Imagens apenas para referência
XCKU115-2FLVF1924I
+Lista de MateriaisIC FPGA 728 I/O 1924FCBGA
-
FabricanteAMD Xilinx
-
Peça do Fabricante #XCKU115-2FLVF1924I
-
Pacote FBGA-1924
-
Em Estoque3901
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 82920 |
| Number of Logic Elements/Cells | 1451100 |
| Total RAM Bits | 77721600 |
| Number of I/O | 728 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
It is housed in a FCBGA-1924 package, which provides a robust connectivity solution and enhances thermal management. The "2" in its designation indicates its speed grade, while the "I" signifies its industrial-grade temperature range, making it ideal for demanding environmental conditions. The device supports a range of I/O standards and includes advanced features like DSP slices, block RAM, and serial transceivers, which are essential for applications in telecommunications, aerospace, and data centers.
The XCKU115-2FLVF1924I is also supported by Xilinx's Vivado Design Suite, enabling efficient development, simulation, and deployment of digital designs. Its combination of versatility, performance, and energy efficiency makes it a preferred choice for high-performance embedded systems.
Equivalent
1. Intel Stratix 10 FPGAs: Comparable in terms of performance and logic capability.
2. Lattice ECP5 or Lattice Nexus series: Depending on specific requirements like power consumption and cost.
3. Microsemi (now part of Microchip) PolarFire FPGAs: Offers similar performance and features for mid-range applications.
Always verify specific technical requirements and compatibility when selecting equivalent FPGA products.
Features
1. High Logic Density: Over 1.1 million logic cells, suitable for complex designs.
2. DSP Slices: 5,520 DSP slices for efficient signal processing tasks.
3. Memory Resources: 75.9 Mb of total on-chip memory, including block RAM and UltraRAM, providing significant data storage capacity.
4. I/O Flexibility: Supports a wide range of I/O standards with numerous high-performance I/O pins.
5. Transceiver Capabilities: Up to 32.75 Gbps transceivers for high-speed data transfer.
6. Clock Management: Multiple clock management tiles for precise control and distribution of clock signals.
7. Power Efficiency: Designed with low power consumption in mind, making it suitable for energy-sensitive applications.
8. Temperature Range: Industrial-grade with an operating temperature range of -40°C to +100°C, suitable for harsh environments.
9. Packaging: Available in a 1924-ball Flip-Chip FineLine BGA package.
These features make it ideal for applications in areas like communications, aerospace, and data center acceleration.
Pinout
Key functions and features include:
1. Logic Cells: It contains a large number of logic cells for implementing complex digital circuits.
2. DSP Slices: Offers a significant number of DSP slices for high-speed signal processing.
3. Block RAM: Provides substantial block RAM for data storage and processing.
4. High-speed Transceivers: Equipped with high-speed transceivers for efficient data transfer.
5. I/O Pins: A large number of I/O pins enable extensive interfacing capabilities.
6. Scalability and Configurability: Highly scalable to meet diverse application requirements.
The XCKU115 is suitable for applications such as data centers, wireless infrastructure, and video processing, providing high throughput and low power consumption.
Manufacturer
Application
1. Data Centers: For acceleration of data processing tasks.
2. Wireless Communications: In baseband processing and 5G systems.
3. Broadcast and Video: For video processing and transmission.
4. Aerospace and Defense: In radar and signal intelligence applications.
5. Test and Measurement: For high-speed data acquisition and processing.
6. High-Performance Computing: As a co-processor for computational tasks.
These applications benefit from the FPGA's high logic density, DSP capabilities, and high-speed transceivers.