XCZU2CG-1SFVC784I

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XCZU2CG-1SFVC784I

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IC SOC CORTEX-A53 784FCBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XCZU2CG-1SFVC784I

  • Pacote FBGA-784

  • Em Estoque5119

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Especificações

Atributo Valor
Package / Case Tray
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)

Visão Geral

Description

The XCZU2CG-1SFVC784I is a model from Xilinx's Zynq UltraScale+ MPSoC series. This component integrates a dual-core ARM Cortex-A53 processor with a variety of customizable logic, making it suitable for applications requiring high processing power and flexibility. The device is built on a 16nm FinFET process, ensuring high performance and low power consumption.
Key features of the XCZU2CG-1SFVC784I include a heterogeneous processing system that combines application processing and programmable logic. The dual-core ARM Cortex-A53 is used for high-efficiency processing tasks, while the programmable logic allows for tailored hardware acceleration.
This MPSoC supports advanced connectivity options, high-speed I/O, and has integrated features like security, low-power operation, and multimedia capabilities, making it ideal for embedded systems, industrial automation, and advanced communication systems. The package type "SFVC784" refers to the specific physical form factor and pin configuration, while the "I" in the model name indicates that it is rated for the industrial temperature range.

Equivalent

The XCZU2CG-1SFVC784I is a Zynq UltraScale+ MPSoC from Xilinx. Equivalent products would include similar FPGA or SoC solutions from other manufacturers like Intel's Cyclone V SoC or Microsemi's SmartFusion2. It's important to closely compare specific features such as logic cells, processing cores, and I/O capabilities, as equivalency can vary based on the application requirements. For precise compatibility, consult specific datasheets and product selectors from the manufacturers.

Features

The XCZU2CG-1SFVC784I is part of Xilinx's Zynq UltraScale+ MPSoC series, designed for embedded applications. Key features include:
1. Architecture: Combines a quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and a Mali-400 MP2 GPU, providing robust computational capabilities.
2. Programmable Logic: Includes approximately 103k system logic cells, making it highly versatile for custom hardware acceleration and parallel processing tasks.
3. Memory: Supports integrated memory controllers for DDR4, LPDDR4, DDR3, and LPDDR3, enhancing data handling efficiency and speed.
4. Connectivity: Offers multiple high-speed connectivity options such as PCIe® Gen2, USB 3.0, SATA 3.1, and Gigabit Ethernet, facilitating extensive interfacing capabilities.
5. Security: Features a range of security functions, including secure boot and hardware root of trust, ensuring data protection and integrity.
6. Package: Available in a 784-ball FBGA package, offering a compact form factor suitable for space-constrained applications.
7. Power Management: Integrated power management unit for efficient energy usage, crucial in embedded and IoT applications.
These features make it suitable for applications requiring high performance, low power, and flexibility, such as automotive, industrial, and networking sectors.

Pinout

The XCZU2CG-1SFVC784I is a part of Xilinx's Zynq UltraScale+ MPSoC family. This specific model comes in an FVC784 package, which has 784 pins. The device integrates a combination of a processing system (PS) and programmable logic (PL) on a single chip. The PS includes a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processors, and an ARM Mali-400MP2 GPU, while the PL provides a high level of flexibility for custom logic designs.
The device is designed for a variety of applications, including embedded systems, data processing, and industrial automation. It supports multiple connectivity interfaces, high-speed I/Os, and has configurable logic blocks for custom applications. Its features include support for advanced memory interfaces, high-speed transceivers, and integrated hardware and software programmability, making it suitable for complex, compute-intensive tasks.
The package supports a comprehensive range of peripherals and interfaces, providing flexibility in design and implementation. For detailed pin functions and mappings, referring to the specific datasheet and user guide from Xilinx is recommended.

Manufacturer

The XCZU2CG-1SFVC784I is manufactured by Xilinx, Inc. Xilinx is a company that specializes in designing and developing programmable logic devices, including field-programmable gate arrays (FPGAs), adaptive compute acceleration platforms (ACAPs), and complex programmable logic devices (CPLDs). Xilinx is known for its innovation in the semiconductor industry, particularly in creating products that allow for high-speed processing and customized computing solutions. The company's products are used in a wide range of applications, such as telecommunications, automotive, aerospace, defense, data centers, and consumer electronics. Xilinx's technology enables developers to design systems with high performance and flexibility, catering to specific needs by allowing hardware customization after manufacturing. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a prominent multinational semiconductor company known for manufacturing microprocessors, graphics processors, and related technologies. This acquisition allows AMD to broaden its product portfolio and offer enhanced solutions by combining Xilinx's FPGA and adaptive computing technologies with AMD's existing expertise in high-performance computing.

Application

The XCZU2CG-1SFVC784I, a member of Xilinx's Zynq UltraScale+ MPSoC family, is utilized in a variety of applications. These include embedded systems, industrial automation, and robotics, where its combination of processing power and programmable logic is beneficial. It's also used in telecommunications for tasks such as network processing and protocol bridging. Additionally, this device finds applications in automotive systems for advanced driver-assistance systems (ADAS) and infotainment. In the medical field, it's used for imaging and diagnostics equipment. Its versatility in combining CPUs and FPGA fabric makes it suitable for any application requiring high-performance computing with flexible I/O customization.

Package

The XCZU2CG-1SFVC784I is a System on Chip (SoC) from Xilinx's Zynq UltraScale+ series. It features a BGA (Ball Grid Array) package with 784 pins. The "SFVC784" indicates the specific package type and dimensions, with "I" denoting industrial grade.

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