XCKU060-2FFVA1156E

Imagens apenas para referência

XCKU060-2FFVA1156E

+Lista de Materiais

IC FPGA 520 I/O 1156FCBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XCKU060-2FFVA1156E

  • Pacote FCBGA/1

  • Em Estoque5621

365 Garantia de Qualidade em 1 dia

7*24 Garantia de serviço em 24 horas

90-Garantia de pós-venda em 1 dia

Garantia de Produto Genuíno

Especificações

Atributo Valor
Package / Case Tray
Series Kintex® UltraScale™
Part Status Active
Number of LABs/CLBs 41460
Number of Logic Elements/Cells 725550
Total RAM Bits 38912000
Number of I/O 520
Voltage - Supply 0.922V ~ 0.979V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)

Visão Geral

Description

The XCKU060-2FFVA1156E is a member of Xilinx's (now AMD) Kintex UltraScale FPGA family. It features 60,720 logic cells, 4,860 DSP slices, and 32.1 Mb of block RAM, making it suitable for high-performance applications like signal processing, networking, and embedded systems.
Built on 16nm FinFET+ technology, it offers high power efficiency and performance. The -2FFVA1156E suffix indicates:
- -2: Speed grade (moderate performance).
- FFVA1156: 1,156-pin flip-chip BGA package.
- E: Extended temperature range (-40°C to +100°C).
Key features include PCIe Gen3/4 support, multi-gigabit transceivers (up to 16.3 Gbps), and DDR4 memory interfaces. It’s ideal for compute-intensive tasks in aerospace, defense, and data centers.
For development, Xilinx provides Vivado Design Suite for synthesis and implementation.

Equivalent

The XCKU060-2FFVA1156E is a Kintex UltraScale FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Xilinx/AMD Kintex UltraScale+ KU060: Higher performance, lower power.
- Intel Stratix 10 GX 060: Comparable FPGA from Intel.
- Microchip PolarFire MPF300T: Lower power, mid-range alternative.
For exact replacements, check AMD's product tables or cross-reference tools like Octopart or Ultra Librarian.

Features

The Xilinx XCKU060-2FFVA1156E is a Kintex UltraScale FPGA with key features:
- Logic Cells: 663,360
- DSP Slices: 2,760
- Block RAM: 38.25 Mb (4,860 Kb)
- Transceivers: 32 (up to 12.5 Gbps each)
- I/O Pins: 400+ (supports LVDS, HSTL, SSTL)
- Process Technology: 20nm
- Power: Optimized for high performance-per-watt
- Package: 1156-ball FCBGA (Flip-Chip BGA)
- Configuration: Supports PCIe Gen3/4, 100G Ethernet, and high-speed memory interfaces (DDR4).
Ideal for high-performance computing, networking, and signal processing.

Pinout

The XCKU060-2FFVA1156E is a Kintex UltraScale FPGA with the following specifications:
- Pin Count: 1,156 pins (FFVA package).
- Key Functions:
- High-speed serial transceivers (up to 16.3 Gbps).
- Logic cells (~663,360).
- DSP slices (~2,760).
- Block RAM (~38.3 Mb).
- PCIe Gen3/4 support.
- High-performance I/O (HP & HR banks).
- Supports DDR4 memory interfaces.
This FPGA is optimized for high-bandwidth applications like data center acceleration, networking, and signal processing.

Application

The XCKU060-2FFVA1156E, a Kintex UltraScale FPGA, is widely used in:
- High-performance computing: Accelerating algorithms in data centers and AI.
- Aerospace & defense: Radar, avionics, and secure communications.
- Telecommunications: 5G infrastructure and high-speed networking.
- Industrial automation: Real-time control and machine vision.
- Medical imaging: High-speed data processing in diagnostic equipment.
- Scientific research: Custom hardware for experiments and simulations.
Its high-speed transceivers, DSP slices, and large logic capacity make it ideal for demanding applications.

Package

The XCKU060-2FFVA1156E is a Xilinx UltraScale+ FPGA in a Flip-Chip FineLine BGA (FFVA) package. It has 1156 pins, a 1.0 mm ball pitch, and is 35 mm x 35 mm in size. The package supports high-speed transceivers and is designed for high-performance applications. The "E" suffix indicates an extended temperature range (-40°C to +125°C).

Produtos relacionados a XCKU060-2FFVA1156E