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MT41K256M8DA-125 IT:K
+Lista de Materiais2Gbit 1.283V~1.45V 800MHz DDR3L SDRAM FBGA-78 Memory (ICs) RoHS
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FabricanteMicron
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Peça do Fabricante #MT41K256M8DA-125 IT:K
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Em Estoque8815
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Especificações
| Atributo | Valor |
| Packaging | FBGA-78 |
| Clock Frequency | 800MHz |
| Supply Current | 39mA |
| Memory Format | DDR3L SDRAM |
| Memory Size | 2Gbit |
| Operating Temperature | -40℃~+95℃ |
| Refresh Current | 12mA |
| Voltage - Supply | 1.283V~1.45V |
Visão Geral
Description
This chip utilizes an 8-bank architecture with a burst length of 8, offering efficient data handling and transmission. It supports CAS latency (CL) settings of 11, improving its operational flexibility. Additionally, it operates at a voltage range of 1.35V (DDR3L) or 1.5V (DDR3), ensuring compatibility with different power requirements.
The MT41K256M8DA-125 IT:K includes features like on-die termination (ODT) for signal integrity and thermal sensors for temperature monitoring. Its robust design and high-speed capabilities make it a reliable choice for demanding applications where performance and durability are critical.
Equivalent
1. Samsung: K4B2G0846D-BCK0
2. Hynix: H5TQ2G83CFR-PBC
3. Kingston: A similar DDR3-1600 2Gb component.
These alternatives match key specifications like memory density, speed, and operating temperature range. Always verify specifications and compatibility with your specific application and system requirements.
Features
1. Capacity: It is a 2Gb (gigabit) chip, organized as 256M x 8.
2. Speed and Latency: Operates at a speed of 1600 MT/s (megatransfers per second) with a CL (CAS latency) of 11.
3. Voltage: Designed for low-voltage operation at 1.35V, also compatible with 1.5V systems.
4. Package: Available in a standard 78-ball FBGA (Fine-pitch Ball Grid Array) package.
5. Temperature Range: Suitable for industrial temperature applications, ranging from -40°C to 95°C.
6. Features: Includes auto-refresh and self-refresh modes, along with a programmable mode register, on-die termination (ODT), and support for burst lengths of 4 and 8.
This chip is ideal for applications requiring high density and low power, such as networking equipment, industrial systems, and embedded solutions.
Pinout
The primary function of the MT41K256M8DA-125 IT:K is to provide volatile memory storage with a lower operating voltage compared to standard DDR3, enhancing energy efficiency. It supports the JEDEC DDR3L standard and is used in applications requiring high-speed data transfer and storage, such as computers, servers, and other electronic devices.
In summary, the MT41K256M8DA-125 IT:K is a 78-ball FBGA-package, high-density, low-voltage DDR3L SDRAM designed for efficient and fast memory access.
Manufacturer
Application
1. Consumer Electronics: Used in devices like smart TVs, gaming consoles, and set-top boxes for efficient memory management.
2. Computing: Integrated into laptops, desktops, and servers for fast processing and multitasking capabilities.
3. Networking: Utilized in routers and switches to improve data throughput and network performance.
4. Embedded Systems: Employed in industrial automation and automotive systems for reliable and efficient data handling.
5. Mobile Devices: Supports smartphones and tablets in managing applications and operating systems efficiently.
These applications benefit from the chip's low power consumption and high bandwidth.