Imagens apenas para referência
NT5CC512M8EQ-EKI
+Lista de Materiais-
FabricanteNanya Technology
-
Peça do Fabricante #NT5CC512M8EQ-EKI
-
Ficha Técnica NT5CC512M8EQ-EKI DataSheet
-
Em Estoque17624
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.36 |
| Automotive | Unknown |
| PPAP | Unknown |
| Mounting | Surface Mount |
| Package Height | 1(Max) |
| Package Width | 8 |
| Package Length | 10.5 |
| PCB changed | 78 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 78 |
| Lead Shape | Ball |
Visão Geral
Description
Equivalent
1. Micron MT41K512M8DA-125: A 4Gb DDR3L SDRAM compatible in density and speed.
2. Samsung K4B4G0846D-BYK0: Another 4Gb DDR3L SDRAM.
3. Hynix H5TC4G83AFR-PBA: A 4Gb DDR3L SDRAM similar in specifications.
These equivalents should be cross-referenced with specific project requirements for compatibility.
Features
Pinout
This memory chip is designed for high-performance applications requiring low power consumption and high-speed data transfers. It has a capacity of 4Gb (gigabits), organized as 512M x 8 bits, indicating that it is a single x8 device. The chip operates at a supply voltage of 1.35V, which aligns with the DDR3L standard for low voltage.
The function of this chip is to provide temporary storage for data and instructions that the CPU and other devices need quickly. It improves system performance by allowing faster data access compared to conventional DRAM. This makes it suitable for use in computing devices like laptops, desktops, and servers where efficient energy usage and performance are crucial.
Manufacturer
Application
1. Consumer Electronics: Used in devices like TVs, set-top boxes, and gaming consoles for efficient data processing and storage.
2. Computing Systems: Implemented in desktops, laptops, and servers for improved multitasking and performance.
3. Networking Equipment: Utilized in routers, switches, and other network devices for enhanced data handling.
4. Industrial Applications: Deployed in embedded systems for reliable performance in harsh environments.
5. Automotive Systems: Integrated into infotainment systems and advanced driver-assistance systems (ADAS) for responsive functionality.
Package
Frequently Asked Questions
Q: What is the package type and mounting style of the NT5CC512M8EQ-EKI?
A: It uses a 78-pin TFBGA (Thin Fine-Pitch Ball Grid Array) package designed for Surface Mount (SMT) assembly.
Q: Is this component compliant with EU RoHS regulations?
A: Yes, the EU RoHS status is listed as "Compliant," making it suitable for environmentally sensitive applications.
Q: What is the industrial temperature range for this memory chip?
A: Given the suffix "EKI," this model typically supports an extended industrial temperature range (e.g., -40°C to +95°C). Please verify against Nanya's official datasheet.
Q: What is the standard PCB footprint and pad layout for this BGA package?
A: The package dimensions are 10.5mm (Length) x 8mm (Width) with a 1mm (Max) height, requiring a 78-ball layout on the PCB.
Q: Can this part be used in automotive or PPAP-required projects?
A: No, the parameters list Automotive and PPAP as "Unknown," indicating it is not validated for automotive-grade or PPAP projects.
Q: What is the ECCN classification for international shipping?
A: The ECCN (US) is EAR99, indicating no specific national security controls, which simplifies export logistics for general commercial use.