KLM8G1GEUF-B04Q

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KLM8G1GEUF-B04Q

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8GB Memory (ICs) RoHS

  • FabricanteSamsung

  • Peça do Fabricante #KLM8G1GEUF-B04Q

  • Em Estoque7990

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Especificações

Atributo Valor
Memory Size 8GB
NAND Operating Voltage (VCCF) 1.8V;3.3V
Operating Temperature -40℃~+105℃

Visão Geral

Description

The KLM8G1GEUF-B04Q is a 8Gb (1GB) DDR4 SDRAM chip from Samsung, designed for high-performance computing and embedded applications. Key features include:
- Capacity: 8Gb (1GB)
- Speed: 3200 Mbps (DDR4-3200)
- Voltage: 1.2V (low power)
- Organization: x8 (8-bit prefetch)
- Package: FBGA (Fine-pitch Ball Grid Array)
- Applications: Laptops, servers, IoT, and industrial systems
It supports auto-refresh, self-refresh, and on-die termination (ODT) for signal integrity. The B04Q suffix indicates a specific revision or variant.
For exact specs, refer to Samsung’s official datasheet.

Equivalent

The KLM8G1GEUF-B04Q is a 8GB eMMC chip by Samsung. Equivalent products include:
- KLM8G1GETF-B041 (Samsung, same specs, different package)
- THGBMAG8B4JBAIR (Toshiba, 8GB eMMC)
- MTFC8GAKAJCN-4M IT (Micron, 8GB eMMC)
- SDIN8DE4-8G (Western Digital/SanDisk, 8GB eMMC)
Check pin compatibility and voltage requirements before substitution.

Features

The KLM8G1GEUF-B04Q is a 8GB (1Gx8) DDR3L SDRAM module with the following key features:
- Capacity: 8GB (1G x 8)
- Type: DDR3L (Low Voltage, 1.35V)
- Speed: 1600MHz (PC3L-12800)
- CAS Latency: 11 cycles
- Voltage: 1.35V (compatible with 1.5V)
- Organization: 2048M x 8 (single rank)
- Form Factor: 260-pin SODIMM
- Operating Temp: Commercial (0°C to 85°C)
- ECC: No
- Density per Chip: 8Gb (1GB)
Designed for laptops and small-form-factor systems, it offers low power consumption and reliable performance.

Manufacturer

The KLM8G1GEUF-B04Q is a NAND flash memory chip manufactured by SK Hynix, a South Korean semiconductor company. SK Hynix is a major global producer of memory chips, specializing in DRAM, NAND flash, and other storage solutions. It is one of the largest memory suppliers worldwide, competing with companies like Samsung and Micron. The company serves industries such as consumer electronics, data centers, and automotive technology.

Application

The KLM8G1GEUF-B04Q is a high-performance NAND flash memory chip primarily used in:
1. Consumer Electronics – Smartphones, tablets, digital cameras.
2. Storage Devices – SSDs, USB drives, memory cards.
3. Embedded Systems – IoT devices, industrial controllers.
4. Automotive – Infotainment, ADAS, telematics.
5. Networking – Routers, switches, servers for data buffering.
Its reliability and speed make it suitable for applications requiring fast, non-volatile storage.

Package

The KLM8G1GEUF-B04Q is a 8Gb (1GB) LPDDR4 SDRAM chip from Samsung. It comes in a 153-ball FBGA (Fine-pitch Ball Grid Array) package, designed for low-power, high-performance applications like mobile devices. The package dimensions are 10.0mm x 14.0mm x 1.0mm. It operates at 1.8V/1.1V and supports 3200Mbps/pin data rates.

Frequently Asked Questions


Q: What is the memory capacity of the KLM8G1GEUF-B04Q?
A: This eMMC features an 8GB NAND flash memory density, suitable for embedded storage applications.


Q: What are the supported NAND operating voltages?
A: It supports both 1.8V (VCCF) and 3.3V (VCCF) NAND core voltages for flexible system integration.


Q: Can this component withstand industrial temperature ranges?
A: Yes, its operating temperature range is -40°C to +105°C, making it ideal for harsh environments.


Q: Is this a Samsung eMMC device?
A: Yes, manufactured by Samsung, it is an embedded multi-media card (eMMC) for reliable data storage.


Q: What is the typical application scenario for this eMMC?
A: It is commonly used in industrial IoT, automotive infotainment, and embedded systems requiring robust endurance.


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