Part A
5CEFA9F27I7N
Intel
- Lifecycle
- Active
- Stock
- 7586 PCS
- Package
- BGA-672
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEFA9F27I7N and 5CEFA4F23C7N are both Intel Cyclone V F-Series FPGAs sharing the same core architecture, logic cell type, and transceiver technology, making them functionally related candidates. However, they differ significantly in logic density, package footprint, and operating temperature grade, so the 5CEFA4F23C7N cannot directly replace the 5CEFA9F27I7N without design validation. The 5CEFA4F23C7N offers lower logic capacity and a smaller package, while the 5CEFA9F27I7N provides higher density and industrial temperature support. Replacement is feasible only when the reduced logic resources and commercial temperature range are acceptable for the target application.
Logic Density
Validation required
Package Type
Validation required
Operating Temperature
Not compatible
Core Architecture
High match
Parts at a glance
Part B
5CEFA4F23C7N
Intel
- Lifecycle
- Active
- Stock
- 9311 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA4F23C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 49000 | Logic element count determines the maximum complexity of digital designs the FPGA can implement; a large difference means the two devices are not functionally interchangeable for complex designs. |
| Total RAM Bits | 14251008 | 3080192 | Embedded memory capacity limits buffering, FIFO depth, and data storage within the FPGA; a smaller device may not fit designs requiring large on-chip memory. |
| Number of I/Os | 336 | 224 | I/O count determines how many external signals and peripherals can be interfaced; fewer I/Os can restrict system connectivity and pinout compatibility. |
| Package / Case | 672-BBGA, FCBGA | 484-BGA, FCBGA | Package footprint and ball count must match the PCB layout; different packages are not drop-in compatible and require board redesign. |
| Operating Temperature Range | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | Industrial versus commercial temperature grades affect reliability in harsh environments; substituting one for the other may violate application thermal requirements. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must match the board power design; identical values indicate power rail compatibility between the two devices. |
| Number of LABs/CLBs | 113560 | 18480 | Logic array blocks define the granularity of programmable logic resources; a large mismatch limits design portability between the two parts. |
| Mounting Type | Surface Mount | Surface Mount | Mounting type must match assembly processes; identical surface-mount types indicate compatible PCB assembly methods. |
| Series | Cyclone V E | Cyclone V E | Same device family indicates shared architecture, toolchain, and IP compatibility, which supports design migration between the two parts. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA4F23C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 18480 |
| Number of Logic Elements/Cells | 301000 | 49000 |
| Total RAM Bits | 14251008 | 3464192 |
| Number of I/O | 336 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA4F23C7N?
The 5CEFA9F27I7N is a larger Cyclone V FPGA in the F27 package with higher logic density, more transceivers, and an industrial temperature grade (I7), while the 5CEFA4F23C7N is a smaller Cyclone V device in the F23 package with lower logic density, fewer high-speed interfaces, and a commercial temperature grade (C7).
Are the 5CEFA9F27I7N and 5CEFA4F23C7N pin-to-pin compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA package (F27), while the 5CEFA4F23C7N uses a 484-pin FBGA package (F23). The different package sizes and pin counts prevent direct pin-to-pin compatibility.
Can the 5CEFA4F23C7N be used as a direct drop-in replacement for the 5CEFA9F27I7N?
No. The two devices differ in package footprint, logic capacity, transceiver count, and temperature grade. A direct drop-in replacement is not possible without redesigning the PCB and revalidating the application.
What temperature grades do the 5CEFA9F27I7N and 5CEFA4F23C7N support?
The 5CEFA9F27I7N is rated for the industrial temperature range (I7 grade), while the 5CEFA4F23C7N is rated for the commercial temperature range (C7 grade). The industrial grade supports a wider ambient temperature range than the commercial grade.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEFA9F27I7N and the 5CEFA4F23C7N are members of the Intel (formerly Altera) Cyclone V FPGA family, specifically the E variant with integrated transceivers.
Which device offers higher logic density, the 5CEFA9F27I7N or the 5CEFA4F23C7N?
The 5CEFA9F27I7N offers higher logic density. The "A9" designation indicates a larger Cyclone V E device with more adaptive logic modules (ALMs) and embedded memory than the "A4" designation used in the 5CEFA4F23C7N.
Are the transceiver capabilities of the 5CEFA9F27I7N and 5CEFA4F23C7N the same?
No. The 5CEFA9F27I7N provides more high-speed transceiver channels than the 5CEFA4F23C7N due to its larger device density and larger package. The exact transceiver count differs between the two devices and should be confirmed in the respective Cyclone V device datasheets.
What package types are used by the 5CEFA9F27I7N and 5CEFA4F23C7N?
Both devices use FBGA packages, but with different ball counts and body sizes. The 5CEFA9F27I7N uses the F27 package (672 pins), and the 5CEFA4F23C7N uses the F23 package (484 pins).