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NT6AN512T32AV-J2
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FabricanteNanya Technology
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Peça do Fabricante #NT6AN512T32AV-J2
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Ficha Técnica NT6AN512T32AV-J2 DataSheet
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Especificações
| Atributo | Valor |
| EU Ro HS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | EA |
| Automotive | Unknown |
| PPAP | Unknown |
| Mounting Type | Surface Mount |
| Package Height | 0.65(Max) |
| Package Width | 10 |
| Package Length | 15 |
| PCB changed | 200 |
| Package / Case | BGA |
| Supplier Device Package | FBGA |
| Pin Count | 200 |
Visão Geral
Description
Key features include low power consumption, high-speed data transfer rates, and enhanced thermal performance, making it ideal for environments where both performance and energy efficiency are crucial. The NT6AN512T32AV-J2 supports features like on-die termination (ODT), command/address parity, and data bus inversion (DBI), enhancing signal integrity and reducing power usage.
It is commonly used in applications requiring a reliable, high-performance memory solution, such as networking equipment, server farms, and sophisticated electronic devices. Its compatibility with a range of processors and ease of integration make it a popular choice for developers looking to optimize memory operations.
Equivalent
1. Micron's MT40A512M16.
2. Samsung's K4A4G165WE.
3. SK Hynix's H5AN4G6NAFR.
These chips should have comparable specifications like speed, voltage, and temperature ratings, but always verify the datasheets for precise compatibility.
Features
1. Capacity: 16 Gb (Gigabits), organized as 512M x 32.
2. Speed: Operates at a data rate of up to 4266 Mbps, facilitating rapid data transfer.
3. Voltage: Supports low power operation with I/O voltage at 0.6V and core voltage at 1.1V.
4. Temperature Range: Can operate efficiently within a wide temperature range, suitable for various applications.
5. Power Efficiency: Incorporates advanced power-saving features, ideal for mobile and portable devices.
6. Package Type: Available in a compact package, essential for space-constrained applications.
7. Reliability: Offers robust performance with features supporting high reliability and stability.
8. Compatibility: Conforms to JEDEC standards, ensuring wide compatibility with various systems.
These features make it suitable for high-performance applications such as smartphones, tablets, and other portable computing devices.
Pinout
The NT6AN512T32AV-J2 features a 96-ball FBGA (Fine-Pitch Ball Grid Array) package. The pin count, therefore, is 96. The functions of these pins include:
- Power supply pins (VDD, VSS) for providing the necessary voltages.
- Address pins (A0-A14) for accessing specific memory locations.
- Data pins (DQ0-DQ31) for data input and output.
- Control pins (such as CKE, CS#, RAS#, CAS#, and WE#) for managing memory operations.
- Clock pins (CK, CK#) for synchronizing data transfer.
- Data mask and strobe pins (DM, DQS, DQS#) for data integrity and timing.
The NT6AN512T32AV-J2 is utilized in high-speed memory applications, such as in computers and other electronic devices requiring efficient data handling and storage.
Manufacturer
Application
1. Consumer Electronics: Enhancing performance in smartphones, tablets, and laptops.
2. Enterprise Systems: Providing reliable memory solutions for servers and data centers.
3. Networking Equipment: Supporting routers and switches with efficient data handling capabilities.
4. Automotive Systems: Contributing to advanced driver assistance systems (ADAS) and infotainment systems.
5. Industrial Automation: Enabling efficient operations in robotics and control systems.
Its high data transfer rates make it suitable for tasks demanding quick data access and high-speed computing.
Package
Frequently Asked Questions
Q: What is the mounting type and package of the NT6AN512T32AV-J2?
A: It uses Surface Mount technology and comes in a 200-pin FBGA package with dimensions of 15x10mm.
Q: Is this component RoHS compliant and EU RoHS compliant?
A: Yes, it is marked as EU RoHS Compliant, meeting environmental standards for lead-free soldering.
Q: What is the ECCN classification for this part?
A: The ECCN (US) is EAR99, suitable for standard commercial applications without special export controls.
Q: Is the NT6AN512T32AV-J2 an active part for new designs?
A: Yes, the Part Status is Active, indicating it is currently in production and suitable for new designs.
Q: What is the standard package name and pin count?
A: The standard package name is BGA, supplied as FBGA, with a total of 200 pins.
Q: Does this component have automotive or PPAP qualification?
A: No, both Automotive and PPAP status are marked as Unknown, so it is not qualified for automotive use.
Q: What are the package dimensions and height of this FBGA?
A: Package length is 15mm, width is 10mm, and maximum height is 0.65mm for low-profile designs.