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eMMC Do not quote for a new design - eMMC Industrial, -40C to 85C
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FabricanteWestern Design Center (WDC)
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Peça do Fabricante #SDIN8DE1-8G-XI
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Em Estoque23272
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Especificações
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Visão Geral
Description
Key features of the SDIN8DE1-8G-XI include:
1. Capacity: 8GB of high-density NAND flash memory, suitable for a variety of applications such as smartphones, tablets, and IoT devices.
2. Interface: Utilizes a standard e.MMC interface that simplifies the integration process by providing a streamlined communication protocol between the storage and the host system.
3. Performance: Offers enhanced read and write speeds with support for features like health reporting and power failure protection, ensuring data integrity and reliability.
4. Durability: Designed to withstand the rigors of embedded applications, including variations in temperature and physical stress.
Overall, the SDIN8DE1-8G-XI is a robust choice for manufacturers seeking reliable, compact, and efficient storage solutions for consumer electronics and industrial applications.
Equivalent
1. Samsung eMMC 5.1 series, such as the KLM8G1GETF-B041 (8GB).
2. Kingston eMMC solutions, like the Kingston EMMC08G-M329.
3. Micron's eMMC 5.1, such as MTFC8GAKAJCN-4M IT.
4. Toshiba e-MMC series like THGBMFG8C2LBAIL.
These equivalents are based on similar storage capacities and eMMC specifications. Always verify compatibility with the specific application requirements.
Features
1. Capacity: 8GB.
2. Interface: e.MMC 5.1, which provides efficient communication between the storage device and the host processor.
3. Operating Temperature Range: -40°C to 85°C, making it suitable for industrial applications.
4. Performance: Enhanced with features such as high-speed sequential read/write and random read/write capabilities.
5. Reliability: Includes advanced error correction code (ECC) and wear leveling to ensure data integrity and prolong the lifespan of the storage device.
6. Form Factor: Compact design, making it ideal for space-constrained applications.
7. Endurance: Designed for high durability, supporting a significant number of program/erase cycles.
8. Compatibility: Compatible with a wide range of host systems, enabling versatile usage across different platforms.
These features make the SDIN8DE1-8G-XI suitable for various applications, including automotive, industrial automation, and other environments requiring robust and reliable data storage.
Pinout
The pin count for the SDIN8DE1-8G-XI is typically 153 balls in a BGA (Ball Grid Array) package. These pins provide interfaces for power, data transfer, command, and other necessary signals for operation.
The primary functions of the pins include:
1. Data Transfer: Data lines for read/write operations.
2. Command/Control: CMD line for sending commands from the host.
3. Clock: CLK line for synchronizing data transfers.
4. Power and Ground: VCC and VSS pins for power supply and grounding.
5. Reset: A reset pin to initialize the device.
6. VCCQ/VSSQ: Separate power supply for I/O interface.
This configuration allows the module to efficiently handle data storage and retrieval tasks in various applications, including mobile devices, embedded systems, and other electronics requiring reliable non-volatile storage.