XCKU11P-2FFVE1517I

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XCKU11P-2FFVE1517I

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IC FPGA 512 I/O 1517FCBGA

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Especificações

Atributo Valor
Series Kintex® UltraScale+™
Part Status Active
Base Product Number XCKU11
Digi Key Programmable Not Verified
Number of LA Bs / CL Bs 37320
Number of Logic Elements / Cells 653100
Total RAM Bits 53964800
Number of I/O 512
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Packaging Tray

Visão Geral

Description

The XCKU11P-2FFVE1517I is a model within the Xilinx Kintex UltraScale+ FPGA family, designed to provide a balance of performance, power efficiency, and cost-effectiveness. This specific FPGA is built using advanced FinFET technology and is tailored for applications requiring high throughput and efficient data processing, such as data centers, wireless communication, and high-performance computing.
The FPGA features a high logic density, numerous DSP slices, and ample block RAM, making it suitable for implementing complex algorithms and processing data in real-time. Its architecture supports high-speed connectivity with integrated high-speed serial transceivers and supports protocols like PCIe, Ethernet, and more, facilitating seamless integration into diverse systems.
Packaged in a 1517-pin flip-chip fine-grid array (FFVE1517), the XCKU11P-2FFVE1517I offers robust thermal and power management options. The device also includes security features, such as bitstream encryption and authentication, ensuring data integrity and protection against unauthorized access. Overall, it is ideal for developers seeking a versatile FPGA solution with an optimal mix of performance and programmability.

Equivalent

The XCKU11P-2FFVE1517I is a Xilinx Kintex UltraScale+ FPGA. Equivalent products could be other FPGA models with similar specifications from different manufacturers, such as the Intel (Altera) Stratix 10 series or Microchip's PolarFire FPGAs. However, exact equivalents may vary based on specific application needs like processing power, I/O capability, and power consumption. It’s important to compare detailed specifications for precise equivalence.

Features

The XCKU11P-2FFVE1517I is a model from the Xilinx Kintex UltraScale+ FPGA family. Key features include:
1. Architecture: Built on a 16nm FinFET process technology, offering high performance and improved power efficiency.
2. Logic Resources: It contains a significant number of logic cells and LUTs (Look-Up Tables), supporting complex designs and parallel processing.
3. DSP Slices: Integrated DSP slices for high-performance digital signal processing tasks.
4. Memory: Features large on-chip memory, including block RAM and UltraRAM, to support data-intensive applications.
5. Transceivers: High-speed serial transceivers for efficient data communication, supporting various protocols.
6. I/O Options: Flexible I/O interfaces for easy integration with other system components.
7. Security: Advanced security features, including encryption and secure boot, to protect designs and data.
8. Applications: Suitable for a wide range of applications such as wireless communication, data center acceleration, and video processing.
9. Packaging: Comes in a 1517-pin FCBGA package, offering a balance between performance and size.
These features make it ideal for applications requiring high throughput and low latency.

Pinout

The XCKU11P-2FFVE1517I is a member of the Xilinx Kintex UltraScale+ FPGA family. It comes in an FFVE1517 package, which indicates that it has 1517 pins. These pins serve a variety of functions necessary for the FPGA's operation. The functions typically include:
1. Power and Ground Pins: These pins supply power to the FPGA and provide paths to ground. They are essential for the FPGA's operation.
2. I/O Pins: These are used for a wide range of input and output operations, interfacing with other components in a design. They support various standards and protocols for flexibility.
3. Configuration Pins: These pins are used to configure the FPGA during startup, determining how the FPGA's resources are utilized.
4. Clock Pins: Critical for synchronizing operations within the FPGA, these pins handle clock signals.
5. Dedicated Pins: Include specific functions such as JTAG for debugging and configuration.
The exact function of each pin can be found in the Xilinx datasheet or user guide for the device, which provides in-depth details on pin allocation and electrical characteristics.

Manufacturer

The XCKU11P-2FFVE1517I is manufactured by Xilinx, Inc. Xilinx is a company that specializes in the design and production of programmable logic devices. It is well-known for its field-programmable gate arrays (FPGAs), adaptive SoCs, and related software tools. FPGAs are integrated circuits that can be configured by the customer or designer after manufacturing, allowing for a high degree of flexibility in hardware design and implementation. Xilinx's products are used across various industries, including communications, automotive, industrial, aerospace, and data centers, among others. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a leading global semiconductor company known for its CPUs and GPUs, further expanding AMD's product portfolio into the FPGA and adaptive computing markets.

Application

The XCKU11P-2FFVE1517I is a high-performance FPGA from Xilinx's Kintex UltraScale+ series. Its application areas include:
1. Data Center Acceleration: Enhancing performance for data-intensive tasks like AI and machine learning.
2. Telecommunications: Supporting high-speed networking and 5G infrastructure.
3. Broadcast and Pro AV: Enabling real-time video processing and encoding.
4. Aerospace and Defense: Providing high-reliability solutions for image processing and secure communications.
5. Industrial Automation: Facilitating real-time control systems and smart manufacturing processes.
These areas exploit the FPGA's capabilities for high throughput, low latency, and reconfigurability.

Package

The XCKU11P-2FFVE1517I is a FPGA (Field-Programmable Gate Array) from Xilinx's Kintex UltraScale+ family. The package type is FFVE1517, which refers to a specific Flip-Chip Ball Grid Array (FCBGA) with 1517 balls used for electrical connections.