AS4C512M16D3L-12BIN

The AS4C512M16D3L-12BIN is a 512Mb Double Data Rate 3 Synchronous DRAM (DDR3 SDRAM) designed for high-performance applications. It features a 16-bit data bus and operates at a frequency of 1600 MHz, providing high-speed data transfer rates. The "-12BIN" in its designation signifies a specific speed grade and temperature rating, ensuring optimal performance in different environments.
This memory module supports data rates of up to 12.8 GB/s, making it suitable for use in computers, servers, and other electronic devices that require efficient data processing and quick access speeds. It operates at a low voltage of 1.35V, contributing to reduced power consumption while maintaining performance.
The AS4C512M16D3L-12BIN also includes features like on-die termination (ODT) and dynamic on-chip calibration (DOC), which help enhance signal integrity and reliability. These attributes make it an ideal choice for applications requiring robust memory performance in both consumer and industrial electronics.

The AS4C512M16D3L-12BIN is a DDR3L SDRAM chip with specifications of 8 GB capacity, 1600 MT/s speed, and 1.35V/1.5V voltage operation. Equivalent products include:
1. Micron MT41K512M16HA-125
2. Samsung K4B4G1646E-BYK0
3. SK Hynix H5TC4G63AFR-PBA
4. Kingston D2516EC4BXGJD
These alternatives match similar specifications in terms of capacity, speed, and voltage, ensuring compatibility for similar applications. Always verify compatibility with your specific system requirements.

The AS4C512M16D3L-12BIN is a 512Mb DDR3 SDRAM component with specific features tailored for high-performance memory applications. It offers a data bus width of 16 bits and operates with a clock speed of 800 MHz (DDR3-1600), providing efficient data transfer rates. The "-12BIN" in its designation indicates a CAS latency of 12. This DDR3 SDRAM operates at a low voltage of 1.35V, which helps in reducing power consumption compared to standard 1.5V DDR3 modules, making it suitable for energy-efficient computing. It supports various memory configurations and is designed for use in a wide range of applications including computing, networking, and consumer electronics. The AS4C512M16D3L-12BIN is known for its reliability and performance, adhering to JEDEC standards, and is available in a compact, industry-standard FBGA package, making it easy to integrate into existing systems.

The AS4C512M16D3L-12BIN is a DDR3 SDRAM chip produced by Alliance Memory. It typically comes in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package. The "512M16" indicates that the chip has a configuration of 512 Meg x 16, meaning it has a total memory density of 8 Gigabits (1 Gigabyte).
In terms of function, this DDR3 SDRAM chip is used to provide high-speed data storage and retrieval in a wide range of applications, such as computing, networking, and consumer electronics. It supports data rates up to 1600 Mbps and operates at a voltage of 1.35V, making it suitable for energy-efficient applications. The low power consumption and high bandwidth make it ideal for systems requiring efficient memory performance.
Overall, the AS4C512M16D3L-12BIN is designed to deliver reliable and fast memory access for systems that demand high performance.

The AS4C512M16D3L-12BIN is manufactured by Alliance Memory, Inc. Alliance Memory is a company that specializes in providing legacy memory products. They focus on offering a wide range of DRAM and SRAM products, including synchronous DRAM (SDRAM), double data rate (DDR), low power DRAM, and other memory types. The company is known for providing solutions that support older memory technologies, catering to customers who need to maintain or upgrade systems that still use these legacy components. Alliance Memory's product offerings are beneficial for industries where long-term availability and reliability of specific memory types are crucial, such as telecommunications, industrial, medical, and automotive sectors.

The AS4C512M16D3L-12BIN is a 512Mb DDR3 SDRAM, commonly used in various applications that require efficient memory solutions. Its primary application areas include:
1. Consumer Electronics: Used in devices like TVs and gaming consoles for improved performance.
2. Networking: Employed in routers and switches to enhance data handling capabilities.
3. Industrial Automation: Supports control systems and robotics for better data processing.
4. Computing: Integrated into laptops and desktops for faster multitasking.
5. Telecommunications: Utilized in equipment for faster data transmission and processing.
6. Automotive Systems: Aids in infotainment systems and advanced driver-assistance systems (ADAS).
These applications benefit from its high-speed data transfer and low power consumption.

The AS4C512M16D3L-12BIN is a DDR3L SDRAM module, typically available in a standard JEDEC-compliant package such as FBGA (Fine-Pitch Ball Grid Array). This packaging is common for memory modules and is designed to provide high performance and reliability in electronic devices.