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XCZU9CG-2FFVC900I
+Lista de MateriaisIC SOC CORTEX-A53 900FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCZU9CG-2FFVC900I
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Pacote FBGA-900
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The device also includes advanced programmable logic akin to Xilinx's Kintex UltraScale devices, offering substantial flexibility for custom hardware acceleration and parallel processing tasks. It comes in a 900-ball grid array (BGA) package (FFVC900), balancing size and connectivity, suitable for complex designs that require significant I/O bandwidth and memory interfaces.
This model supports applications in embedded systems requiring high computational power and real-time processing, such as automotive, aerospace, defense, and communications. The industrial-grade temperature rating (I) means it can operate in harsh conditions, ensuring reliability across a range of environments.
Equivalent
1. Altera (Intel) Stratix 10 SoC series.
2. Microsemi (Microchip) PolarFire SoC FPGA series.
3. Lattice Semiconductor's CrossLink-NX FPGA series (though not a direct one-to-one feature match).
These alternatives provide similar capabilities such as integrated CPUs and FPGA fabric but may vary in specific features and performance. Always compare specifications to ensure suitability for your application.
Features
1. Processing System: It includes a quad-core ARM Cortex-A53, dual-core Cortex-R5 real-time processor, and a Mali-400 MP2 GPU for efficient processing and graphics capabilities.
2. Programmable Logic: The device offers 504K system logic cells, enabling extensive custom hardware acceleration and adaptability.
3. Memory: It supports DDR4, LPDDR4, DDR3, and LPDDR3 interfaces for high-speed memory connectivity.
4. I/Os and Interfaces: It includes high-speed connectivity options like PCIe Gen3, USB 3.0, SATA, and Gigabit Ethernet, suitable for a wide range of applications.
5. Power Efficiency: The -2 speed grade and lower power consumption make it optimal for embedded applications requiring efficient energy use.
6. Package: Comes in a FFVC900 package ideal for space-constrained applications.
This versatile MPSoC is well-suited for applications in automotive, industrial, and communication systems, offering a robust balance of performance, flexibility, and power efficiency.
Pinout
In terms of functionality, this device integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400MP2 graphics processing unit. Additionally, it includes programmable logic (PL) fabric, which is a field-programmable gate array (FPGA) for custom hardware acceleration. This combination of processing units allows for a versatile range of applications, including embedded vision, industrial IoT, and advanced driver-assistance systems (ADAS).
This model offers high processing power, security features, and connectivity options, making it suitable for complex and compute-intensive applications. The pin configuration supports a variety of interfaces, such as DDR memory, high-speed transceivers, and general-purpose I/Os, enabling flexible system design.
Manufacturer
Application
1. Embedded Vision Systems: Utilized in automotive, industrial, and consumer electronics for image processing and machine learning.
2. Communications: Supports 5G wireless infrastructure with its high-speed processing capabilities.
3. Aerospace and Defense: Offers reliability and performance for radar and electronic warfare systems.
4. Medical Imaging: Facilitates advanced processing in diagnostic equipment.
5. Industrial IoT: Powers smart sensors and control systems for automation solutions.
Its integration of a programmable logic array and a processing system makes it suitable for applications requiring high performance and flexibility.