Imagens apenas para referência
MT29F512G08AUCBBH8-6IT:B
+Lista de MateriaisIC FLASH 512GBIT PAR 152LBGA
-
FabricanteMicron Technology Inc.
-
Peça do Fabricante #MT29F512G08AUCBBH8-6IT:B
-
Pacote LBGA-152
-
Em Estoque4857
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 512Gb (64G x 8) |
| Memory Interface | Parallel |
| Clock Frequency | 166 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Visão Geral
Description
Operating with a voltage range typically around 3.3V, this NAND Flash chip is designed for use in a variety of devices, including solid-state drives (SSDs), memory cards, and other embedded systems, where reliable data storage is essential. It supports a high-speed data transfer rate, enhancing the performance of systems in which it is integrated, and has a standard industrial temperature range making it suitable for various environmental conditions.
The chip follows the ONFI (Open NAND Flash Interface) standard, ensuring compatibility with other ONFI-compliant devices and systems. Its compact package design is ideal for modern electronics that require efficient use of space without compromising on performance.
Equivalent
Features
1. Capacity: It offers a storage capacity of 512 Gb (Gigabits).
2. Architecture: Designed with SLC technology, which stores one bit per cell, providing improved endurance and speed compared to MLC and TLC NAND types.
3. Performance: Suitable for applications requiring high read and write speeds. SLC architecture supports fast data transfer rates.
4. Endurance and Reliability: High endurance with a significantly longer program/erase (P/E) cycle lifespan compared to multi-bit cell NAND types.
5. Interface: Operates with an asynchronous interface, making it compatible with a wide range of controllers.
6. Temperature Range: Rated for industrial temperature ranges, typically -40°C to +85°C, making it suitable for harsh environmental conditions.
7. Form Factor: Generally available in a compact TSOP or BGA package, optimized for space-constrained applications.
This makes the MT29F512G08AUCBBH8-6IT:B ideal for industrial, automotive, and other high-performance applications requiring reliable and durable storage solutions.
Pinout
For this component, the pin count is 48, following the TSOP (Thin Small Outline Package) configuration. The functions of these pins generally include:
- I/O Pins (8 pins): Used for data input/output.
- CLE (Command Latch Enable): Activates command input.
- ALE (Address Latch Enable): Activates address input.
- CE# (Chip Enable): Selects the chip.
- WE# (Write Enable): Controls writing operations.
- RE# (Read Enable): Controls reading operations.
- WP# (Write Protect): Provides hardware protection for the write operations.
- R/B# (Ready/Busy): Indicates the status of the device.
- VCC and VSS: Power supply and ground pins.
For precise function details, refer to the specific datasheet of the MT29F512G08AUCBBH8-6IT:B, as it provides comprehensive information on electrical characteristics and pin functions.
Manufacturer
Application
1. Consumer Electronics: Smartphones, tablets, and cameras for storing media and apps.
2. Computing: Laptops and PCs as part of SSDs to enhance speed and performance.
3. Industrial: Embedded systems in machinery for data logging and firmware storage.
4. Automotive: Infotainment systems and advanced driver-assistance systems (ADAS) for data storage.
5. Networking: Routers and switches for firmware and configuration data.
6. Healthcare Devices: Medical equipment for data recording and analysis.
These applications benefit from the chip’s durability, capacity, and speed.