Part A
10M50DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 2856 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M50DAF256C8G and 10M50DCF256I6G are both Intel MAX 10 FPGA devices sharing the same 50,000 logic element density and 256-ball FineLine BGA footprint, making them functionally interchangeable at the board level. The primary distinction lies in their speed grade and operating temperature range, which must be validated against the target application's timing and environmental requirements before committing to a drop-in substitution.
Logic Density
High match
Package Type
High match
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10M50DCF256I6G
Intel
- Lifecycle
- Active
- Stock
- 3446 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256C8G | 10M50DCF256I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 50,000 | 50,000 | Matching logic density ensures equivalent programmable logic capacity for the target design. |
| Package | 256-pin FBGA | 256-pin FBGA | Identical package and pin count allow the same PCB footprint and board layout to be reused. |
| Operating Temperature Range | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | The industrial-grade version supports harsher environments, so the commercial part cannot directly replace it in wide-temperature applications. |
| Speed Grade | 8 (Fastest) | 6 (Slower) | Different speed grades affect maximum operating frequency and timing closure, impacting whether the design meets its performance targets. |
| Embedded Memory (M9K blocks) | 1,638 Kbits | 1,638 Kbits | Equal embedded memory capacity ensures the same on-chip storage is available for buffering and data handling. |
| User I/O Pins | 178 | 178 | Matching I/O count preserves the number of external interfaces the device can support. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage means the same power supply design and decoupling network can be used. |
| Configuration Method | Internal configuration flash | Internal configuration flash | Both are instant-on, single-chip devices with on-die configuration memory, simplifying system boot and board design. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256C8G | 10M50DCF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M50DAF256C8G and the 10M50DCF256I6G?
The primary differences are speed grade, temperature grade, and package option. The 10M50DAF256C8G is a commercial-grade device (0°C to 85°C junction temperature) with an 8 speed grade and a 256-pin FineLine BGA package with lead-free (Pb-free) construction. The 10M50DCF256I6G is an industrial-grade device (-40°C to 100°C junction temperature) with a 6 speed grade and a 256-pin FineLine BGA package with lead-free construction. Both are based on the Intel MAX 10 FPGA family with 50,000 logic elements.
Are the 10M50DAF256C8G and 10M50DCF256I6G pin-to-pin compatible?
Yes. Both devices use the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out specifications. The package code "F256" is common to both ordering codes, so the physical footprint and pin assignments are the same. However, designers must still verify that the different speed and temperature grades meet the timing and environmental requirements of the target application.
Can the 10M50DAF256C8G be used as a drop-in replacement for the 10M50DCF256I6G?
Not unconditionally. Although both share the same 256-pin FBGA package and 50,000 LE MAX 10 architecture, the 10M50DAF256C8G is rated for commercial temperature range (0°C to 85°C) and speed grade 8, while the 10M50DCF256I6G is rated for industrial temperature range (-40°C to 100°C) and speed grade 6. A drop-in replacement is only valid if the target design operates within the commercial temperature range and the slower speed grade 8 timing still meets all setup, hold, and clock-to-out requirements. Intel datasheets and timing models must be consulted before substitution.
What is the logic capacity of the 10M50DAF256C8G and 10M50DCF256I6G?
Both devices are members of the Intel MAX 10 FPGA family and provide 50,000 logic elements (LEs). They also include the same embedded memory blocks, DSP blocks, and analog-to-digital converter (ADC) blocks as defined in the MAX 10 device family datasheet. The logic capacity is identical because the "10M50" prefix denotes the 50K LE density in both ordering codes.
What are the operating temperature ranges for these two devices?
The 10M50DAF256C8G is specified for commercial operation with a junction temperature range of 0°C to 85°C. The 10M50DCF256I6G is specified for industrial operation with a junction temperature range of -40°C to 100°C. These ranges are defined in the Intel MAX 10 device datasheet and ordering information. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled environments.
What do the speed grades "8" and "6" mean in these ordering codes?
In Intel FPGA ordering codes, the speed grade indicates the relative performance of the device. A lower number generally corresponds to a faster speed grade. The 10M50DAF256C8G has speed grade 8, and the 10M50DCF256I6G has speed grade 6. Speed grade 6 is faster than speed grade 8, meaning the industrial-grade device can achieve higher maximum operating frequencies and tighter timing margins. Exact timing specifications are provided in the Intel MAX 10 device datasheet and timing model.
Do both devices support the same configuration and packaging options?
Both devices use the 256-pin FineLine BGA package with lead-free (Pb-free) construction, indicated by the "G" suffix in the ordering code. They support the same configuration schemes available in the MAX 10 family, including internal configuration flash, JTAG, and external configuration via supported interfaces. However, the specific configuration speed and timing may differ due to the different speed grades. Designers should refer to the Intel MAX 10 configuration user guide for details.
Which device is more suitable for industrial or automotive applications?
The 10M50DCF256I6G is more suitable for industrial applications because it is rated for the industrial temperature range of -40°C to 100°C junction temperature. The 10M50DAF256C8G is rated only for the commercial temperature range of 0°C to 85°C and is therefore not recommended for industrial environments unless the system maintains the device within the commercial range. Neither device is automatically qualified for automotive applications unless explicitly stated in the manufacturer's qualification documentation.
Where can I find verified technical data for these devices?
Verified technical data is available from Intel (now Altera) official documentation, including the MAX 10 FPGA device datasheet, MAX 10 device pin-out files, and ordering information guides. Authorized distributors such as DigiKey, Mouser, TTI, and Future Electronics also publish manufacturer-sourced parametric data. Always cross-check distributor data against the latest official Intel/Altera datasheet and errata before finalizing a design.