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XCVU095-2FFVA2104E
+Lista de MateriaisIC FPGA 832 I/O 2104FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCVU095-2FFVA2104E
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Pacote FBGA-2104
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Especificações
| Atributo | Valor |
| Package | Bulk |
| Series | Virtex® UltraScale™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 67200 |
| NumberofLogicElements/Cells | 1176000 |
| TotalRAMBits | 62259200 |
| NumberofI/O | 832 |
| Voltage-Supply | 0.922V ~ 0.979V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
Visão Geral
Description
Key features include:
1. Logic Cells: A high count of logic cells for complex computations.
2. Transceivers: High-speed serial transceivers to support fast data communication.
3. Memory: A significant amount of on-chip memory for efficient data handling.
4. DSP Slices: Dedicated DSP slices for intensive mathematical operations.
The FFVA2104 package refers to the specific physical packaging and pin layout, essential for integration into hardware systems. It supports various I/O standards, making it versatile for different applications. Overall, the XCVU095-2FFVA2104E is tailored for industries requiring robust performance and adaptable design capabilities.
Equivalent
Features
1. High Logic Density: Provides a large number of logic cells, suitable for complex computations and large designs.
2. Advanced I/O Capabilities: Supports high-speed transceivers, various I/O standards, and large memory interfaces for flexible connectivity.
3. DSP Slices: Contains numerous DSP slices for efficient implementation of signal processing algorithms.
4. UltraRAM and Block RAM: Offers significant on-chip memory resources, ensuring fast data access and storage.
5. Scalability: Part of the UltraScale architecture that allows for scalability and future-proofing.
6. Power Efficiency: Designed for optimized power consumption without compromising performance.
7. Security Features: Includes built-in security measures to protect designs and data.
8. Versatile Applications: Ideal for data centers, networking, video processing, and other demanding computational tasks.
These features make it a versatile choice for developers looking for high performance and flexibility in FPGA applications.
Pinout
1. Power and Ground Pins: Essential for powering the FPGA and maintaining stable operation.
2. Configurable I/O Pins: Used for general-purpose input/output, interfacing with other components and systems.
3. Clock Pins: Dedicated to clock signal inputs for synchronous operations.
4. Dedicated Transceiver Pins: For high-speed serial communication, supporting protocols like PCIe and Ethernet.
5. Memory Interface Pins: For connecting to external memory devices such as DDR4 or QDR-IV.
6. Configuration Pins: Used for loading the FPGA configuration during startup.
7. JTAG Pins: For testing and debugging purposes.
This FPGA is designed for high-performance applications, offering extensive logic resources, DSP slices, and memory blocks, making it suitable for complex processing tasks in fields like telecommunications, data centers, and advanced computing systems.
Manufacturer
Application
1. Data Centers: Used for acceleration of complex data processing tasks and AI workloads.
2. Telecommunications: Supports high-speed data transfer and processing in 5G networks and optical transport networks.
3. Aerospace and Defense: Facilitates advanced signal processing, radar, and communication systems.
4. Broadcasting: Enables high-quality video processing and streaming.
5. Scientific Computing: Used in research institutions for simulations and data analysis.
Its high logic density and I/O bandwidth make it suitable for applications requiring intensive computation and high-speed data handling.