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XCVU9P-2FLGB2104I
+Lista de MateriaisIC FPGA 702 I/O 2104FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCVU9P-2FLGB2104I
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Pacote FBGA-2104
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Em Estoque2894
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 147780 |
| Number of Logic Elements/Cells | 2586150 |
| Total RAM Bits | 391168000 |
| Number of I/O | 702 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The FPGA boasts a robust set of resources that support complex algorithms and data-intensive tasks. Its flexible architecture allows for customizability in various applications, from machine learning and AI to video processing and network acceleration. With its advanced power management and enhanced security features, the XCVU9P-2FLGB2104I is tailored for next-generation technologies that require scalability, efficiency, and reliability.
Equivalent
1. Intel Stratix 10 FPGAs
2. Lattice CrossLink-NX Series (in specific applications)
3. Microsemi PolarFire FPGAs (for low power applications)
These alternatives vary based on specific application requirements, such as processing power, energy efficiency, and IO capabilities. Always verify specifications to ensure compatibility with your project needs.
Features
1. High Performance: Designed for high-performance computing applications with a significant number of logic cells.
2. Large Scale Integration: Supports millions of system logic cells, making it suitable for complex designs.
3. High Bandwidth: Offers high-bandwidth connectivity options with numerous I/O pins and support for high-speed transceivers.
4. Advanced Power Management: Features dynamic power-saving techniques to enhance energy efficiency.
5. Versatile Design Capabilities: Supports a wide range of applications, from data centers to aerospace and defense.
6. 3D IC Technology: May employ 3D IC technology for improved density and performance.
7. Scalability: Offers scalability and flexibility for different application needs.
Specific features may vary, so checking the official datasheet is recommended for precise information.
Pinout
The functions provided by the XCVU9P-2FLGB2104I include a wide array of configurable logic blocks, DSP slices for digital signal processing tasks, and an extensive routing architecture to facilitate complex designs. It also supports high-speed transceivers for communication purposes, embedded memory blocks, and integrated IP for faster development cycles. The device is equipped to handle applications ranging from communications and networking to data center and automotive systems. This specific model is also characterized by its speed grade and temperature range, making it suitable for industrial applications.
Manufacturer
Application
1. Telecommunications: Used in 5G networks and broadband communication systems.
2. Data Centers: Supports high-performance computing and server acceleration.
3. Aerospace and Defense: Facilitates radar, electronic warfare, and secure communication systems.
4. Medical Imaging: Powers advanced imaging and data processing.
5. Automotive: Supports advanced driver-assistance systems (ADAS) and autonomous driving technology.
These applications leverage the FPGA's capability for parallel processing, reconfigurability, and high bandwidth memory interface.