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XC7VX690T-2FFG1761I
+Lista de MateriaisIC FPGA 850 I/O 1761FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7VX690T-2FFG1761I
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Pacote BBGA-1760
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Virtex®-7 XT |
| Part Status | Active |
| Number of LABs/CLBs | 54150 |
| Number of Logic Elements/Cells | 693120 |
| Total RAM Bits | 54190080 |
| Number of I/O | 850 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The "2FFG1761I" in the name provides additional details about this specific model's characteristics. "2" indicates the speed grade, which affects the device's maximum operating frequency. "FFG1761" refers to the package type and pin count, with FFG indicating a flip-chip package that supports high-density connections and improved thermal performance. The "I" at the end designates the industrial temperature range, ensuring reliable operation in environments with more extreme temperature variations.
Overall, the XC7VX690T-2FFG1761I offers a robust platform for developers seeking a high-capacity and versatile FPGA solution for demanding applications.
Equivalent
Features
1. Logic Resources: Contains 693,120 logic cells, suitable for complex designs.
2. DSP Slices: Incorporates 3,600 DSP slices for high-speed arithmetic operations, ideal for signal processing tasks.
3. Memory: Offers over 52 Mb of block RAM, supporting memory-intensive applications.
4. I/O: Provides 1,000 user I/O pins, facilitating extensive external interfacing.
5. Transceivers: Equipped with 80 high-speed serial transceivers, capable of up to 13.1 Gbps, supporting high-bandwidth data transfer.
6. Packaging: Comes in a FFG1761 package, with an industrial-grade temperature range.
7. Clock Management: Includes advanced clock management features like MMCMs and PLLs for robust clocking solutions.
8. Configuration: Supports multiple configuration modes, ensuring flexibility in design implementation.
This FPGA is designed for high-performance applications in industries such as telecommunications, aerospace, and defense, offering scalability and efficiency for sophisticated computing tasks.
Pinout
Key functions and features of the XC7VX690T-2FFG1761I include:
1. Logic Resources: It contains approximately 693,120 logic cells, making it suitable for complex digital designs.
2. DSP Slices: The device includes 3,600 DSP slices for efficient signal processing tasks.
3. Memory: It provides significant block RAM resources for data storage and buffering.
4. I/O Capability: The FPGA supports high-speed I/O standards and interfaces, allowing for flexible connectivity.
5. High-Speed Transceivers: It includes GTX transceivers for high-speed serial communication.
6. Power Management: The device integrates power management features to optimize power consumption.
The XC7VX690T-2FFG1761I is typically used in applications such as wireless infrastructure, video processing, and high-performance computing.
Manufacturer
Xilinx was founded in 1984 and became a part of AMD (Advanced Micro Devices, Inc.) in 2022, following an acquisition. As part of AMD, Xilinx continues to focus on innovation in adaptive and intelligent computing, offering solutions that enhance data processing capabilities and performance across a variety of sectors. The company's products are integral to facilitating the development of advanced computing systems by providing flexible and high-performance hardware solutions.