XCVU095-2FFVB1760I

The XCVU095-2FFVB1760I is a high-performance Virtex UltraScale+ FPGA from Xilinx (now AMD). It features:
- Logic Cells: ~1.1 million
- DSP Slices: 6,840
- Memory: 270 Mb BRAM, 512 Mb UltraRAM
- Transceivers: Up to 32x 32.75 Gbps GTY
- I/O Pins: 1,760 (2FFVB package)
- Process: 16nm FinFET+
Designed for high-speed networking, data centers, and compute-intensive applications, it supports advanced protocols like PCIe Gen4, 100G Ethernet, and DDR4 memory. The -2 speed grade ensures robust performance, while the 1760-pin flip-chip BGA (2FFVB) package optimizes signal integrity.
Key applications include AI acceleration, 5G infrastructure, and high-performance computing (HPC). Its UltraScale+ architecture balances power efficiency with scalability, making it ideal for complex, high-bandwidth designs.
For detailed specs, refer to Xilinx DS923 (Datasheet) or UG575 (User Guide).

The XCVU095-2FFVB1760I is a Virtex UltraScale+ FPGA from Xilinx (now AMD). Equivalent alternatives include:
- XCVU065-2FFVB1760I (lower capacity)
- XCVU125-2FFVB1760I (higher capacity)
- Intel Stratix 10 GX/SX (competing FPGA family)
Check pin compatibility and feature requirements when substituting. For exact replacements, consult AMD/Xilinx documentation or distributors like Avnet, Arrow, or Digi-Key.

The XCVU095-2FFVB1760I is a high-performance FPGA from Xilinx's Virtex UltraScale+ family. Key features:
- Logic Cells: ~1.08 million
- DSP Slices: 6,840 (for high-speed math operations)
- Memory: 75.9 Mb of UltraRAM + 38.7 Mb block RAM
- Transceivers: 32 x 16.3 Gbps GTH or 12.5 Gbps GTY
- I/O Pins: 600+ (supports multiple standards like LVDS, HSTL)
- Process Technology: 16nm FinFET+ (low power, high performance)
- Configuration: Supports PCIe Gen3/4, 100G Ethernet, and advanced memory interfaces (DDR4, HBM).
Ideal for data center acceleration, networking, and high-speed signal processing.

The XCVU095-2FFVB1760I is a Virtex® UltraScale+ FPGA with the following key details:
- Pin Count: 1,760 pins (FFVB package, 45x45mm, flip-chip BGA).
- Primary Functions:
- High-speed serial transceivers (up to 32.75 Gbps).
- Logic cells (~1.2M), DSP slices (~6,840), and block RAM (~270 Mb).
- Supports PCIe Gen4, 100G Ethernet, and advanced memory interfaces (DDR4, HBM).
- Designed for high-performance computing, networking, and signal processing.
This device is part of Xilinx's (now AMD) 16nm UltraScale+ family, optimized for bandwidth-intensive applications.

The XCVU095-2FFVB1760I is a Virtex UltraScale+ FPGA manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System-on-Chips), and adaptive computing solutions. Their products are widely used in data centers, automotive, aerospace, AI, and 5G applications.
The XCVU095-2FFVB1760I is a high-performance FPGA designed for advanced computing tasks, offering high-speed processing and reconfigurability.

The XCVU095-2FFVB1760I, a high-performance Virtex UltraScale+ FPGA from Xilinx, is used in:
1. Data Centers – Accelerating AI/ML, networking, and storage.
2. 5G & Wireless – Baseband processing and fronthaul/backhaul.
3. Aerospace & Defense – Radar, EW, and secure communications.
4. High-Performance Computing (HPC) – Scientific simulations and big data analytics.
5. Automotive – ADAS and autonomous driving systems.
6. Video & Imaging – Real-time 4K/8K processing and broadcast.
Its high-speed I/O (up to 32.75 Gbps) and large logic capacity make it ideal for demanding applications.

The XCVU095-2FFVB1760I is a Virtex UltraScale+ FPGA from Xilinx (now AMD). It comes in a Flip-Chip Fine-Pitch Ball Grid Array (FFVB) package. The package type is 1760-ball FFVB (1760I), with a 1.0mm ball pitch. It supports high-speed transceivers and is designed for advanced applications requiring high performance and bandwidth.