TC58BVG1S3HBAI4

TC58BVG1S3HBAI4 is a Toshiba (now Kioxia) TC58-series 3D NAND flash memory device used for non-volatile storage in electronics. It stores data in flash cells organized into planes, blocks, and pages, with an out-of-band (OOB) area for ECC. The chip supports standard NAND operations—program/write a page, read a page, erase a block—and employs wear leveling and bad-block management to extend endurance. It uses a NAND-style command/address/data interface and often benefits from multi-plane and interleaved operation for higher throughput. Exact capacity, page size, timing, and voltage requirements vary by variant; the suffix encodes packaging and revision. Typical applications include embedded storage in microcontroller systems, consumer electronics, and solid-state storage subsystems. For precise specifications—density, endurance (P/E cycles), timing, and electrical characteristics—consult the official Kioxia/Toshiba datasheet for TC58BVG1S3HBAI4.

- Pin count: 48 pins
- Function: Toshiba TC58BVG1S3HBAI4 is a NAND flash memory IC (MLC) with an 8‑bit data bus and a parallel address/command interface (ONFI-compatible) for non-volatile storage.

Manufacturer: Kioxia (formerly Toshiba Memory Corporation, originally Toshiba).
What kind of company: A Japanese multinational semiconductor company that designs and manufactures flash memory NAND products and other storage technologies.

TC58BVG1S3HBAI4 is a Toshiba/Kioxia 3D NAND flash memory. Common application areas include:
- Solid-state drives (SSDs) and external storage
- Embedded storage in mobile devices (smartphones, tablets), cameras, wearables
- Automotive infotainment, telematics, and in-vehicle storage
- Industrial, networking, and edge computing equipment
- Consumer electronics (set-top boxes, gaming consoles, digital cameras)
- Memory cards, USB drives, and other NAND-based storage
- Firmware storage and caching in various devices
(High-density, durable NAND suitable for dense, embedded storage needs.)

BGA package (FBGA).