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XCKU035-3FBVA676E
+Lista de MateriaisIC FPGA 312 I/O 676FCBGA
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FabricanteAMD
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Peça do Fabricante #XCKU035-3FBVA676E
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Especificações
| Atributo | Valor |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 444343 |
| Total RAM Bits | 19456000 |
| Number of I/O | 312 |
| Voltage - Supply | 0.970V ~ 1.030V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XCKU035 |
| Number of LA Bs / CL Bs | 25391 |
Visão Geral
Description
This FPGA supports multiple high-speed I/O standards, making it versatile for various applications such as telecommunications, automotive, and industrial automation. It also includes advanced features like integrated DSP slices for high-speed signal processing and large memory blocks for efficient data handling.
The Kintex UltraScale series is known for its balance of performance and power efficiency, making it ideal for applications requiring high throughput and low latency. Additionally, the XCKU035 offers flexibility in design through programmable logic and customizable architectures, empowering engineers to create tailored solutions for their specific needs.
Equivalent
Features
1. Logic Resources: Approximately 35,000 logic cells, providing extensive configurability and performance for complex applications.
2. DSP Slices: Contains around 210 DSP slices for efficient digital signal processing.
3. Memory: Offers up to 2.1 Mbits of distributed RAM and supports various memory interfaces.
4. Transceivers: Equipped with high-speed serial transceivers supporting data rates up to 12.5 Gb/s, enabling high-bandwidth communication.
5. I/O Pins: 676 I/O pins, allowing for flexible connectivity options with various standard protocols.
6. Power Efficiency: Delivers high performance while maintaining low power consumption, ideal for power-sensitive applications.
7. Advanced Features: Supports partial reconfiguration, enabling dynamic updates to the design without downtime.
8. Development Support: Compatible with Xilinx design tools like Vivado for simplified design and verification processes.
These features make the XCKU035-3FBVA676E suitable for applications in telecommunications, automotive, and industrial automation.
Pinout
The I/O pins are configurable and support various standards (e.g., LVDS, LVCMOS), making the FPGA versatile for different applications. Additionally, the device includes specialized pins for configuration and control, such as JTAG and boot mode options. The availability of dedicated clock management resources enables efficient performance tuning and power management. Overall, the XCKU035 is designed for applications requiring high bandwidth and parallel processing capabilities.
Manufacturer
Founded in 1984, Xilinx pioneered the development of FPGAs, enabling users to reconfigure hardware for specific applications after manufacturing. This flexibility makes their products highly sought after in various sectors, including telecommunications, automotive, aerospace, defense, and data centers, among others. The XCKU035-3FBVA676E is part of the Kintex UltraScale family of FPGAs, designed for high-performance applications that require efficient processing and adaptability.
In summary, Xilinx, now under AMD, is a leading manufacturer of advanced programmable logic solutions, catering to a diverse range of industries with cutting-edge technology.
Application
1. Data Processing: High-speed data acquisition and processing for telecommunications and networking.
2. Video and Image Processing: Real-time video analytics and image processing in broadcast and surveillance systems.
3. Machine Learning: Acceleration of machine learning algorithms in edge and cloud computing.
4. Aerospace and Defense: Reliable and robust solutions for radar and signal processing.
5. Industrial Automation: Control systems and automation in manufacturing environments.
Its flexibility and processing power make it ideal for these and other demanding applications.