ZGM130S037HGN2

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ZGM130S037HGN2

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RX TXRX MODULE ISM < 1GHZ SMD

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Especificações

Atributo Valor
Package / Case Tray
Series Z-Wave®
Part Status Active
RF Family / Standard General ISM < 1GHz
Protocol Z-Wave®
Modulation 2FSK, GFSK
Frequency 863MHz ~ 876MHz, 902MHz ~ 930MHz
Data Rate 100Kbps
Power - Output 13dBm
Sensitivity -102.6dBm
Serial Interfaces ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART
Antenna Type Antenna Not Included
Utilized IC / Part ZGM130S
Memory Size 512kB Flash, 64kB RAM
Voltage - Supply 1.8V ~ 3.8V
Current - Receiving 9.5mA ~ 9.9mA
Current - Transmitting 13.3mA ~ 40.7mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)

Visão Geral

Description

The ZGM130S037HGN2 is a highly integrated wireless microcontroller designed by Silicon Labs. It is part of the Gecko series, specifically tailored for low-power, high-performance applications in the IoT (Internet of Things) domain. This microcontroller combines a powerful ARM Cortex-M33 processor with robust wireless capabilities, typically supporting protocols like Zigbee, Thread, and Bluetooth.
The ZGM130S037HGN2 is known for its energy efficiency, making it suitable for battery-powered devices. It features a rich set of peripherals, including ADCs, DACs, timers, and communication interfaces like UART, SPI, and I2C, allowing seamless integration with various sensors and external modules.
Additionally, the device includes security features such as Secure Boot and TrustZone, ensuring safe and reliable operation in connected environments. The microcontroller is supported by Silicon Labs' Simplicity Studio, offering developers comprehensive tools and libraries to streamline development, debugging, and deployment processes. It's ideal for smart home, industrial automation, and healthcare applications.

Equivalent

The ZGM130S037HGN2 is a system-on-chip (SoC) typically used for IoT applications. Its equivalents depend on specific requirements like wireless protocols, processing power, and power consumption. Common alternatives include:
1. Silicon Labs EFR32 Series - Similar wireless and microcontroller features.
2. Nordic Semiconductor nRF52 Series - Supports BLE and similar applications.
3. Texas Instruments CC2652R - Suitable for multiprotocol tasks.
4. NXP KW41Z - Combines BLE and IEEE 802.15.4.
Always compare specifications to ensure compatibility with your specific needs.

Features

The ZGM130S037HGN2 is a system-on-chip (SoC) designed for wireless connectivity, typically used in IoT applications. Key features include:
1. Low-Power Operation: Optimized for battery-powered devices with efficient energy consumption.
2. Wireless Protocols: Supports standards like Zigbee, Thread, and Bluetooth Low Energy (BLE) for robust connectivity.
3. Integrated Microcontroller: Features a 32-bit ARM Cortex-M4 processor for efficient processing capabilities.
4. Memory: Comes with integrated Flash and RAM to support application storage and rapid data access.
5. Security: Offers security features such as AES encryption to ensure safe data communication.
6. Peripherals: Includes various interfaces such as USART, I2C, SPI, and GPIO for versatile connectivity options.
7. Operating Range: Supports a wide range of operating temperatures, making it suitable for diverse environments.
8. Development Tools: Compatible with Silicon Labs’ software and tools for easy development and deployment.
These features make the ZGM130S037HGN2 suitable for smart home devices, industrial IoT solutions, and other embedded applications requiring reliable wireless communication.

Pinout

The ZGM130S037HGN2 is a module from Silicon Labs, part of their ZGM130S series which is designed for smart home and IoT applications. This module integrates a wireless SoC and is tailored for Zigbee and Bluetooth low energy connectivity.
1. Pin Count: The ZGM130S037HGN2 has 59 pins.
2. Functions:
- RF Interface: Supports Zigbee and Bluetooth Low Energy for wireless communication.
- GPIO: General-purpose input/output pins for interfacing with other hardware components.
- Analog: Includes analog interfaces like ADCs for sensor readings.
- Communication Interfaces: Contains SPI, I2C, and UART interfaces for communication with other devices.
- Power Management: Pins for managing the power supply, including VDD, ground, and reset.
- Debugging: SWD (Serial Wire Debug) interface for debugging and programming.
This module is highly integrated to facilitate quick deployment in IoT applications requiring robust wireless communication. For detailed specifications and exact pin functions, referring to the official datasheet is recommended.

Manufacturer

The ZGM130S037HGN2 is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in the design and development of semiconductors, software, and solutions for the Internet of Things (IoT), internet infrastructure, industrial automation, consumer electronics, and automotive markets. The company is known for its expertise in wireless communication technologies and microcontroller units (MCUs), providing a range of products that enable connectivity and control in various applications. Silicon Labs focuses on creating energy-efficient devices and systems, catering to both consumer and industrial needs.

Application

The ZGM130S037HGN2 is a wireless microcontroller designed for low-power IoT applications. Its key application areas include smart home devices, such as smart lighting and thermostats, and health monitoring systems where efficient energy use is critical. It is also suited for industrial automation, enabling wireless sensor networks and control systems. Additionally, it can be used in asset tracking, providing reliable connectivity for location and status monitoring. Its low power consumption and integrated security features make it ideal for battery-operated devices while ensuring data protection in connected applications.

Package

The ZGM130S037HGN2 is a microcontroller unit (MCU) with a QFN (Quad Flat No-lead) package type.

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