Imagens apenas para referência
XCZU2CG-L1SBVA484I
+Lista de MateriaisIC SOC CORTEX-A53 484FCBGA
-
FabricanteAMD Xilinx
-
Peça do Fabricante #XCZU2CG-L1SBVA484I
-
Pacote FBGA-484
-
Em Estoque3403
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The device is built on a 16nm FinFET process, offering high performance and low power consumption. It features a wide range of connectivity options, including high-speed transceivers, I/O ports, and memory interfaces, making it suitable for applications in automotive, industrial, and communication sectors.
The "SBVA484" part of the name refers to its specific package type and pin count, while "L1" denotes the speed grade. The "I" at the end signifies industrial temperature range support, making it robust for various environmental conditions.
Overall, the XCZU2CG-L1SBVA484I is ideal for developers needing a versatile, efficient platform for complex embedded systems.
Equivalent
1. Xilinx Zynq UltraScale+ MPSoC variants with similar specs.
2. Intel (Altera) Cyclone V SoC for comparable applications.
3. NXP i.MX 8 series for similar embedded processing.
4. Texas Instruments AM57x Sitara series for integrated processors.
Specifications such as processing power, I/O, and specific application needs should guide exact equivalency.
Features
1. Architecture: Combines a dual-core ARM Cortex-A53 processing system and Xilinx programmable logic.
2. Processing System: ARM Cortex-R5 real-time processors and a Mali-400 MP2 GPU for graphics processing.
3. Programmable Logic: Offers a range of FPGA logic resources for custom hardware designs.
4. Connectivity: Includes high-speed interfaces such as USB, SATA, PCIe, and Gigabit Ethernet.
5. Security: Advanced security features including secure boot and encryption support.
6. Power Management: Integrated power management for efficient energy use.
7. Memory Support: Interfaces for DDR4, LPDDR4, and DDR3L memory.
8. Package: Available in a small SBVA484 package suitable for compact designs.
9. Temperature Range: Industrial-grade temperature range for robust operation in harsh environments.
This combination makes it suitable for a wide range of applications, including industrial automation, automotive, and communications, where a mix of software programmability and hardware acceleration is beneficial.
Pinout
Key functions of the XCZU2CG include:
1. Processing System (PS): Comprising the ARM cores for application processing, real-time processing, and graphics.
2. Programmable Logic (PL): FPGA fabric for custom logic implementation.
3. Interconnect: High-bandwidth interface between the PS and PL for efficient data transfer.
4. I/O Interfaces: Support for various I/O standards and peripherals.
This combination of processing capabilities and programmable logic makes it suitable for applications in automotive, industrial, and embedded systems.
Manufacturer
Application
1. Industrial Automation: Enhances real-time processing for robotics and control systems.
2. Automotive: Supports ADAS and infotainment systems with high processing power.
3. Aerospace and Defense: Offers robust processing for secure communications and radar systems.
4. Medical Imaging: Facilitates high-resolution imaging and diagnostics.
5. Telecommunications: Provides infrastructure for 5G network development and data processing.
6. IoT and Smart Devices: Enables edge computing and efficient data management.
These applications leverage the device's high performance, flexibility, and integration capabilities.