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XCKU035-1FFVA1156C
+Lista de MateriaisIC FPGA 520 I/O 1156FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCKU035-1FFVA1156C
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Pacote FCBGA-1156
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 25391 |
| Number of Logic Elements/Cells | 444343 |
| Total RAM Bits | 19456000 |
| Number of I/O | 520 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
The "XCKU035" indicates a specific Kintex UltraScale model, while "1FFVA1156C" details the package type and specific configuration. The "1FF" denotes the speed grade, "VA" refers to the package type (BGA), and "1156" indicates the number of pins. The "C" typically signifies the commercial temperature range.
Key features of the XCKU035 include high DSP slice density, advanced memory hierarchy, and high-speed connectivity options like PCIe and 100G Ethernet. These features, combined with the UltraScale architecture, support efficient parallel processing, making the FPGA suitable for compute-intensive tasks. It is ideal for scenarios where high data throughput and low latency are critical.
Equivalent
Features
1. Performance and Logic Resources: It provides a balance of performance and cost, with up to 355,000 logic cells and 840 DSP slices, making it suitable for complex processing tasks.
2. Memory: The FPGA includes block RAM and UltraRAM for flexible and efficient data storage requirements.
3. Transceivers: It features high-speed transceivers, capable of rates up to 16.3 Gbps, supporting high-bandwidth communication standards.
4. Power Efficiency: Built on a 20nm process technology, it's designed for low power consumption while maintaining high performance.
5. I/O and Packaging: The component supports a wide range of I/O standards and is offered in an FFVA1156 package, ensuring versatile connectivity options.
6. Development Support: Compatible with Xilinx's Vivado Design Suite, offering comprehensive tools for design and implementation.
These features make the XCKU035-1FFVA1156C suitable for a variety of applications, including data centers, wireless infrastructure, and video processing.
Pinout
Manufacturer
Application
1. Data Centers: For accelerating data processing and networking tasks.
2. Wireless Communication: Used in 4G/5G infrastructure for digital signal processing.
3. Broadcast and Pro A/V: In video processing and high-definition broadcasting systems.
4. Automotive: Supports advanced driver-assistance systems (ADAS) and infotainment.
5. Aerospace and Defense: Applied in radar systems and secure communications.
6. Medical Imaging: For real-time image and signal processing.
7. Industrial Automation: Enhances control systems and robotics with high-speed data processing capabilities.
These application areas benefit from the FPGA's high efficiency, low latency, and configurability.