XCZU9CG-2FFVC900I

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XCZU9CG-2FFVC900I

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IC SOC CORTEX-A53 900FCBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XCZU9CG-2FFVC900I

  • Pacote FBGA-900

  • Em Estoque2920

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Especificações

Atributo Valor
Package / Case Tray
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)

Visão Geral

Description

The XCZU9CG-2FFVC900I is a model from Xilinx's Zynq UltraScale+ MPSoC family, which integrates a high-performance processing system with programmable logic. This specific part, XCZU9CG, features a combination of ARM Cortex-A53 64-bit quad-core processors, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 GPU, providing robust processing capabilities for diverse applications. The -2 denotes its speed grade, affecting performance parameters like maximum clock frequency.
The device also includes advanced programmable logic akin to Xilinx's Kintex UltraScale devices, offering substantial flexibility for custom hardware acceleration and parallel processing tasks. It comes in a 900-ball grid array (BGA) package (FFVC900), balancing size and connectivity, suitable for complex designs that require significant I/O bandwidth and memory interfaces.
This model supports applications in embedded systems requiring high computational power and real-time processing, such as automotive, aerospace, defense, and communications. The industrial-grade temperature rating (I) means it can operate in harsh conditions, ensuring reliability across a range of environments.

Equivalent

The XCZU9CG-2FFVC900I is a Xilinx Zynq UltraScale+ MPSoC device. Equivalent products from other manufacturers might include:
1. Altera (Intel) Stratix 10 SoC series.
2. Microsemi (Microchip) PolarFire SoC FPGA series.
3. Lattice Semiconductor's CrossLink-NX FPGA series (though not a direct one-to-one feature match).
These alternatives provide similar capabilities such as integrated CPUs and FPGA fabric but may vary in specific features and performance. Always compare specifications to ensure suitability for your application.

Features

The XCZU9CG-2FFVC900I is a Zynq UltraScale+ MPSoC from Xilinx. It features a combination of ARM-based processing system and programmable logic. Key highlights include:
1. Processing System: It includes a quad-core ARM Cortex-A53, dual-core Cortex-R5 real-time processor, and a Mali-400 MP2 GPU for efficient processing and graphics capabilities.

2. Programmable Logic: The device offers 504K system logic cells, enabling extensive custom hardware acceleration and adaptability.
3. Memory: It supports DDR4, LPDDR4, DDR3, and LPDDR3 interfaces for high-speed memory connectivity.
4. I/Os and Interfaces: It includes high-speed connectivity options like PCIe Gen3, USB 3.0, SATA, and Gigabit Ethernet, suitable for a wide range of applications.
5. Power Efficiency: The -2 speed grade and lower power consumption make it optimal for embedded applications requiring efficient energy use.
6. Package: Comes in a FFVC900 package ideal for space-constrained applications.
This versatile MPSoC is well-suited for applications in automotive, industrial, and communication systems, offering a robust balance of performance, flexibility, and power efficiency.

Pinout

The XCZU9CG-2FFVC900I is a model from Xilinx's Zynq UltraScale+ MPSoC family. It features a total of 900 pins in a flip-chip ball grid array (FCBGA) package.
In terms of functionality, this device integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400MP2 graphics processing unit. Additionally, it includes programmable logic (PL) fabric, which is a field-programmable gate array (FPGA) for custom hardware acceleration. This combination of processing units allows for a versatile range of applications, including embedded vision, industrial IoT, and advanced driver-assistance systems (ADAS).
This model offers high processing power, security features, and connectivity options, making it suitable for complex and compute-intensive applications. The pin configuration supports a variety of interfaces, such as DDR memory, high-speed transceivers, and general-purpose I/Os, enabling flexible system design.

Manufacturer

The XCZU9CG-2FFVC900I is manufactured by Xilinx, Inc. Xilinx is a technology company that specializes in the development and production of programmable logic devices. It is well-known for its field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). Xilinx provides its products for a wide range of applications including telecommunications, data centers, automotive, aerospace, and industrial sectors. The company's solutions enable hardware programmability, offering flexibility and efficiency for various electronic designs. Xilinx was acquired by Advanced Micro Devices (AMD) in 2022, which expanded AMD's product offerings and capabilities in programmable logic and adaptive computing technologies.

Application

The XCZU9CG-2FFVC900I, part of Xilinx's Zynq UltraScale+ MPSoC family, is used in various application areas due to its versatile architecture. Key areas include:
1. Embedded Vision Systems: Utilized in automotive, industrial, and consumer electronics for image processing and machine learning.
2. Communications: Supports 5G wireless infrastructure with its high-speed processing capabilities.
3. Aerospace and Defense: Offers reliability and performance for radar and electronic warfare systems.
4. Medical Imaging: Facilitates advanced processing in diagnostic equipment.
5. Industrial IoT: Powers smart sensors and control systems for automation solutions.
Its integration of a programmable logic array and a processing system makes it suitable for applications requiring high performance and flexibility.

Package

The XCZU9CG-2FFVC900I is a Xilinx Zynq UltraScale+ MPSoC with a package type of FC-CSP (Flip-Chip Chip Scale Package) featuring 900 pins. The "FFVC900" part of the designation refers to the specific package and pin arrangement.

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