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XCKU115-2FLVD1924I
+Lista de MateriaisIC FPGA 832 I/O 1924FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XCKU115-2FLVD1924I
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Pacote FBGA-1924
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 82920 |
| Number of Logic Elements/Cells | 1451100 |
| Total RAM Bits | 77721600 |
| Number of I/O | 832 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key specifications include:
- Logic Cells: It offers a large number of logic cells, providing substantial programmable logic capability.
- DSP Slices: Equipped with numerous DSP slices, it's optimized for digital signal processing tasks.
- Memory: Integrated with high-capacity, high-speed internal memory for efficient data handling.
- I/O Bandwidth: Provides high input/output bandwidth to accommodate rapid data transfer and connectivity needs.
- Power Efficiency: Designed to deliver maximum performance with minimal power usage, ideal for energy-sensitive applications.
The "-2" denotes a specific speed and power grade, while "FLVD1924I" signifies the package type and number of pins, with "I" indicating industrial temperature range support. This makes the XCKU115-2FLVD1924I versatile for both commercial and industrial applications.
Equivalent
Features
1. High Logic Density: Offers over 1.1 million logic cells, providing significant resources for complex designs.
2. Memory: Includes up to 75.9 Mb of block RAM and UltraRAM for efficient data storage and processing.
3. Speed Grade: The "-2" speed grade indicates a balance between power consumption and performance, suitable for demanding applications.
4. Package: Comes in an FBG1924 package, which provides numerous I/O options and supports high-bandwidth interfaces.
5. I/O Flexibility: Supports high-speed serial transceivers and various I/O standards, enabling versatile connectivity options.
6. Power Efficiency: Designed with advanced power management features to optimize performance per watt.
7. Security: Offers secure boot and encryption features for design protection.
8. Applications: Ideal for applications in data centers, communications, and other high-performance computing environments.
This FPGA is suitable for applications requiring high performance and low latency, with strong support for customizable and scalable designs.
Pinout
1. General Purpose I/Os (GPIOs): These pins can be configured for various input/output operations.
2. Power and Ground Pins: Essential for powering the FPGA and maintaining a stable ground reference.
3. Configuration Pins: Used for programming the FPGA with a desired configuration or bitstream.
4. Clock Pins: For clock signal input, necessary for synchronous operations within the FPGA.
5. Transceiver Pins: Support high-speed serial communication links, crucial for high-bandwidth data transfer.
6. Dedicated Function Pins: For special functions like JTAG for debugging, and special interfaces such as PCIe, Ethernet, and more.
This combination makes the XCKU115-2FLVD1924I suitable for applications requiring high performance, large bandwidth, and versatile connectivity.
Manufacturer
Xilinx's products are used in various applications, such as signal processing, machine learning, and embedded systems, providing flexibility and performance optimization for complex computing tasks. The company was a pioneer in FPGA technology, which allows designers to configure hardware features using software, enabling rapid prototyping and iterative design processes. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a leading multinational semiconductor company known for its central processing units (CPUs), graphics processing units (GPUs), and other semiconductor products, expanding AMD's portfolio and enhancing its capabilities in adaptive computing technologies.