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XCKU115-2FLVA1517I
+Lista de MateriaisIC FPGA 624 I/O 1517FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCKU115-2FLVA1517I
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Pacote FBGA-1517
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Em Estoque4925
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 82920 |
| Number of Logic Elements/Cells | 1451100 |
| Total RAM Bits | 77721600 |
| Number of I/O | 624 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features of the XCKU115-2FLVA1517I include:
1. Architecture: Built on the UltraScale architecture, which provides enhanced performance and scalability.
2. Performance: Offers high throughput with a balanced combination of logic, DSP, and memory resources.
3. Package: Comes in a FCBGA-1517 package, ensuring robust connectivity and integration.
4. Logic Cells: Contains around 1.15 million logic cells, providing ample capability for complex designs.
5. DSP Slices: Includes numerous DSP slices for intensive signal processing tasks.
6. Power Efficiency: Designed for optimized power consumption, balancing performance with energy efficiency.
This FPGA is ideal for applications requiring scalable performance and high-speed data processing, with the flexibility of reprogramming to adapt to evolving needs.
Equivalent
1. Intel's Stratix 10 series, such as the Stratix 10 GX.
2. Lattice Semiconductor's ECP5-5G.
3. Microchip's PolarFire series.
When choosing an equivalent, consider factors like logic cells, DSP slices, I/O standards, and power consumption to match your specific application needs.
Features
1. Architecture: Built on the 20nm process technology, offering a balance of performance, capacity, and cost.
2. Logic Cells: Contains approximately 1,176K logic cells, suitable for complex designs.
3. Memory: Features high-capacity block RAM, integrated DSP slices, and UltraRAM for effective data handling.
4. Connectivity: Provides high-speed serial transceivers, enabling data rates up to 28.1 Gbps for efficient data communication.
5. I/O Ports: Offers a wide range of I/O standards and capabilities, allowing flexible interfacing with various systems.
6. Power Efficiency: Designed for reduced power consumption without compromising performance.
7. Temperature Range: The "-I" designation indicates it operates in the industrial temperature range, suitable for harsh environments.
8. Package: Comes in a 1517-ball FPGA package (FLVA1517), ensuring compactness for space-saving designs.
These features make it ideal for applications in data centers, telecommunications, and high-end consumer electronics.
Pinout
The primary function of the XCKU115-2FLVA1517I is to serve as a reprogrammable hardware platform, enabling custom logic implementation for a variety of applications, including data center, wireless communication, and other data-intensive tasks. This FPGA includes a range of configurable logic blocks (CLBs), DSP slices for signal processing, and high-speed transceivers to facilitate complex computation and data throughput.
The device also features integrated memory resources and supports advanced I/O configurations, making it suitable for interfacing with other system components. Its industrial-grade specification ensures reliable operation under extended temperature ranges, making it ideal for demanding environments.
For detailed pin assignment and electrical characteristics, consulting the official Xilinx documentation is recommended.
Manufacturer
Xilinx's products are distinguished by their flexibility, allowing customers to configure and reconfigure the hardware to suit specific application needs. This adaptability is particularly valuable in industries that require rapid prototyping and deployment of complex digital systems. The company's FPGAs, such as the XCKU115-2FLVA1517I, are used extensively in sectors that demand high-performance computing and efficient data processing.
In 2020, Xilinx was acquired by AMD (Advanced Micro Devices, Inc.), a major player in the semiconductor industry known for its microprocessors, graphics processing units (GPUs), and other computing technologies. The acquisition aimed to bolster AMD's product portfolio and capabilities in adaptive computing, augmenting its position in the high-performance computing market.
Application
1. Data Center Acceleration: Enhancing processing speeds for cloud computing and storage solutions.
2. Wireless Infrastructure: Supporting 5G networks with improved bandwidth and reduced latency.
3. Broadcast and Pro AV: Facilitating high-resolution video processing and encoding.
4. Test and Measurement: Providing precision and flexibility for complex instrumentation systems.
5. Aerospace and Defense: Offering reliability and performance for mission-critical applications.
6. High-Performance Computing (HPC): Accelerating computational tasks and simulations.
These areas leverage its high logic density, advanced DSP capabilities, and energy efficiency.