ST25DV04KC-IE6T3

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ST25DV04KC-IE6T3

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Especificações

Atributo Valor
Part Status Active
Type RFID Transponder
Frequency 13.56MHz
Standards ISO 15693, NFC
Interface I2C
Voltage - Supply 1.8V ~ 5.5V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 8-TSSOP
Base Product Number ST25
Grade Automotive
Qualification AEC-Q100

Visão Geral

Description

The ST25DV04KC-IE6T3 is a dynamic NFC/RFID tag IC developed by STMicroelectronics. It features a 4-Kbit (512-byte) EEPROM memory, configurable in four different areas, and supports ISO/IEC 15693 and NFC Forum Type 5 tag standards. This IC allows for both RF and I2C interfaces, enabling dual connectivity to microcontrollers and NFC-enabled devices, such as smartphones and readers.
The ST25DV04KC-IE6T3 is designed for versatile applications like smart packaging, product authentication, and industrial automation. It offers fast data transfer rates and supports energy harvesting, allowing the IC to power up external devices. Anti-tearing and password protection features ensure data integrity and security, while its fast transfer mode (FTM) enhances real-time communication.
Operating in a temperature range of -40°C to +85°C, the chip is packaged in a TSSOP-8 for compact installations. Its advanced features and dual interface make it suitable for IoT applications requiring high reliability and data protection.

Equivalent

The ST25DV04KC-IE6T3 is a dynamic NFC/RFID tag IC by STMicroelectronics. Equivalent products include:
1. NXP NT3H2111 - A similar NFC tag IC with I2C interface and energy harvesting.
2. Texas Instruments RF430FRL152H - An NFC tag with a programmable microcontroller.
3. NXP NTAG I2C plus - Offers both NFC and I2C interfaces for smart packaging and IoT applications.
These alternatives provide comparable features for NFC/RFID communication and storage applications.

Pinout

The ST25DV04KC-IE6T3 is a dynamic NFC/RFID tag IC with a dual interface, supporting both RF and I²C communication. This IC typically comes in a SO8 (Small Outline) package, which includes 8 pins. Here is a brief overview of its pin functions:
1. VCC: Power supply for the I²C interface.
2. GND: Ground connection.
3. SCL: Serial Clock Line for the I²C interface.
4. SDA: Serial Data Line for the I²C interface.
5. RFU: Reserved for future use or no connection (NC).
6. RFU: Reserved for future use or no connection (NC).
7. VCC_RF: Provides power derived from the RF field when RF communication is active.
8. GPO: General Purpose Output for event signaling.
The ST25DV04KC-IE6T3 is designed for applications requiring NFC capabilities and offers 4 Kbits of EEPROM memory. Its dual interface allows for versatile use in various environments, supporting energy harvesting, and features such as fast transfer mode and security options for data protection.

Manufacturer

The ST25DV04KC-IE6T3 is manufactured by STMicroelectronics. STMicroelectronics is a global semiconductor company that designs, develops, manufactures, and markets a wide range of electronic components and systems. It is a leading player in the semiconductor industry, providing solutions for various applications including automotive, industrial, personal electronics, communications equipment, and Internet of Things (IoT) devices. The company is known for its expertise in microcontrollers, sensors, power management, and analog devices, among other technologies. Headquartered in Geneva, Switzerland, STMicroelectronics operates worldwide with numerous research and development centers, as well as manufacturing facilities.

Application

The ST25DV04KC-IE6T3 is a dynamic NFC/RFID tag IC that is commonly used in several applications due to its unique features. Key application areas include:
1. Smart Packaging: Enables interactive packaging solutions for consumer engagement and anti-counterfeiting.
2. Asset Tracking: Facilitates efficient tracking and management of assets in logistics and supply chain operations.
3. Industrial Automation: Used for inventory management and production line automation.
4. IoT Devices: Enhances connectivity and data exchange in IoT ecosystems.
5. Consumer Electronics: Provides wireless connectivity and data transfer for smart home devices and personal gadgets.
These applications leverage its dual interface, EEPROM memory, and energy harvesting capabilities.

Package

The ST25DV04KC-IE6T3 is available in a TSSOP-8 package, which is a Thin Shrink Small Outline Package with 8 leads. It is designed for applications requiring NFC/RFID communication, providing a compact form factor suitable for various electronic designs.

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