MT40A2G4SA-075:E

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MT40A2G4SA-075:E

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IC DRAM 8GBIT PARALLEL 78FBGA

  • FabricanteMicron Technology Inc.

  • Peça do Fabricante #MT40A2G4SA-075:E

  • Pacote FBGA-78

  • Em Estoque2274

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Especificações

Atributo Valor
Package / Case Tray
Part Status Active
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR4
Memory Size 8Gb (2G x 4)
Memory Interface Parallel
Clock Frequency 1.33 GHz
Voltage - Supply 1.14V ~ 1.26V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount

Visão Geral

Description

MT40A2G4SA-075:E is a Micron DRAM device from the MT40A2G4SA family. It is a 2-gigabit, x4 SDRAM (2 Gb total density, 4 data bits per access) with a -075 speed grade (7.5 ns) and an extended-temperature (-E) rating. This type of die is used as a memory component in systems with a memory controller, often in embedded/mobile applications, and is typically packaged in a small FF/BGA package. Exact specs (voltage, timings, banks, package, pinout) are in the Micron MT40A2G4SA-075:E datasheet. Want a link to it?

Equivalent

MT40A2G4SA-075:E is a Micron DDR SDRAM device (density/organization: 2 Gb per device, x4, 1.8 V, speed -075). Equivalents are other vendors’ DDR SDRAM parts with the same density and x4 width and 1.8 V (e.g., SK hynix, Samsung cross-refs). For exact part numbers, consult Micron’s cross-reference sheet or distributor catalogs (Mouser, Digi-Key).

Pinout

Pin count: 84-ball FBGA (84 pins).
Function: MT40A2G4SA-075:E is a 2 Gbit DDR3 SDRAM device in x4 configuration. It provides a 4-bit wide data I/O interface (DQ0–DQ3) with DQS/DQMS, plus address/command inputs (A0–A14, BA0–BA2), control lines (CS#, RAS#, CAS#, WE#), clock inputs (CK/CK#), bank and refresh logic, and power/ground pins (VCC/VSS, VREF).

Manufacturer

Manufacturer: Micron Technology, Inc.
What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage solutions (DRAM, NAND/NOR flash) and is an integrated device manufacturer (IDM).

Application

MT40A2G4SA-075:E is a Micron DDR3L SDRAM device. Common application areas include:
- Desktop and notebook memory subsystems
- Servers, data-center/storage gear, and caching
- Networking/telecom equipment (routers, switches, controllers)
- Embedded systems and industrial automation
- Consumer electronics (set-top boxes, digital TVs, media players, gaming consoles)

Package

96-ball FBGA package (FBGA-96)

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