TC58NVG5H2HTAI0

TC58NVG5H2HTAI0 is a high-density 3D NAND flash memory device from Toshiba/Kioxia (TC58NVG family). It provides non-volatile storage for SSDs, embedded storage, and memory cards. Built on stacked 3D NAND cells (BiCS-type), it offers higher capacity and better endurance and performance than older planar NAND, with multi-plane operation to improve throughput. It uses a standard NAND flash interface (ONFi-compatible/Toggle DDR) and supports typical NAND features such as page/block organization, ECC, wear leveling, and bad-block management. Endurance and speed vary by density and mode; densities span hundreds of gigabits to multiple terabits, with P/E cycles in the thousands for TLC/QLC variants and substantial read/write throughput per plane. Common applications include consumer and enterprise SSDs, embedded NAND in storage devices, and memory cards. For exact specifications (capacity, timing, voltage, endurance, temperature) refer to the official datasheet for TC58NVG5H2HTAI0 from Kioxia/Toshiba.

Pin count: 48 pins.
Function: Toshiba/Kioxia TC58NVG5H2HTAI0 is a NAND flash memory device (non-volatile storage) with an x8 data bus and a standard NAND flash interface (ONFI/Toggle-compatible).

Manufacturer: Kioxia (formerly Toshiba Memory Corporation, originally part of Toshiba).
What kind of company: A Japanese multinational that designs, manufactures, and sells flash memory and solid-state storage products (NAND flash, SSDs) and related semiconductor technology.

Applications areas for TC58NVG5H2HTAI0 include:
- Mobile/consumer devices (smartphones, tablets, cameras)
- Embedded/IoT and wearables
- Automotive and industrial systems (infotainment, telematics, ECUs)
- Storage products (SSDs, USB drives, SD/memory cards)
- Data-center/enterprise storage and caching (NVMe/SATA SSDs)
- Networking equipment and edge devices
- Surveillance cameras, drones, and smart-home devices

FBGA (fine-pitch Ball Grid Array) package.