Part A
10M50DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 2856 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M50DAF256C6G is a functionally compatible alternative to the 10M50DAF256C8G, sharing identical logic density, package, and I/O configuration, with the primary distinction being a faster speed grade that may require timing closure review.
Logic Density
High match
Package Type
High match
I/O Count
High match
Speed Grade
Validation required
Parts at a glance
Part B
10M50DAF256C6G
Intel
- Lifecycle
- Active
- Stock
- 7922 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256C8G | 10M50DAF256C6G | Why it matters |
|---|---|---|---|
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster device performance; grade 6 offers higher maximum operating frequency than grade 8, affecting timing closure and achievable clock rates. |
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, ensuring identical architecture, tool support, and IP compatibility. |
| Logic Elements (LEs) | 50,000 | 50,000 | Matching logic capacity means both devices can implement designs of the same complexity without resource constraints. |
| Package | 256-pin FBGA | 256-pin FBGA | Identical package ensures the same PCB footprint, pinout, and assembly process, allowing drop-in replacement. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Same temperature range means both parts are suitable for the same commercial-grade environmental conditions. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage ensures the same power supply design and decoupling requirements. |
| Embedded Memory | 1,638 Kbit | 1,638 Kbit | Equal embedded memory capacity supports the same on-chip buffering and storage needs. |
| User I/O Pins | 178 | 178 | Same I/O count allows identical interface connections and peripheral support. |
| Configuration Flash | Integrated | Integrated | Both devices feature integrated configuration flash, enabling single-chip operation without external configuration memory. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256C8G | 10M50DAF256C6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 10M50DAF256C8G and 10M50DAF256C6G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-pin FineLine BGA (FBGA) package. They share the 10M50 density grade, which provides 50,000 logic elements (LEs), and both are specified for commercial temperature operation. The suffix difference (C8G vs C6G) denotes the speed grade: C8 is a slower speed grade and C6 is a faster speed grade within the MAX 10 family.
What is the difference between the C8 and C6 speed grades?
The C8 and C6 suffixes indicate different speed grades of the same MAX 10 10M50 device. C6 is the faster speed grade and C8 is the slower speed grade. The speed grade affects timing performance, including maximum operating frequency and propagation delays, but does not change the logic density, package, or pinout. Exact timing specifications must be taken from the respective Intel MAX 10 device datasheet and timing model for each speed grade.
Are the 10M50DAF256C8G and 10M50DAF256C6G pin-compatible?
Yes. Both devices use the same 256-pin FineLine BGA package with the same 10M50 die and the same pinout. The only difference is the speed grade, so the package footprint, pin assignments, and I/O bank structure are identical. This means a board designed for one speed grade can generally accept the other from a pinout and footprint perspective.
Can the 10M50DAF256C8G and 10M50DAF256C6G be used interchangeably in a design?
They are not automatically interchangeable in every design. Because the C6 speed grade offers faster timing than the C8 speed grade, a design that meets timing with the C8 device will typically also meet timing with the C6 device, but the reverse is not guaranteed. A design closed with the C6 device may fail timing if populated with the C8 device. Timing analysis must be re-run for the specific speed grade used, and any design constraints or PLL settings must be validated against the target device.
Do both devices support the same configuration and feature set?
Yes. Both the 10M50DAF256C8G and 10M50DAF256C6G are MAX 10 10M50 devices in the same package and therefore support the same feature set, including internal configuration flash, analog-to-digital converter (ADC) blocks, and the same number of user I/O pins and PLLs. The feature set is determined by the device family, density, and package, not by the speed grade suffix.
Which speed grade should be selected for a new design?
The speed grade should be selected based on the timing requirements of the design. If the design can close timing with the C8 speed grade, the C8 device may be sufficient and potentially more cost-effective. If higher performance is required, the C6 speed grade provides faster timing. The selection must be confirmed by running static timing analysis with the appropriate Intel MAX 10 timing model for the chosen speed grade.
Are the 10M50DAF256C8G and 10M50DAF256C6G available in the same temperature grade?
Both part numbers use the commercial temperature grade, indicated by the "C" in the suffix. The 10M50DAF256C8G and 10M50DAF256C6G are both commercial-grade devices. Industrial or automotive temperature grades would be denoted by different suffix letters and are separate orderable part numbers.
What documentation should be consulted for timing and ordering information?
The Intel MAX 10 FPGA Device Datasheet, the MAX 10 FPGA Device Overview, and the respective device pin-out files should be consulted for verified timing, package, and ordering information. Speed grade specifications, including maximum frequencies and delays, are published in the device datasheet and timing model files. Ordering codes and available speed grade and temperature combinations are listed in the Intel MAX 10 ordering information section.