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XCVU3P-2FFVC1517I
+Lista de MateriaisIC FPGA 520 I/O 1517FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCVU3P-2FFVC1517I
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Pacote FBGA-1517
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Em Estoque2421
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 49260 |
| Number of Logic Elements/Cells | 862050 |
| Total RAM Bits | 118067200 |
| Number of I/O | 520 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features include a large number of configurable logic blocks, high-speed serial transceivers, and extensive DSP resources, making it suitable for demanding computational tasks. The device supports high bandwidth memory integration, which is essential for data-intensive applications like data centers, networking, and video processing.
Additionally, the Virtex UltraScale+ series is known for enhanced security features, including bitstream encryption and authentication, ensuring safe deployment in critical applications. The XCVU3P-2FFVC1517I is typically used in environments requiring high throughput and low latency, such as telecom infrastructure, aerospace, and defense systems. Its extensive I/O capabilities and flexibility make it an ideal choice for customized, high-performance solutions in modern digital designs.
Equivalent
1. Intel Stratix 10 FPGAs for high-performance applications.
2. Microchip PolarFire FPGAs for lower power consumption needs.
Ensure compatibility by comparing specifications like logic cells, DSP slices, memory, I/O capabilities, and power ratings. For exact equivalents, consult detailed datasheets and product documentation from respective manufacturers.
Features
1. Architecture: Built on a 16nm FinFET process, offering high performance and power efficiency.
2. Logic Resources: Provides a large number of programmable logic cells for complex designs.
3. DSP Slices: Includes numerous DSP slices for high-speed signal processing applications.
4. Memory: Possesses large blocks of on-chip memory for data storage and processing.
5. I/O Options: Supports high-speed serial transceivers and configurable I/O standards for versatile connectivity.
6. Security Features: Incorporates advanced security mechanisms for secure boot and data encryption.
7. Clock Management: Has advanced clock management features for precise timing control.
8. Power Efficiency: Designed for optimized power consumption without compromising performance.
9. Scalability: Suitable for a range of applications from communications to data center acceleration.
This FPGA targets high-performance applications like 5G wireless, data center acceleration, and advanced aerospace and defense systems.
Pinout
Manufacturer
Application
1. Data Center Acceleration: Enhances performance for cloud computing and data processing.
2. 5G Wireless Infrastructure: Supports high-speed data processing and connectivity.
3. Advanced Network Systems: Improves throughput and efficiency in network hardware.
4. Broadcast and Pro AV: Facilitates high-resolution video processing and transmission.
5. Aerospace and Defense: Provides robust solutions for complex signal processing and communications.
6. Automotive ADAS: Assists in advanced driver-assistance systems with real-time data processing.
Its high logic density and power efficiency make it ideal for demanding applications requiring speed and reliability.