K4F6E3S4HM-THCL

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K4F6E3S4HM-THCL

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16Gbit x32 LPDDR4 FBGA-200 Memory (ICs) RoHS

  • FabricanteSamsung

  • Peça do Fabricante #K4F6E3S4HM-THCL

  • Em Estoque8886

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Especificações

Atributo Valor
Packaging FBGA-200
Interface LPDDR4
Memory Format x32
Memory Size 16Gbit
Operating Temperature -40℃~+105℃
Voltage - Supply 1.8V;1.1V

Visão Geral

Description

K4F6E3S4HM-THCL appears to be a code or model number, possibly related to a specific product, component, or system. Without additional context, it's challenging to provide detailed information. However, such codes are often used in industries like electronics, manufacturing, or technology to identify specific items, configurations, or versions.
If K4F6E3S4HM-THCL is a part of a technical system, an introduction would typically cover its primary function, specifications, and applications. For instance, if it's a semiconductor component, the introduction might include its role in electronic circuits, its performance characteristics (like speed, power consumption, or capacity), and compatible systems or technologies.
For precise details, you would need to consult the product's datasheet, manual, or manufacturer's documentation, which would provide comprehensive information about its features, intended use, and any installation or operational guidelines. Always ensure you're referencing the right documentation for accurate and relevant details.

Equivalent

The K4F6E3S4HM-THCL is a Samsung LPDDR4 memory chip. Equivalent products would be other LPDDR4 memory chips with similar specifications from different manufacturers, such as:
1. Micron MT53B512M32D2NP-062 WT:B (LPDDR4)
2. SK Hynix H9HCNNNBUMLXR-NEE (LPDDR4)
3. Kingston’s LPDDR4 options with comparable specs
Ensure to compare parameters like capacity, data rate, and form factor for precise equivalency.

Features

The K4F6E3S4HM-THCL is a high-performance LPDDR4 DRAM chip manufactured by Samsung. Key features include:
1. Capacity: Typically available in configurations like 8GB, catering to high-demand applications.

2. Speed: Offers data transfer rates up to 4266 MT/s, providing fast memory access and improved system performance.
3. Power Efficiency: Utilizes low power technology to extend battery life in portable devices, thanks to its 1.1V core voltage.
4. Architecture: Based on a 16-bank design with a 3D packaging structure to maximize space efficiency.
5. Reliability: Includes error correction features to enhance data integrity and reliability.
6. Compatibility: Designed for use in mobile devices, laptops, and other compact, high-performance electronics.
7. Temperature Range: Can operate across a wide temperature range, making it suitable for various environmental conditions.
These features make the K4F6E3S4HM-THCL ideal for delivering high-speed, efficient memory performance in modern computing devices.

Pinout

The K4F6E3S4HM-THCL is a mobile DRAM LPDDR3 memory chip manufactured by Samsung. It typically comes in a package with a ball grid array (BGA) format, specifically FBGA, which generally includes a large number of pin connections. However, the exact pin count for this specific model is not generally disclosed in detail in publicly available datasheets or specifications by Samsung.
As a part of the LPDDR3 (Low Power Double Data Rate 3) family, its primary function is to provide high-speed, low-power memory for mobile and embedded devices. LPDDR3 memory is often used in smartphones, tablets, and other compact electronic devices where power efficiency is crucial. The K4F6E3S4HM-THCL is designed to offer improved performance and energy efficiency over its predecessors, suitable for a range of applications where low power consumption and high performance are necessary. For detailed technical specifications, including exact pin count and layout, consulting the manufacturer's datasheet or technical resources would be necessary.

Manufacturer

The K4F6E3S4HM-THCL is a DRAM memory component manufactured by Samsung Electronics. Samsung Electronics is a multinational conglomerate based in South Korea, and it is one of the largest technology companies in the world. It operates in various sectors, including consumer electronics, semiconductors, telecommunications, and digital media. Samsung is particularly known for its extensive product line, which includes smartphones, tablets, televisions, home appliances, and memory products such as DRAM and NAND flash. The company has a significant presence in the semiconductor industry, where it is a leading producer of memory chips and other components.

Application

The product code "K4F6E3S4HM-THCL" appears to represent a specific type of electronic component or semiconductor device, likely related to memory chips or flash storage, based on common naming conventions. Its application areas would typically include consumer electronics, mobile devices, computers, and industrial systems, where reliable and efficient data storage solutions are required. It could also be used in automotive electronics, IoT devices, and other applications requiring high-performance memory solutions. For precise application areas, consulting the manufacturer's datasheet or product specification document is recommended.

Package

The package type for K4F6E3S4HM-THCL, which is a Samsung LPDDR5 DRAM chip, is typically a BGA (Ball Grid Array) package. This type of packaging involves solder balls arranged in a grid pattern on the underside of the chip, allowing for robust connections to a circuit board.

Frequently Asked Questions


Q: What is the memory density and organization of the K4F6E3S4HM-THCL?
A: It has a 16Gbit capacity with a x32 memory format, suitable for high-bandwidth LPDDR4 applications.


Q: What is the operating temperature range for this Samsung LPDDR4 chip?
A: The device is rated for -40°C to +105°C, making it suitable for industrial and automotive environments.


Q: What package type does the K4F6E3S4HM-THCL use?
A: It comes in an FBGA-200 package, compliant with JEDEC LPDDR4 standards for space-constrained designs.


Q: What voltage supplies are required for this memory component?
A: It requires dual supplies: 1.8V for I/O and 1.1V for core operation, typical for LPDDR4 devices.


Q: Is this memory compatible with high-speed mobile or embedded systems?
A: Yes, its LPDDR4 interface and x32 bus provide high data rates ideal for mobile, IoT, and edge computing.


Q: Can this component operate reliably in thermal stress conditions?
A: With a -40°C to +105°C range and FBGA package, it supports extended thermal endurance and robust solder joint reliability.


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