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TC58CVG1S3HRAIJ
+Lista de MateriaisIC FLASH 2GBIT SPI 133MHZ 8WSON
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FabricanteKioxia America, Inc.
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Peça do Fabricante #TC58CVG1S3HRAIJ
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Pacote WSON-8
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Em Estoque3789
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 2Gb (256M x 8) |
| Memory Interface | SPI |
| Clock Frequency | 133 MHz |
| Access Time | 180 µs |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
Visão Geral
Description
With its single-level cell architecture, the TC58CVG1S3HRAIJ stores one bit per cell, which contributes to faster read and write speeds and greater endurance compared to MLC (Multi-Level Cell) or TLC (Triple-Level Cell) NAND alternatives. This makes it especially suitable for environments where data integrity and longevity are critical, such as industrial applications and critical system components.
The chip also supports various interface options, ensuring compatibility with different host systems, and includes features for error correction and wear leveling, enhancing data integrity and extending the lifespan of the memory.
Equivalent
Features
1. Capacity: Typically available in various storage capacities, commonly used in consumer electronics, industrial applications, and SSDs.
2. Technology: Utilizes 3D NAND technology, which offers higher density storage, improved performance, and reduced power consumption compared to traditional planar NAND.
3. Interface: Supports standard NAND flash interfaces, ensuring compatibility with a wide range of controllers and systems.
4. Reliability: Incorporates error correction code (ECC) and wear leveling to enhance data integrity and prolong the lifespan of the memory.
5. Performance: Offers high read and write speeds, crucial for applications requiring fast data access and transfer.
6. Temperature Range: Capable of operating within a broad temperature range, suitable for various environments.
7. Form Factor: Available in compact package sizes, facilitating integration into space-constrained designs.
This NAND flash chip is widely used in consumer electronics, embedded systems, and other applications requiring reliable and efficient data storage.
Pinout
In terms of pin count, NAND flash packages can vary, but a common package type for such chips, like the TSOP (Thin Small Outline Package), usually has around 48 pins. However, the pin count can vary based on the specific package type used (e.g., BGA, LGA).
The primary function of the TC58CVG1S3HRAIJ is to store data persistently, even without power. It is used in applications where large amounts of data need to be stored, such as in SSDs (Solid State Drives), USB flash drives, and other memory cards. The memory is organized in blocks and pages, supporting read, program, and erase operations.