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XCKU040-1FFVA1156C
+Lista de MateriaisIC FPGA 520 I/O 1156FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCKU040-1FFVA1156C
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Pacote BGA-1156
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 30300 |
| Number of Logic Elements/Cells | 530250 |
| Total RAM Bits | 21606000 |
| Number of I/O | 520 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
- Logic Capacity: ~242K logic cells, 11.3Mb BRAM, and 1,920 DSP slices.
- Speed: Supports high-speed transceivers (up to 12.5Gbps) and PCIe Gen3/4.
- Package: 1,156-pin flip-chip BGA (FFVA) with fine-pitch interconnects.
- I/O: 400+ user I/Os supporting LVDS, HSTL, and other standards.
- Applications: Used in data centers, wireless, aerospace, and high-speed signal processing.
It leverages UltraScale architecture for improved routing efficiency and lower power consumption compared to previous generations. The device is programmable via Vivado Design Suite, supporting advanced debugging and IP integration.
Ideal for compute-intensive tasks, the XCKU040 balances performance, power, and cost for mid-range FPGA applications.
Equivalent
- Xilinx Kintex UltraScale+ KU040 (newer generation, improved performance/power).
- Intel (Altera) Stratix 10 GX 040 (competitive FPGA with similar logic capacity).
- Microchip PolarFire MPF300T (lower power, mid-range FPGA).
Check pin compatibility and features for direct replacement. For exact equivalents, consult vendor cross-reference tools or distributors like Xilinx (AMD), Intel, or Microchip.
Features
- Logic Cells: 242,200
- DSP Slices: 1,920
- Block RAM: 13.5 Mb
- Transceivers: 12x GTH (up to 16.3 Gbps)
- I/O Pins: 400+ (supports HP & HR banks)
- Process Technology: 20nm
- Power: Optimized for high performance-per-watt
- Package: 1156-pin FCBGA (1.0mm pitch)
- Configuration: Supports PCIe, JTAG, and multi-boot
- PCIe: Integrated Gen1/2/3 support
Ideal for high-speed networking, DSP, and embedded systems.
Pinout
- Pin count: 1,156 (FFVA package, 35x35mm, 0.8mm pitch).
- Key functions:
- High-speed I/O: Supports up to 16.3 Gbps transceivers (16 GTY lanes).
- Logic capacity: ~242K logic cells, 19.2Mb BRAM, 1,920 DSP slices.
- Memory: DDR4/LPDDR4 support.
- Configuration: JTAG, SPI, BPIs.
- Power: 0.95V core voltage (1.8V–3.3V I/O banks).
Designed for high-performance computing, networking, and signal processing.
Manufacturer
Xilinx is a pioneer in FPGA technology, providing flexible, high-speed computing solutions for hardware acceleration and custom logic design.
Application
1. High-speed communications (5G, optical networks, data centers).
2. Aerospace & defense (radar, avionics, secure systems).
3. Industrial automation (real-time control, machine vision).
4. Medical imaging (ultrasound, MRI processing).
5. AI/ML acceleration (edge inference, data preprocessing).
6. Broadcast & professional AV (4K/8K video processing).
Its high bandwidth (16G transceivers), DSP slices, and low latency make it ideal for demanding applications.