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XC7Z035-1FBG676I
+Lista de MateriaisIC SOC CORTEX-A9 667MHZ 676FCBGA
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FabricanteAMD
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Especificações
| Atributo | Valor |
| Series | Zynq®-7000 |
| Part Status | Active |
| Base Product Number | XC7Z035 |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Packaging | Tray |
Visão Geral
Equivalent
The XC7Z035-1FBG676I is a Zynq-7000 SoC with dual-core ARM Cortex-A9 and Artix-7 FPGA. Equivalent alternatives include:
1. Xilinx Zynq-7000 family:
- XC7Z030 (lower logic density)
- XC7Z045 (higher logic density)
2. Competitors:
- Intel (Altera) Cyclone V SoC (5CSXFC6D6F31C8N)
- Microchip PolarFire SoC (MPFS250T-1FCVG1152I)
These offer similar ARM+FPGA integration. Choose based on performance, power, and ecosystem needs.
1. Xilinx Zynq-7000 family:
- XC7Z030 (lower logic density)
- XC7Z045 (higher logic density)
2. Competitors:
- Intel (Altera) Cyclone V SoC (5CSXFC6D6F31C8N)
- Microchip PolarFire SoC (MPFS250T-1FCVG1152I)
These offer similar ARM+FPGA integration. Choose based on performance, power, and ecosystem needs.
Pinout
The XC7Z035-1FBG676I is a Zynq-7000 SoC from Xilinx (now AMD), featuring a dual-core ARM Cortex-A9 processor and Artix-7 FPGA fabric.
- Pin Count: 676 pins (FBG676 package).
- Key Functions:
- PS (Processor System): Dual-core ARM Cortex-A9, DDR3/LPDDR2 memory controllers, peripherals (USB, UART, SPI, I2C, Gigabit Ethernet).
- PL (Programmable Logic): ~275K logic cells, 16.3 Mb block RAM, 240 DSP slices, high-speed transceivers (up to 6.25 Gbps).
- I/O: Supports LVDS, LVCMOS, and other standards.
This SoC is used in embedded systems requiring high processing power and FPGA flexibility.
- Pin Count: 676 pins (FBG676 package).
- Key Functions:
- PS (Processor System): Dual-core ARM Cortex-A9, DDR3/LPDDR2 memory controllers, peripherals (USB, UART, SPI, I2C, Gigabit Ethernet).
- PL (Programmable Logic): ~275K logic cells, 16.3 Mb block RAM, 240 DSP slices, high-speed transceivers (up to 6.25 Gbps).
- I/O: Supports LVDS, LVCMOS, and other standards.
This SoC is used in embedded systems requiring high processing power and FPGA flexibility.
Application
The XC7Z035-1FBG676I, a Zynq-7000 SoC from Xilinx (now AMD), integrates dual-core ARM Cortex-A9 processors with FPGA logic. Key application areas include:
- Embedded Systems: Industrial automation, robotics, and motor control.
- Aerospace & Defense: Avionics, radar, and secure communications.
- Automotive: ADAS, infotainment, and vehicle networking.
- Medical Imaging: Ultrasound and MRI processing.
- Communications: 5G, software-defined radio (SDR), and networking.
- Video & AI: Real-time vision processing and edge AI inference.
Its high-performance processing and reconfigurable logic make it ideal for complex, real-time applications.
- Embedded Systems: Industrial automation, robotics, and motor control.
- Aerospace & Defense: Avionics, radar, and secure communications.
- Automotive: ADAS, infotainment, and vehicle networking.
- Medical Imaging: Ultrasound and MRI processing.
- Communications: 5G, software-defined radio (SDR), and networking.
- Video & AI: Real-time vision processing and edge AI inference.
Its high-performance processing and reconfigurable logic make it ideal for complex, real-time applications.
Package
The XC7Z035-1FBG676I is a Zynq-7000 SoC from Xilinx (now AMD), packaged in a 676-ball Fine-Pitch Ball Grid Array (FBGA). The "FBG676I" suffix indicates the package type (FBGA), pin count (676), and industrial temperature range (-40°C to +100°C). It integrates dual-core ARM Cortex-A9 processors with FPGA logic.
