XCVU3P-2FFVC1517I

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XCVU3P-2FFVC1517I

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IC FPGA 520 I/O 1517FCBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XCVU3P-2FFVC1517I

  • Pacote FBGA-1517

  • Em Estoque2421

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Especificações

Atributo Valor
Package / Case Tray
Series Virtex® UltraScale+™
Part Status Active
Number of LABs/CLBs 49260
Number of Logic Elements/Cells 862050
Total RAM Bits 118067200
Number of I/O 520
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Visão Geral

Description

The XCVU3P-2FFVC1517I is a model from Xilinx's Virtex UltraScale+ FPGA family, designed to deliver high performance and capacity for a wide range of applications. This specific model features advanced 16nm FinFET+ process technology, providing enhanced speed, power efficiency, and integrative capabilities compared to earlier technologies.
Key features include a large number of configurable logic blocks, high-speed serial transceivers, and extensive DSP resources, making it suitable for demanding computational tasks. The device supports high bandwidth memory integration, which is essential for data-intensive applications like data centers, networking, and video processing.
Additionally, the Virtex UltraScale+ series is known for enhanced security features, including bitstream encryption and authentication, ensuring safe deployment in critical applications. The XCVU3P-2FFVC1517I is typically used in environments requiring high throughput and low latency, such as telecom infrastructure, aerospace, and defense systems. Its extensive I/O capabilities and flexibility make it an ideal choice for customized, high-performance solutions in modern digital designs.

Equivalent

The XCVU3P-2FFVC1517I is a Virtex UltraScale+ FPGA by Xilinx. Equivalent products might include other FPGAs with similar capabilities from other brands, such as:
1. Intel Stratix 10 FPGAs for high-performance applications.
2. Microchip PolarFire FPGAs for lower power consumption needs.
Ensure compatibility by comparing specifications like logic cells, DSP slices, memory, I/O capabilities, and power ratings. For exact equivalents, consult detailed datasheets and product documentation from respective manufacturers.

Features

The XCVU3P-2FFVC1517I is part of Xilinx's Virtex UltraScale+ FPGA family. Key features include:
1. Architecture: Built on a 16nm FinFET process, offering high performance and power efficiency.
2. Logic Resources: Provides a large number of programmable logic cells for complex designs.
3. DSP Slices: Includes numerous DSP slices for high-speed signal processing applications.
4. Memory: Possesses large blocks of on-chip memory for data storage and processing.
5. I/O Options: Supports high-speed serial transceivers and configurable I/O standards for versatile connectivity.
6. Security Features: Incorporates advanced security mechanisms for secure boot and data encryption.
7. Clock Management: Has advanced clock management features for precise timing control.
8. Power Efficiency: Designed for optimized power consumption without compromising performance.
9. Scalability: Suitable for a range of applications from communications to data center acceleration.
This FPGA targets high-performance applications like 5G wireless, data center acceleration, and advanced aerospace and defense systems.

Pinout

The XCVU3P-2FFVC1517I is a Virtex® UltraScale+™ FPGA from Xilinx. It features a pin count of 1517 pins. These pins are distributed across various functions needed to support the FPGA's operation, including user I/O pins, power pins, ground pins, and configuration pins. The user I/O pins are used for interfacing the FPGA with external components, while power and ground pins are essential for supplying the necessary power to the FPGA. Configuration pins are used during the initial setup and programming of the FPGA. Additionally, some of the pins may be designated for specific high-speed transceivers or other specialized functions provided by the FPGA.

Manufacturer

The XCVU3P-2FFVC1517I is a product manufactured by Xilinx, Inc., which is a company that specializes in designing and developing programmable logic devices. Xilinx is known for its field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and programmable system-on-chips (PSOCs), which are used in a variety of applications such as data centers, automotive, telecommunications, aerospace, and more. FPGAs are semiconductor devices that can be programmed after manufacturing to perform a wide array of tasks, offering flexibility and adaptability in hardware design. Xilinx was acquired by Advanced Micro Devices, Inc. (AMD) in 2022, further enhancing AMD's capabilities in high-performance and adaptive computing solutions. The company operates as a subsidiary under AMD, continuing to focus on innovation in programmable logic devices.

Application

The XCVU3P-2FFVC1517I is a high-performance FPGA from Xilinx's Virtex UltraScale+ family. Its application areas include:
1. Data Center Acceleration: Enhances performance for cloud computing and data processing.
2. 5G Wireless Infrastructure: Supports high-speed data processing and connectivity.
3. Advanced Network Systems: Improves throughput and efficiency in network hardware.
4. Broadcast and Pro AV: Facilitates high-resolution video processing and transmission.
5. Aerospace and Defense: Provides robust solutions for complex signal processing and communications.
6. Automotive ADAS: Assists in advanced driver-assistance systems with real-time data processing.
Its high logic density and power efficiency make it ideal for demanding applications requiring speed and reliability.

Package

The XCVU3P-2FFVC1517I is a Field-Programmable Gate Array (FPGA) from Xilinx's Virtex UltraScale+ family. Its package type is "FFVC1517," which denotes a Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) with 1517 pins. The "-2" indicates its speed grade, and the "I" at the end signifies its industrial temperature range.

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