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XCZU9EG-2FFVB1156I
+Lista de MateriaisIC SOC CORTEX-A53 1156FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCZU9EG-2FFVB1156I
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Pacote FCBGA-1156
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Em Estoque6907
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA, FCBGA |
Visão Geral
Description
Manufactured using TSMC's 16nm FinFET process, the XCZU9EG-2FFVB1156I features advanced power efficiency and significant performance improvements over previous architectures. It includes a comprehensive set of interfaces and peripherals, making it suitable for a wide range of applications, such as automotive, industrial, and communication systems.
The device is housed in a 1156-ball Flip-Chip Ball Grid Array (FCBGA) package, providing numerous I/O options for flexible connectivity. It also incorporates extensive on-chip memory, high-bandwidth interfaces, and security features, supporting secure boot and data encryption.
Overall, the XCZU9EG-2FFVB1156I offers a powerful platform for developers needing versatile, high-performance, and energy-efficient solutions in their designs.
Equivalent
1. Intel's Stratix 10 SoC series, offering similar FPGA and processing capabilities.
2. Microsemi's PolarFire SoC, which provides FPGA-based SoCs with RISC-V cores.
3. Altera's Arria 10 SoC series, combining FPGA with ARM processors.
These alternatives vary in processing power, features, and specific use cases, so compatibility with the intended application should be checked.
Features
1. Architecture: Combines a processing system (PS) with programmable logic (PL).
2. Processing System: Includes a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processors, and an ARM Mali-400 MP2 GPU.
3. Programmable Logic: Provides substantial FPGA fabric for custom hardware acceleration.
4. Memory: Supports DDR4, LPDDR4, DDR3, and LPDDR3 memory interfaces.
5. I/O and Interfaces: Includes high-speed connectivity options like PCIe, SATA, and Gigabit Ethernet.
6. Power: Offers advanced power management features for efficient energy use.
7. Security: Features secure boot, encryption, and authentication for secure applications.
8. Package: Comes in a 1156-pin FFG (flip-chip fine-pitch ball grid array) package.
9. Temperature Range: Designed for industrial temperature ranges, making it suitable for demanding environments.
This device is ideal for applications requiring a combination of processing power, flexibility, and high-speed interfacing, such as automotive, industrial automation, and telecommunications.
Pinout
Key functions of the XCZU9EG-2FFVB1156I include:
1. Processing System (PS): It includes a quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and a Mali-400 MP2 GPU, offering robust processing capabilities.
2. Programmable Logic (PL): The FPGA section allows for customized logic implementation, providing high flexibility for hardware acceleration and custom peripheral integration.
3. High-Speed Interfaces: Supports high-speed connectivity options like PCIe, SATA, and Gigabit Ethernet.
4. Memory Interfaces: Capable of interfacing with DDR4, LPDDR4, and other memory standards for high data throughput.
5. Security Features: Includes hardware-based security features essential for secure boot processes and data protection.
This combination of processing power, flexibility, and advanced features makes it an ideal choice for complex, high-performance applications.
Manufacturer
Application
1. Embedded Vision Systems: Used in advanced imaging and video processing due to its parallel processing capabilities.
2. Industrial Automation: Ideal for complex control systems and real-time processing.
3. Automotive: Supports ADAS (Advanced Driver Assistance Systems) for enhanced safety and automation.
4. Telecommunications: Utilized in network infrastructure for 5G and beyond, providing high-speed data processing.
5. Aerospace and Defense: Suitable for radar and electronic warfare systems due to its robust and adaptable architecture.
These applications benefit from its integration of processing systems and programmable logic.