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XCKU060-2FFVA1156E
+Lista de MateriaisIC FPGA 520 I/O 1156FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCKU060-2FFVA1156E
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Pacote FCBGA/1
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Em Estoque5621
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 41460 |
| Number of Logic Elements/Cells | 725550 |
| Total RAM Bits | 38912000 |
| Number of I/O | 520 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Visão Geral
Description
Built on 16nm FinFET+ technology, it offers high power efficiency and performance. The -2FFVA1156E suffix indicates:
- -2: Speed grade (moderate performance).
- FFVA1156: 1,156-pin flip-chip BGA package.
- E: Extended temperature range (-40°C to +100°C).
Key features include PCIe Gen3/4 support, multi-gigabit transceivers (up to 16.3 Gbps), and DDR4 memory interfaces. It’s ideal for compute-intensive tasks in aerospace, defense, and data centers.
For development, Xilinx provides Vivado Design Suite for synthesis and implementation.
Equivalent
- Xilinx/AMD Kintex UltraScale+ KU060: Higher performance, lower power.
- Intel Stratix 10 GX 060: Comparable FPGA from Intel.
- Microchip PolarFire MPF300T: Lower power, mid-range alternative.
For exact replacements, check AMD's product tables or cross-reference tools like Octopart or Ultra Librarian.
Features
- Logic Cells: 663,360
- DSP Slices: 2,760
- Block RAM: 38.25 Mb (4,860 Kb)
- Transceivers: 32 (up to 12.5 Gbps each)
- I/O Pins: 400+ (supports LVDS, HSTL, SSTL)
- Process Technology: 20nm
- Power: Optimized for high performance-per-watt
- Package: 1156-ball FCBGA (Flip-Chip BGA)
- Configuration: Supports PCIe Gen3/4, 100G Ethernet, and high-speed memory interfaces (DDR4).
Ideal for high-performance computing, networking, and signal processing.
Pinout
- Pin Count: 1,156 pins (FFVA package).
- Key Functions:
- High-speed serial transceivers (up to 16.3 Gbps).
- Logic cells (~663,360).
- DSP slices (~2,760).
- Block RAM (~38.3 Mb).
- PCIe Gen3/4 support.
- High-performance I/O (HP & HR banks).
- Supports DDR4 memory interfaces.
This FPGA is optimized for high-bandwidth applications like data center acceleration, networking, and signal processing.
Application
- High-performance computing: Accelerating algorithms in data centers and AI.
- Aerospace & defense: Radar, avionics, and secure communications.
- Telecommunications: 5G infrastructure and high-speed networking.
- Industrial automation: Real-time control and machine vision.
- Medical imaging: High-speed data processing in diagnostic equipment.
- Scientific research: Custom hardware for experiments and simulations.
Its high-speed transceivers, DSP slices, and large logic capacity make it ideal for demanding applications.