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XCVU19P-2FSVA3824E
+Lista de MateriaisIC FPGA 1976 I/O 3824FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCVU19P-2FSVA3824E
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Pacote BGA
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 510720 |
| Number of Logic Elements/Cells | 8937600 |
| Total RAM Bits | 79586918 |
| Number of I/O | 1976 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Visão Geral
Description
The -2 in the model number indicates the speed grade of the device, with this specific grade offering a balance between performance and power consumption. The FSVA3824 denotes the package type and pin count, which affects how the FPGA can be integrated into hardware systems. The Virtex UltraScale+ series also includes features like integrated HBM (High Bandwidth Memory) and advanced DSP (Digital Signal Processing) slices, enhancing its capability to process large volumes of data efficiently. This FPGA is ideal for advanced applications requiring customization, scalability, and high efficiency.
Equivalent
1. Intel Stratix 10 series FPGAs, which offer similar high-performance capabilities.
2. Achronix Speedster7t FPGAs, known for high-speed interfaces and bandwidth.
These alternatives vary in architecture, features, and support, so it's important to review specific requirements and performance needs when considering an equivalent replacement.
Features
1. High Logic Density: It provides a substantial number of logic cells, making it suitable for complex designs.
2. UltraRAM and Block RAM: Significant on-chip memory resources for efficient data storage and processing.
3. DSP Slices: Equipped with numerous DSP slices for high-speed computations, beneficial for signal processing applications.
4. Transceivers: High-speed serial connectivity is enabled by multiple transceivers, supporting various industry standards.
5. Integrated IP: Supports a wide range of integrated IP cores for faster development cycles.
6. Power Efficiency: Designed for optimized power consumption without sacrificing performance.
7. Scalability: Offers scalability and flexibility for various applications, including communications, data centers, and aerospace.
This FPGA is ideal for advanced applications demanding high computational capabilities and efficient data handling.
Pinout
This FPGA is designed for high-performance applications and offers various functionalities, including:
1. Logic Cells: It contains a large number of programmable logic cells suitable for implementing complex digital circuits.
2. DSP Slices: Equipped with DSP slices for handling high-speed digital signal processing tasks.
3. Memory: Includes block RAM and UltraRAM for high-bandwidth memory applications.
4. I/O Capabilities: Supports a wide array of I/O standards and high-speed transceivers for communication with other devices.
5. Clock Management: Offers advanced clock management features to synchronize internal and external signals.
Overall, the XCVU19P-2FSVA3824E is designed for use in applications that require high levels of parallel processing, data throughput, and flexibility, such as telecommunications, data centers, and advanced computing systems.
Manufacturer
Application
1. Data Centers: Supports acceleration for data processing tasks, machine learning, and AI workloads.
2. Telecommunications: Used in 5G networks for high-speed data transmission and signal processing.
3. Aerospace and Defense: Ideal for radar systems, secure communications, and real-time data analysis.
4. Broadcast and Pro A/V: Facilitates high-resolution video processing and encoding.
5. Automotive: Enhances advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
Its high logic density and advanced features make it versatile for demanding computing tasks.