XCKU095-2FFVC1517I

XCKU095-2FFVC1517I is a Xilinx Kintex UltraScale FPGA (industrial-temperature variant) in a FFVC1517I flip‑chip ball-grid array package, with speed grade -2. It belongs to the Kintex UltraScale family built on a 28nm process, designed for high performance with a balance of logic density, DSP, and memory resources, plus multi‑gigabit transceivers and flexible I/O banks. The device integrates大量 logic elements (LUTs/FFs), DSP slices, and block RAM to support data-path, signal processing, and networking tasks, while offering hardened/programmable IP options and standard design flows (HDL and IP cores). Typical use cases include high-throughput data processing, communications, embedded compute, and hardware acceleration. The -I suffix indicates industrial temperature range (extended operating temperature).

Do you mean cross‑vendor equivalents (e.g., Intel/Altera, Lattice) with similar capacity, or other Xilinx Kintex UltraScale parts in the same FFVC1517I package? Please also specify required resources (logic cells, DSPs, transceivers/MGTs, memory), I/O count, and speed grade.

Here are the key features of XCKU095-2FFVC1517I (Kintex UltraScale FPGA in FFVC1517I package):
- Kintex UltraScale FPGA family for high-density, high-performance designs
- Large programmable logic fabric: millions of logic cells with LUTs/flip-flops
- Robust DSP resources for signal processing (DSP slices)
- On-chip memory: Block RAM and UltraRAM blocks
- High-speed serial transceivers: GTx up to about 12.5 Gbps (multi-channel SERDES)
- Flexible I/O banks: multiple voltage standards and wide I/O compatibility
- Rich clocking resources: multiple clock-management tiles, MMCMs, PLLs
- Extensive IP support: PCIe, Ethernet, memory controllers, and other hard/soft IP
- Partial reconfiguration capability
- Industrial temperature range (-40 °C to +105 °C)
- Package: FFVC1517I (1517-ball flip-chip BGA) with good density and thermal performance
Note: exact counts (logic cells, BRAM/UltraRAM, number of transceivers) vary by device variant within the XCKU095 family. Consult the datasheet for precise specifications.

- Pin count: 1517 pins in the FFVC1517 package (industrial temperature).
- Function: XCKU095 is a Kintex UltraScale+ FPGA device with programmable logic, DSP blocks, block RAM, and high-speed multi-gigabit transceivers for high-performance digital designs.

Manufacturer: Xilinx (now part of AMD).
What kind of company: An American multinational semiconductor company that designs and manufactures programmable logic devices, including FPGAs (such as Kintex UltraScale), SoCs, and related software.

XCKU095-2FFVC1517I (Kintex UltraScale+) applications include:
- Networking/telecom: 100G/400G gateways, switches, packet processing, DSP acceleration
- Wireless infrastructure: 5G fronthaul/backhaul, RF/IF signal processing
- Data center: programmable NICs, acceleration, storage controllers
- Defense/aerospace: radar, SIGINT/EW, secure communications, SATCOM
- Industrial/vision: machine vision, real-time control, high‑end video processing (HD/4K)
- Prototyping/engineering: test & measurement, research platforms
These leverage its high logic density, flexible I/O, and high-speed transceivers.

Packaging: Flip-Chip Ball Grid Array (FFVC) with 1517 balls (1517-ball FC-BGA); industrial temperature range (-I); speed grade -2.