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XCZU4EV-1SFVC784I
+Lista de MateriaisIC SOC CORTEX-A53 784FCBGA
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FabricanteAMD
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Peça do Fabricante #XCZU4EV-1SFVC784I
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Especificações
| Atributo | Valor |
| Series | Zynq® UltraScale+™ MPSOC EV |
| Part Status | Active |
| Base Product Number | XCZU4 |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 784-BFBGA, FCBGA |
| Supplier Device Package | 784-FCBGA (23x23) |
| Packaging | Tray |
Visão Geral
Description
The XCZU4EV variant integrates a high-performing FPGA fabric with over 192K logic cells, 728 DSP slices, and high-speed transceiver capabilities, suitable for data-intensive operations. Its package, SFVC784, allows for efficient heat dissipation and reliable connectivity in demanding environments, while the industrial-grade (-I) temperature range ensures performance in harsh conditions.
This chip is well-suited for applications in automotive, industrial automation, and communications, where high performance and flexibility are critical. It supports advanced features such as secure boot and hardware-accelerated encryption, addressing both security and performance needs in modern embedded systems.
Equivalent
Features
Pinout
The functions of this device encompass a wide range of applications due to its heterogeneous architecture. It supports processing tasks using its ARM cores, graphical processing via the GPU, and custom logic design using the programmable FPGA fabric. The device is suitable for applications in embedded processing, high-performance computing, machine learning, and real-time control.
The pinout of the SFVC784 package includes connections for power, ground, GPIO, and various interfaces such as DDR, PCIe, SATA, USB, Ethernet, and others, which facilitate communication and data transfer between the processing system and external components or devices.
Manufacturer
Application
1. Embedded Vision: Ideal for image and video processing in automotive, surveillance, and industrial applications.
2. 5G Wireless Communication: Supports high-speed data processing and low-latency requirements.
3. Industrial IoT: Enhances smart factory automation with real-time data analytics and system control.
4. Aerospace and Defense: Used in radar and communication systems due to its high-performance processing capabilities.
5. Medical Imaging: Facilitates advanced diagnostics and imaging techniques.
6. Data Centers: Contributes to accelerated workloads in cloud computing and AI inference tasks.
Its integration of programmable logic with processing systems supports a wide array of demanding applications.