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IC FPGA 512 I/O 1517FCBGA
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FabricanteAMD
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Peça do Fabricante #XCKU11P-2FFVE1517I
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Em Estoque7555
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Especificações
| Atributo | Valor |
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| Base Product Number | XCKU11 |
| Digi Key Programmable | Not Verified |
| Number of LA Bs / CL Bs | 37320 |
| Number of Logic Elements / Cells | 653100 |
| Total RAM Bits | 53964800 |
| Number of I/O | 512 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Packaging | Tray |
Visão Geral
Description
The FPGA features a high logic density, numerous DSP slices, and ample block RAM, making it suitable for implementing complex algorithms and processing data in real-time. Its architecture supports high-speed connectivity with integrated high-speed serial transceivers and supports protocols like PCIe, Ethernet, and more, facilitating seamless integration into diverse systems.
Packaged in a 1517-pin flip-chip fine-grid array (FFVE1517), the XCKU11P-2FFVE1517I offers robust thermal and power management options. The device also includes security features, such as bitstream encryption and authentication, ensuring data integrity and protection against unauthorized access. Overall, it is ideal for developers seeking a versatile FPGA solution with an optimal mix of performance and programmability.
Equivalent
Features
1. Architecture: Built on a 16nm FinFET process technology, offering high performance and improved power efficiency.
2. Logic Resources: It contains a significant number of logic cells and LUTs (Look-Up Tables), supporting complex designs and parallel processing.
3. DSP Slices: Integrated DSP slices for high-performance digital signal processing tasks.
4. Memory: Features large on-chip memory, including block RAM and UltraRAM, to support data-intensive applications.
5. Transceivers: High-speed serial transceivers for efficient data communication, supporting various protocols.
6. I/O Options: Flexible I/O interfaces for easy integration with other system components.
7. Security: Advanced security features, including encryption and secure boot, to protect designs and data.
8. Applications: Suitable for a wide range of applications such as wireless communication, data center acceleration, and video processing.
9. Packaging: Comes in a 1517-pin FCBGA package, offering a balance between performance and size.
These features make it ideal for applications requiring high throughput and low latency.
Pinout
1. Power and Ground Pins: These pins supply power to the FPGA and provide paths to ground. They are essential for the FPGA's operation.
2. I/O Pins: These are used for a wide range of input and output operations, interfacing with other components in a design. They support various standards and protocols for flexibility.
3. Configuration Pins: These pins are used to configure the FPGA during startup, determining how the FPGA's resources are utilized.
4. Clock Pins: Critical for synchronizing operations within the FPGA, these pins handle clock signals.
5. Dedicated Pins: Include specific functions such as JTAG for debugging and configuration.
The exact function of each pin can be found in the Xilinx datasheet or user guide for the device, which provides in-depth details on pin allocation and electrical characteristics.
Manufacturer
Application
1. Data Center Acceleration: Enhancing performance for data-intensive tasks like AI and machine learning.
2. Telecommunications: Supporting high-speed networking and 5G infrastructure.
3. Broadcast and Pro AV: Enabling real-time video processing and encoding.
4. Aerospace and Defense: Providing high-reliability solutions for image processing and secure communications.
5. Industrial Automation: Facilitating real-time control systems and smart manufacturing processes.
These areas exploit the FPGA's capabilities for high throughput, low latency, and reconfigurability.