Part A
10M16SAU169I7G
Intel
- Lifecycle
- Active
- Stock
- 6216 PCS
- Package
- BGA-169
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256C8G and 10M16SAU169I7G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and 10M16 density class, making them functionally related candidates. However, they differ in package type, operating temperature grade, and integrated feature set, so a direct drop-in replacement is not possible without design and validation work. The 10M16DAF256C8G offers a larger 256-ball FBGA package with commercial temperature range and integrated analog-to-digital converter capability, while the 10M16SAU169I7G uses a compact 169-ball UBGA package with industrial temperature range and no ADC block. Engineers should verify pinout, thermal requirements, and feature compatibility before substituting one for the other in any design.
Logic Density
High match
Package Type
Validation required
Operating Temperature
Not compatible
Integrated ADC Feature
Not compatible
Parts at a glance
Part B
10M16DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 4171 PCS
- Package
- BGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256C8G | 10M16SAU169I7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which supports functional substitutability at the architecture level. |
| Logic Elements (LEs) | 16,000 | 16,000 | Equal logic capacity means both can implement the same logic designs without resource constraints. |
| Package | 256-pin FBGA | 169-pin UBGA | Different packages require different PCB footprints and cannot be used as drop-in replacements on the same board. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Industrial-grade parts support harsher environments, while commercial parts are limited to benign conditions. |
| Speed Grade | 8 (Fastest) | 7 (Fast) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Embedded Memory | Up to 5,888 Kbits | Up to 5,888 Kbits | Identical embedded memory capacity supports the same on-chip buffering and storage requirements. |
| User I/O Pins | 178 | 130 | Different I/O counts affect the number of peripherals and interfaces that can be connected simultaneously. |
| Analog-to-Digital Converter (ADC) | Yes (12-bit, 1 MSPS) | Yes (12-bit, 1 MSPS) | Both include an integrated ADC, enabling analog signal monitoring without external components. |
| Configuration Flash Memory | Yes (Internal) | Yes (Internal) | Internal configuration flash allows single-chip operation and instant-on capability for both devices. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Matching core voltage simplifies power supply design and ensures electrical compatibility. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SAU169I7G | 10M16DAF256C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 178 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256C8G and the 10M16SAU169I7G?
The 10M16DAF256C8G is an Intel (Altera) MAX 10 FPGA with 16,000 logic elements, a 256-pin FineLine BGA package, commercial temperature grade (0°C to 85°C junction), and integrated analog-to-digital converter (ADC) blocks. The 10M16SAU169I7G is also a MAX 10 FPGA with 16,000 logic elements but uses a 169-pin Ultra FineLine BGA package, industrial temperature grade (-40°C to 100°C junction), and single-supply (SA) configuration without the dual-supply ADC feature set. The primary differences are package type, temperature grade, and the presence or absence of integrated ADC capabilities.
Are the 10M16DAF256C8G and 10M16SAU169I7G pin-to-pin compatible?
No. The 10M16DAF256C8G uses a 256-ball FineLine BGA (FBGA) package, while the 10M16SAU169I7G uses a 169-ball Ultra FineLine BGA (UBGA) package. These packages have different ball counts, ball pitches, and physical dimensions, so they are not pin-to-pin or footprint compatible. A PCB redesign would be required to interchange them.
Do both devices support the same configuration methods?
Both devices are Intel MAX 10 FPGAs and support configuration via internal configuration flash, JTAG, and external configuration sources as defined in the MAX 10 device family documentation. However, the 10M16DAF256C8G includes dual configuration image support and analog features associated with the DAF variant, while the 10M16SAU169I7G is a single-supply variant. Designers should verify the specific configuration scheme in the respective device datasheets and pin-out files.
Can the 10M16SAU169I7G operate at the same temperature range as the 10M16DAF256C8G?
No. The 10M16DAF256C8G is specified for commercial temperature operation with a junction temperature range of 0°C to 85°C. The 10M16SAU169I7G is specified for industrial temperature operation with a junction temperature range of -40°C to 100°C. The industrial-grade device can operate over a wider temperature range, but the commercial-grade device should not be used outside its rated range.
Do both devices offer the same number of user I/O pins?
No. The 10M16DAF256C8G in the 256-pin FBGA package provides up to 178 user I/O pins, while the 10M16SAU169I7G in the 169-pin UBGA package provides up to 130 user I/O pins. The exact available I/O count depends on the configuration of dedicated pins and power pins. Designers should consult the respective device pin-out files for precise I/O availability.
Which device is better suited for space-constrained industrial applications?
The 10M16SAU169I7G is generally better suited for space-constrained industrial applications because its 169-ball Ultra FineLine BGA package occupies less PCB area than the 256-ball FineLine BGA package of the 10M16DAF256C8G, and its industrial temperature grade supports -40°C to 100°C junction operation. However, the trade-off is fewer user I/O pins and the absence of the integrated ADC blocks found in the DAF variant.
Are both devices part of the same Intel MAX 10 FPGA family?
Yes. Both the 10M16DAF256C8G and the 10M16SAU169I7G are members of the Intel MAX 10 FPGA family, which features 16,000 logic elements, non-volatile integrated configuration flash, and instant-on capability. They share the same FPGA fabric architecture and development tool support, but differ in package, temperature grade, supply configuration, and integrated analog feature set.