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IC SOC CORTEX-A53 784FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCZU2CG-1SFVC784I
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Pacote FBGA-784
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Em Estoque5119
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features of the XCZU2CG-1SFVC784I include a heterogeneous processing system that combines application processing and programmable logic. The dual-core ARM Cortex-A53 is used for high-efficiency processing tasks, while the programmable logic allows for tailored hardware acceleration.
This MPSoC supports advanced connectivity options, high-speed I/O, and has integrated features like security, low-power operation, and multimedia capabilities, making it ideal for embedded systems, industrial automation, and advanced communication systems. The package type "SFVC784" refers to the specific physical form factor and pin configuration, while the "I" in the model name indicates that it is rated for the industrial temperature range.
Equivalent
Features
1. Architecture: Combines a quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and a Mali-400 MP2 GPU, providing robust computational capabilities.
2. Programmable Logic: Includes approximately 103k system logic cells, making it highly versatile for custom hardware acceleration and parallel processing tasks.
3. Memory: Supports integrated memory controllers for DDR4, LPDDR4, DDR3, and LPDDR3, enhancing data handling efficiency and speed.
4. Connectivity: Offers multiple high-speed connectivity options such as PCIe® Gen2, USB 3.0, SATA 3.1, and Gigabit Ethernet, facilitating extensive interfacing capabilities.
5. Security: Features a range of security functions, including secure boot and hardware root of trust, ensuring data protection and integrity.
6. Package: Available in a 784-ball FBGA package, offering a compact form factor suitable for space-constrained applications.
7. Power Management: Integrated power management unit for efficient energy usage, crucial in embedded and IoT applications.
These features make it suitable for applications requiring high performance, low power, and flexibility, such as automotive, industrial, and networking sectors.
Pinout
The device is designed for a variety of applications, including embedded systems, data processing, and industrial automation. It supports multiple connectivity interfaces, high-speed I/Os, and has configurable logic blocks for custom applications. Its features include support for advanced memory interfaces, high-speed transceivers, and integrated hardware and software programmability, making it suitable for complex, compute-intensive tasks.
The package supports a comprehensive range of peripherals and interfaces, providing flexibility in design and implementation. For detailed pin functions and mappings, referring to the specific datasheet and user guide from Xilinx is recommended.