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XCZU15EG
+Lista de MateriaisSoC FPGA XCZU15EG-2FFVB1156I4560
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FabricanteAMD / Xilinx
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Peça do Fabricante #XCZU15EG
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Ficha Técnica XCZU15EG DataSheet
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Especificações
| Atributo | Valor |
| Standard Pack Qty | 24 |
Visão Geral
Description
- Processing System (PS):
- Quad-core 64-bit Cortex-A53 (up to 1.5GHz)
- Dual-core Cortex-R5 (up to 600MHz) for real-time tasks
- Mali-400 GPU for graphics
- Programmable Logic (PL):
- 746K logic cells, 32.1Mb BRAM, 3,528 DSP slices
- Supports high-speed interfaces (PCIe Gen3, 10G Ethernet, USB 3.0)
- Memory: 32KB L1, 1MB L2 cache, DDR4/LPDDR4 support
- I/O: Rich peripherals (CAN, SPI, I2C, UART)
- Applications: Aerospace, automotive, AI/ML, and high-speed data processing.
The XCZU15EG excels in heterogeneous computing, offering flexibility for both software and hardware acceleration.
Equivalent
- Intel (Altera): Stratix 10 SX SoC (combines ARM cores with FPGA logic).
- Microchip (Microsemi): PolarFire SoC (lower power, mid-range performance).
- AMD (Xilinx): Other Zynq UltraScale+ variants (e.g., XCZU11EG for lower logic, XCZU19EG for higher).
These offer similar FPGA+ARM SoC architectures but vary in performance, power, and features.
Features
- Processor: Quad-core Arm Cortex-A53 (up to 1.5GHz), dual-core Cortex-R5 (up to 600MHz), and Mali-400 MP2 GPU.
- FPGA Logic: 746K system logic cells, 1,728 DSP slices, and 70.9Mb BRAM.
- Memory: Supports DDR4, LPDDR4, and HBM (via select models).
- I/O: 32.75Gb/s transceivers (16x GTH, 4x GTY), PCIe Gen3/Gen4 support.
- Connectivity: Gigabit Ethernet, USB 3.0, CAN, SPI, I2C, UART.
- Power Efficiency: 16nm FinFET+ process for low power.
- Security: Secure boot, AES/SHA-256 encryption, and tamper protection.
- Applications: Embedded vision, AI acceleration, 5G, and high-performance computing.
Compact yet powerful, it integrates processing, FPGA flexibility, and high-speed interfaces.
Pinout
- Pin Count: 760 pins (FFVC1760 package, 0.8mm ball pitch).
- Functions:
- Quad-core ARM Cortex-A53 (up to 1.5GHz).
- Dual-core ARM Cortex-R5 (up to 600MHz).
- Mali-400 MP2 GPU.
- FPGA Logic: ~746K logic cells, 34.1Mb BRAM, 3,528 DSP slices.
- High-speed I/O: Supports PCIe Gen3/4, USB 3.0, SATA 3.1, DisplayPort, and multiple GTH/GTY transceivers (up to 16.3Gbps).
- Memory Interfaces: DDR4, LPDDR4, HBM (optional).
- Peripherals: Gigabit Ethernet, CAN, SPI, I2C, UART, GPIO.
It is designed for high-performance embedded systems, data acceleration, and signal processing.
Manufacturer
Application
1. High-Performance Computing (HPC) – Accelerating AI/ML, data analytics.
2. 5G & Wireless – Baseband processing, RF signal handling.
3. Automotive – ADAS, autonomous driving, in-vehicle networks.
4. Industrial Automation – Robotics, real-time control, vision systems.
5. Aerospace & Defense – Radar, secure comms, avionics.
6. Medical Imaging – Ultrasound, MRI processing.
7. Video & Vision – 4K/8K encoding, surveillance, AR/VR.
Its ARM cores + FPGA logic enable flexible, power-efficient solutions.
Package
1. FFVC1760 - Flip-chip Fine-pitch Ball Grid Array (FFBGA) with 1760 pins.
2. FFVC1156 - Flip-chip Fine-pitch Ball Grid Array (FFBGA) with 1156 pins.
Both packages support the Zynq UltraScale+ MPSoC architecture, offering high-performance processing and programmable logic.