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XCVU23P-2VSVA1365E
+Lista de MateriaisIC FPGA VIRTEX-UP 1365FCBGA
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FabricanteAMD
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Peça do Fabricante #XCVU23P-2VSVA1365E
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Especificações
| Atributo | Valor |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 2252250 |
| Total RAM Bits | 77909197 |
| Number of I/O | 364 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1365-BFBGA, FCBGA |
| Supplier Device Package | 1365-FCBGA (35x35) |
| Number of LABs/CLBs | 128700 |
Visão Geral
Description
Equivalent
Features
1. Advanced Architecture: Built on a 16nm FinFET process, providing improved power efficiency and performance.
2. High Logic Density: Contains a large number of logic cells, enhancing its capability for complex computations and data processing.
3. Enhanced Memory: Features UltraRAM and high-speed block RAM to support data-intensive applications with ample storage and fast data access.
4. DSP Slices: Equipped with DSP slices optimized for high-speed arithmetic operations, supporting complex signal processing tasks.
5. High-Speed Connectivity: Includes multiple high-speed transceivers and I/O options for robust data exchange with peripheral components.
6. Scalability: Offers flexibility and scalability for a wide range of applications, including telecommunications, data centers, and high-performance computing.
7. Security Features: Incorporates advanced security mechanisms to protect data integrity and intellectual property.
These features make the XCVU23P-2VSVA1365E suitable for applications requiring high throughput, low latency, and efficient processing capabilities.
Pinout
1. Power and Ground Pins: Supply power to the FPGA and provide a return path for current.
2. Configuration Pins: Used for configuring the FPGA at startup.
3. I/O Pins: These are general-purpose input/output pins that can be configured for various standards and used for interfacing with other devices.
4. Dedicated Clock Pins: Used for clock inputs and distributions.
5. Multi-Gigabit Transceivers (MGTs): High-speed transceiver pins for serial communication.
6. Special Function Pins: Such as pins for JTAG interface, which is used for testing and programming.
These pins allow the FPGA to be highly versatile, supporting complex designs and interfacing with a wide range of peripherals and systems. For detailed pin functions, refer to the specific datasheet or user guide provided by Xilinx.
Manufacturer
The company’s products are widely used in various applications such as data centers, wireless communications, automotive systems, industrial control, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry known for its processors and graphics technologies. This acquisition, completed in February 2022, aims to enhance AMD's product portfolio and capabilities in FPGA and adaptive computing solutions, broadening its ability to serve a range of markets with high-performance and high-efficiency computing products.
Application
1. Data Centers: Enhances processing for AI, machine learning, and big data analytics.
2. Telecommunications: Supports next-generation networking, including 5G infrastructure.
3. Aerospace and Defense: Provides robust processing for radar, avionics, and secure communications.
4. Broadcast and Pro AV: Facilitates video processing and transcoding.
5. Industrial Automation: Powers real-time processing for automation and robotics.
6. Scientific Research: Supports simulations and high-performance computing tasks.
Its high capacity and performance make it ideal for applications demanding intensive computational tasks and data throughput.