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XCKU5P-2FFVB676I
+Lista de MateriaisIC FPGA 280 I/O 676FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCKU5P-2FFVB676I
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Pacote FBGA-676
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 27120 |
| NumberofLogicElements/Cells | 474600 |
| TotalRAMBits | 41984000 |
| NumberofI/O | 280 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
Visão Geral
Description
Key features of the XCKU5P-2FFVB676I include:
1. Enhanced Performance: Built using TSMC's 16nm FinFET process, offering improved speed and power efficiency.
2. Versatile Applications: Supports up to millions of logic cells, which are essential for customizing and optimizing digital circuits.
3. High Bandwidth: Equipped with multiple transceiver channels supporting high data rates, making it ideal for high-speed communication.
4. Programmability: Offers extensive flexibility, allowing developers to customize functionalities post-manufacturing.
5. Power Efficiency: Designed to balance performance with power consumption, suitable for power-sensitive applications.
These capabilities make the XCKU5P-2FFVB676I a highly versatile component for modern digital applications requiring scalable performance.
Equivalent
Features
1. Architecture: Built on the 16nm FinFET process technology, offering enhanced performance and power efficiency.
2. Logic Cells: It features a substantial number of logic cells, providing significant computational capacity for complex designs.
3. DSP Slices: Includes numerous DSP slices optimized for signal processing tasks, beneficial for applications requiring high-speed data processing.
4. Memory: The device is equipped with a considerable amount of on-chip RAM, supporting efficient data storage and retrieval operations.
5. I/O Connectivity: Offers a variety of I/O options, including high-speed serial transceivers, to facilitate robust connectivity and data transfer.
6. Power Efficiency: Designed for low power consumption, making it suitable for applications where energy efficiency is crucial.
7. Security Features: Incorporates advanced security features to protect designs and data.
8. Application Areas: Ideal for applications in areas such as communications, data centers, and high-performance computing due to its balance of performance, power, and cost.
These features make it suitable for a wide range of demanding applications.
Pinout
The pin functions of the XCKU5P-2FFVB676I typically include a range of I/O configurations such as differential and single-ended I/O, and support for various standards including LVDS, LVCMOS, and others. It also supports high-speed transceivers, clock management resources, and configuration pins. The exact function of each pin can vary based on the specific application and configuration. Detailed pin functions and arrangements can be found in the datasheet or user guide provided by Xilinx for the Kintex UltraScale+ family.
Manufacturer
Xilinx is known for its innovations in the semiconductor industry, particularly for pioneering the FPGA technology. FPGAs are semiconductor devices that can be configured by customers or designers after manufacturing, allowing for tailored solutions that can be updated or changed even after deployment. This flexibility makes them invaluable in rapidly evolving technology fields where adaptability is crucial. Xilinx's products are widely used in applications that require high performance and optimization, such as networking, video processing, and machine learning.