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XC7VX690T-2FFG1930C
+Lista de MateriaisIC FPGA 1000 I/O 1930FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7VX690T-2FFG1930C
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Pacote FCBGA-1930
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Virtex®-7 XT |
| ProductStatus | Active |
| NumberofLABs/CLBs | 54150 |
| NumberofLogicElements/Cells | 693120 |
| TotalRAMBits | 54190080 |
| NumberofI/O | 1000 |
| Voltage-Supply | 0.97V ~ 1.03V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 1924-BBGA, FCBGA |
Visão Geral
Description
- FPGA Family: Virtex-7 (7th-gen, 28nm process)
- Logic Cells: ~693K, optimized for high-speed processing
- DSP Slices: 3,600, ideal for signal processing
- Memory: ~52Mb BRAM, ~68Mb UltraRAM
- I/O: 1,200+ pins, supports high-speed protocols (PCIe Gen3, 10G Ethernet, etc.)
- Package: 1930-pin Flip-Chip BGA (FFG1930)
- Speed Grade: -2 (moderate performance)
Applications: Aerospace, defense, networking, and high-performance computing.
Key Strengths: High bandwidth, low latency, and scalability for complex designs.
Equivalent
- Xilinx Kintex-7 (e.g., XC7K420T) – Lower cost, reduced performance.
- Xilinx Virtex-7 (e.g., XC7VX485T) – Smaller capacity, same family.
- Intel Stratix V (e.g., 5SGXEA7K2F40C2) – Comparable performance, different vendor.
- Xilinx Ultrascale (e.g., XCVU190) – Newer architecture, higher performance.
Choose based on requirements for speed, power, and compatibility.
Features
- Logic Cells: 693,120
- DSP Slices: 3,600
- Block RAM: 52,920 Kb
- GTX/GTH Transceivers: 24 (up to 12.5 Gbps)
- PCIe Gen3 Support: Up to x8
- Package: 1930-pin Flip-Chip BGA (FFG1930)
- Speed Grade: -2 (moderate performance)
- Power Efficiency: 28nm HKMG process
- I/O Banks: Supports multiple standards (LVDS, HSTL, etc.)
Ideal for high-speed networking, signal processing, and compute-intensive applications.
Pinout
- Pin count: 1,930 pins (FFG1930 package).
- Key functions:
- High-speed serial transceivers (up to 28.05 Gbps).
- DSP slices, Block RAM (36.5 Mb), and logic cells (693,120).
- Supports PCIe Gen3, 10G Ethernet, and memory interfaces (DDR3).
- 2.5D IC integration via stacked silicon interconnect (SSI) technology.
- Package: Flip-chip BGA (FFG1930) with 1.0mm ball pitch.
Designed for high-performance computing, networking, and signal processing.