XCKU035-3FBVA676E

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XCKU035-3FBVA676E

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IC FPGA 312 I/O 676FCBGA

  • FabricanteAMD

  • Peça do Fabricante #XCKU035-3FBVA676E

  • Em Estoque7582

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Especificações

Atributo Valor
Series Kintex® UltraScale™
Part Status Active
Digi Key Programmable Not Verified
Number of Logic Elements / Cells 444343
Total RAM Bits 19456000
Number of I/O 312
Voltage - Supply 0.970V ~ 1.030V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XCKU035
Number of LA Bs / CL Bs 25391

Visão Geral

Description

The XCKU035-3FBVA676E is a member of Xilinx's Kintex UltraScale FPGA family, designed for high-performance and cost-effective applications. It features 35,000 logic cells, offering significant resources for complex designs. The "3" in its designation indicates the speed grade, while "FBVA" refers to the package type, which is a 676-ball FBGABGA, suitable for demanding thermal and performance requirements.
This FPGA supports multiple high-speed I/O standards, making it versatile for various applications such as telecommunications, automotive, and industrial automation. It also includes advanced features like integrated DSP slices for high-speed signal processing and large memory blocks for efficient data handling.
The Kintex UltraScale series is known for its balance of performance and power efficiency, making it ideal for applications requiring high throughput and low latency. Additionally, the XCKU035 offers flexibility in design through programmable logic and customizable architectures, empowering engineers to create tailored solutions for their specific needs.

Equivalent

The Xilinx XCKU035-3FBVA676E is part of the Kintex UltraScale FPGA family. Equivalent products include the Intel/Altera Stratix 10 GX FPGA, and other Kintex UltraScale variants such as XCKU040 or XCKU050, depending on specific requirements like I/O count, performance, and resource utilization. Always verify compatibility based on application needs and specifications.

Features

The XCKU035-3FBVA676E is a high-performance field-programmable gate array (FPGA) from Xilinx's Kintex UltraScale series. Key features include:
1. Logic Resources: Approximately 35,000 logic cells, providing extensive configurability and performance for complex applications.
2. DSP Slices: Contains around 210 DSP slices for efficient digital signal processing.
3. Memory: Offers up to 2.1 Mbits of distributed RAM and supports various memory interfaces.
4. Transceivers: Equipped with high-speed serial transceivers supporting data rates up to 12.5 Gb/s, enabling high-bandwidth communication.
5. I/O Pins: 676 I/O pins, allowing for flexible connectivity options with various standard protocols.
6. Power Efficiency: Delivers high performance while maintaining low power consumption, ideal for power-sensitive applications.
7. Advanced Features: Supports partial reconfiguration, enabling dynamic updates to the design without downtime.
8. Development Support: Compatible with Xilinx design tools like Vivado for simplified design and verification processes.
These features make the XCKU035-3FBVA676E suitable for applications in telecommunications, automotive, and industrial automation.

Pinout

The XCKU035-3FBVA676E is a member of the Xilinx Kintex UltraScale FPGA family. It features a total of 676 pins. The device supports various functionalities, including digital signal processing, high-speed data processing, and high-performance computing applications. The pin configuration includes power pins, ground pins, user I/O pins, dedicated configuration pins, and clock management pins.
The I/O pins are configurable and support various standards (e.g., LVDS, LVCMOS), making the FPGA versatile for different applications. Additionally, the device includes specialized pins for configuration and control, such as JTAG and boot mode options. The availability of dedicated clock management resources enables efficient performance tuning and power management. Overall, the XCKU035 is designed for applications requiring high bandwidth and parallel processing capabilities.

Manufacturer

The manufacturer of the XCKU035-3FBVA676E is Xilinx, Inc., which is now a part of AMD (Advanced Micro Devices, Inc.) following their acquisition in 2022. Xilinx is renowned for its contributions to the semiconductor industry, particularly in the field of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and adaptive compute acceleration platforms.
Founded in 1984, Xilinx pioneered the development of FPGAs, enabling users to reconfigure hardware for specific applications after manufacturing. This flexibility makes their products highly sought after in various sectors, including telecommunications, automotive, aerospace, defense, and data centers, among others. The XCKU035-3FBVA676E is part of the Kintex UltraScale family of FPGAs, designed for high-performance applications that require efficient processing and adaptability.
In summary, Xilinx, now under AMD, is a leading manufacturer of advanced programmable logic solutions, catering to a diverse range of industries with cutting-edge technology.

Application

The XCKU035-3FBVA676E is a high-performance FPGA from Xilinx's Kintex UltraScale family, suitable for various applications, including:
1. Data Processing: High-speed data acquisition and processing for telecommunications and networking.
2. Video and Image Processing: Real-time video analytics and image processing in broadcast and surveillance systems.
3. Machine Learning: Acceleration of machine learning algorithms in edge and cloud computing.
4. Aerospace and Defense: Reliable and robust solutions for radar and signal processing.
5. Industrial Automation: Control systems and automation in manufacturing environments.
Its flexibility and processing power make it ideal for these and other demanding applications.

Package

The XCKU035-3FBVA676E is packaged in a FBG676 (FBGA) form factor, which features a 676-ball grid array configuration. This package type is designed for high-performance applications, providing effective thermal and electrical performance.

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