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XCZU3EG-2SFVC784I
+Lista de MateriaisIC SOC CORTEX-A53 784FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCZU3EG-2SFVC784I
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Pacote FBGA-784
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Em Estoque6140
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The "XCZU3EG" designates it as part of the ZU3EG series, which balances performance and power efficiency. The "2" indicates its speed grade, and "SFVC784" refers to its package type and pin count, which is a 784-pin flip-chip ball grid array (FCBGA).
The "-I" suffix denotes the industrial temperature range, suitable for environments between -40°C and +100°C. This makes it ideal for applications in automotive, industrial, and communication systems requiring robust performance in diverse conditions.
Overall, the XCZU3EG-2SFVC784I is a versatile solution that combines processing power with the flexibility of FPGA, suitable for complex embedded systems.
Equivalent
1. Altera (Intel) Stratix 10 or Arria 10 SoCs.
2. Microsemi (Microchip) PolarFire SoC.
3. NXP's Layerscape series.
4. Texas Instruments' Sitara AM6x series.
These alternatives offer similar embedded processing capabilities but may vary in specific features and performance metrics. Always verify compatibility with your specific application requirements.
Features
1. Processing System (PS):
- Quad-core ARM Cortex-A53 processor, offering 32/64-bit processing capabilities.
- ARM Cortex-R5 real-time processors for real-time applications.
- Integrated ARM Mali-400 MP2 GPU.
2. Programmable Logic (PL):
- Built on UltraScale+ FPGA architecture.
- Approximately 154,000 logic cells.
3. Memory:
- Supports DDR4/LPDDR4, DDR3/LPDDR3 memory interfaces.
4. I/O and Communication:
- High-speed connectivity options with multiple I/O standards.
- Integrated transceivers supporting high data rates.
5. Security Features:
- Secure boot, encrypted bitstream, and other security protocols.
6. Power Management:
- Advanced power management features for optimized energy consumption.
This device is suitable for applications requiring a combination of advanced processing, programmable logic, and real-time operations, such as embedded systems, automotive, and industrial automation.
Pinout
The device is designed for high-performance applications, offering a combination of processing system and programmable logic. It supports various interfaces, including PCIe, USB, and Gigabit Ethernet, making it suitable for applications such as embedded vision, industrial automation, and communication systems. The I/O pins of the device can be configured for different standards and voltages, which adds to its versatility in system design.
Manufacturer
Application
1. Embedded Systems: Used in advanced embedded applications requiring high performance and flexibility.
2. Automotive: Supports ADAS, infotainment, and autonomous driving technologies.
3. Networking: Facilitates high-speed data processing and protocol implementations in network infrastructure.
4. Industrial Automation: Enables sophisticated control systems and real-time processing.
5. Aerospace and Defense: Suitable for complex signal processing and secure communications.
6. Consumer Electronics: Powers smart devices requiring advanced computation and connectivity.
7. Medical Imaging: Assists in real-time data processing and image enhancement tasks.