Imagens apenas para referência
SDINBDG4-8G-XI2
+Lista de MateriaiseMMC Industrial eMMC 5.1 HS400 new FW -40C+85C
-
FabricanteWestern Design Center (WDC)
-
Peça do Fabricante #SDINBDG4-8G-XI2
-
Em Estoque10339
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
Visão Geral
Description
The SDINBDG4-8G-XI2 is an industrial-grade 4G LTE router designed for reliable wireless communication in harsh environments. Key features include:
- 4G LTE Connectivity: Supports high-speed mobile broadband with global band compatibility.
- Dual Ethernet Ports: Enables wired connections for devices like PLCs or sensors.
- Industrial Durability: Operates in extreme temperatures (-30°C to 70°C) and has high EMI resistance.
- VPN & Firewall: Secure remote access with IPsec/OpenVPN and built-in security protocols.
- Cloud Management: Supports remote monitoring and configuration via platforms like MQTT.
Ideal for IIoT, smart grids, and transportation, it ensures stable connectivity in remote or challenging conditions.
- 4G LTE Connectivity: Supports high-speed mobile broadband with global band compatibility.
- Dual Ethernet Ports: Enables wired connections for devices like PLCs or sensors.
- Industrial Durability: Operates in extreme temperatures (-30°C to 70°C) and has high EMI resistance.
- VPN & Firewall: Secure remote access with IPsec/OpenVPN and built-in security protocols.
- Cloud Management: Supports remote monitoring and configuration via platforms like MQTT.
Ideal for IIoT, smart grids, and transportation, it ensures stable connectivity in remote or challenging conditions.
Equivalent
The SDINBDG4-8G-XI2 is a 4GB eMMC chip from Western Digital (SanDisk). Equivalent alternatives include:
- KLM4G1WEPD-B031 (Samsung 4GB eMMC)
- THGBM4G4D1HBAIR (Toshiba/Kioxia 4GB eMMC)
- MTFC4GACAJCN-4M (Micron 4GB eMMC)
Ensure compatibility with pinout, voltage (3.3V), and interface (eMMC 5.0/5.1). Verify datasheets for exact matches.
- KLM4G1WEPD-B031 (Samsung 4GB eMMC)
- THGBM4G4D1HBAIR (Toshiba/Kioxia 4GB eMMC)
- MTFC4GACAJCN-4M (Micron 4GB eMMC)
Ensure compatibility with pinout, voltage (3.3V), and interface (eMMC 5.0/5.1). Verify datasheets for exact matches.
Features
The SDINBDG4-8G-XI2 is a 4GB eMMC flash storage module by Western Digital (SanDisk). Key features:
- Capacity: 4GB (8GB variant also available).
- Interface: eMMC 5.1, backward-compatible.
- Performance: Sequential read up to 250MB/s, write up to 90MB/s.
- Reliability: Supports wear leveling, bad block management, and ECC.
- Operating Temp.: -25°C to +85°C (industrial-grade).
- Form Factor: BGA-153 package, compact design.
- Applications: Embedded systems, IoT, industrial devices.
Ideal for low-power, high-endurance storage needs.
- Capacity: 4GB (8GB variant also available).
- Interface: eMMC 5.1, backward-compatible.
- Performance: Sequential read up to 250MB/s, write up to 90MB/s.
- Reliability: Supports wear leveling, bad block management, and ECC.
- Operating Temp.: -25°C to +85°C (industrial-grade).
- Form Factor: BGA-153 package, compact design.
- Applications: Embedded systems, IoT, industrial devices.
Ideal for low-power, high-endurance storage needs.
Pinout
The SDINBDG4-8G-XI2 is an 8GB eMMC flash memory chip from Western Digital (SanDisk).
- Pin Count: 153-ball BGA (Ball Grid Array).
- Function: Provides embedded NAND flash storage with an integrated controller, supporting eMMC 5.1 interface. It is used in embedded systems, IoT devices, and consumer electronics for reliable, high-speed storage.
Key features:
- 8GB capacity
- HS400 mode (up to 400MB/s)
- Supports eMMC 5.1 protocol
- 3.3V operation
- Pin Count: 153-ball BGA (Ball Grid Array).
- Function: Provides embedded NAND flash storage with an integrated controller, supporting eMMC 5.1 interface. It is used in embedded systems, IoT devices, and consumer electronics for reliable, high-speed storage.
Key features:
- 8GB capacity
- HS400 mode (up to 400MB/s)
- Supports eMMC 5.1 protocol
- 3.3V operation
Manufacturer
The SDINBDG4-8G-XI2 is manufactured by Western Digital (WD), a leading American data storage company. Western Digital produces a wide range of storage solutions, including hard drives, SSDs, and memory products. The SDINBDG4-8G-XI2 is an eMMC (embedded MultiMediaCard) storage chip, commonly used in smartphones, tablets, and IoT devices.
Western Digital is a well-established company known for reliability in the storage industry, with brands like SanDisk under its umbrella. It focuses on innovation in NAND flash and other storage technologies.
Western Digital is a well-established company known for reliability in the storage industry, with brands like SanDisk under its umbrella. It focuses on innovation in NAND flash and other storage technologies.
Package
The SDINBDG4-8G-XI2 is a BGA (Ball Grid Array) package type. It's an 8GB NAND flash memory component designed for embedded storage applications, commonly used in devices like smartphones and tablets. The BGA package ensures compact size and reliable electrical connections, suitable for high-density PCB designs.
