Part A
10M16DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 4171 PCS
- Package
- BGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256C8G and 10M16DCF484I6G are both Intel MAX 10 FPGA devices sharing the same 16,000 logic elements and core architecture, making them functionally related. However, they differ in package type, operating temperature grade, and speed grade, so a direct drop-in replacement is not possible without design and thermal validation. The 10M16DAF256C8G is a commercial-grade device in a 256-ball FineLine BGA package, while the 10M16DCF484I6G is an industrial-grade device in a 484-ball FineLine BGA package. Designers must verify pinout, thermal performance, and timing closure before substituting one for the other.
Logic Density
High match
Package Type
Validation required
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M16DCF484I6G
Intel
- Lifecycle
- Active
- Stock
- 2759 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256C8G | 10M16DCF484I6G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, which supports similar design flows and IP reuse. |
| Logic Elements (LEs) | 16,000 | 16,000 | Matching logic capacity ensures equivalent programmable logic resources for the same design. |
| Package | 256-pin FBGA | 484-pin FBGA | Different package footprints and pin counts affect PCB layout, routing, and mechanical compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Industrial temperature support allows operation in harsher environments where commercial parts may not be reliable. |
| Speed Grade | 8 | 6 | A faster speed grade can support higher clock frequencies and tighter timing closure. |
| Supply Voltage | 1.2 V core | 1.2 V core | Identical core voltage simplifies power supply design and ensures electrical compatibility. |
| User I/O Count | 178 | 360 | Different I/O counts affect the number of peripherals and interfaces that can be connected. |
| Embedded Memory | 588 kbits | 588 kbits | Equal embedded memory supports similar on-chip buffering and data storage requirements. |
| Configuration Flash | Yes (integrated) | Yes (integrated) | Integrated configuration flash eliminates the need for external configuration memory. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256C8G | 10M16DCF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256C8G and the 10M16DCF484I6G?
The 10M16DAF256C8G is a MAX 10 FPGA in a 256-pin FineLine BGA package with a commercial temperature grade (0°C to 85°C junction) and speed grade 8. The 10M16DCF484I6G is a MAX 10 FPGA in a 484-pin FineLine BGA package with an industrial temperature grade (-40°C to 100°C junction) and speed grade 6. Both devices feature 16,000 logic elements, but they differ in package, temperature range, and speed grade.
Do the 10M16DAF256C8G and 10M16DCF484I6G have the same logic density?
Yes. Both devices are part of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with the same embedded memory and DSP resources as defined by the MAX 10 10M16 device specification.
Can the 10M16DAF256C8G be used as a drop-in replacement for the 10M16DCF484I6G?
No. The two devices have different package footprints (256-pin vs. 484-pin FineLine BGA), different temperature grades (commercial vs. industrial), and different speed grades (8 vs. 6). A direct drop-in replacement is not possible without verifying pinout, thermal requirements, and timing closure against the target design.
Which device supports a wider operating temperature range?
The 10M16DCF484I6G supports the industrial temperature range, typically specified as -40°C to 100°C junction temperature (TJ). The 10M16DAF256C8G supports the commercial temperature range, typically 0°C to 85°C TJ. The industrial-grade device is suitable for harsher environments.
What is the difference in speed grade between the 10M16DAF256C8G and the 10M16DCF484I6G?
The 10M16DAF256C8G has a speed grade of 8, while the 10M16DCF484I6G has a speed grade of 6. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10M16DCF484I6G offers higher performance than the 10M16DAF256C8G.
Are the I/O pin counts the same for both devices?
No. The 10M16DAF256C8G in the 256-pin FineLine BGA package provides a different number of user I/O pins than the 10M16DCF484I6G in the 484-pin FineLine BGA package. The exact I/O counts are specified in the Intel MAX 10 device pin-out files and should be verified from the official datasheet before design.
Which device is better suited for a cost-sensitive commercial application?
The 10M16DAF256C8G is generally more suitable for cost-sensitive commercial applications because it uses a smaller 256-pin package and a commercial temperature grade, which typically reduces unit cost compared to the larger 484-pin industrial-grade 10M16DCF484I6G.
Do both devices support the same configuration methods?
Yes. Both the 10M16DAF256C8G and the 10M16DCF484I6G are Intel MAX 10 FPGAs and support the same configuration options, including internal configuration flash, dual configuration images, and external configuration via JTAG or active serial modes, as defined by the MAX 10 family documentation.