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THGBMJG8C4LBAU8
+Lista de MateriaisIC FLASH 256GBIT EMMC 153FBGA
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FabricanteKioxia America, Inc.
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Peça do Fabricante #THGBMJG8C4LBAU8
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Pacote FBGA-153
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Em Estoque5798
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | e•MMC™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 256Gb (32G x 8) |
| Memory Interface | eMMC |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
Visão Geral
Description
Equivalent
1. Samsung's K9GBG08U0M (3D NAND)
2. Micron's MT29F4T08EQLEEG8 (3D NAND)
3. SanDisk's SDTNQGAMA-008G (3D NAND)
4. SK Hynix's H27UBG8T2BTR-BC (3D NAND)
Always verify the specifications, such as storage capacity, interface, and form factor, to ensure compatibility.
Features
1. Capacity: This chip is part of Toshiba's e-MMC line, which means it integrates NAND flash memory with a controller in a single package. The capacity of this specific model is typically around 64GB.
2. e-MMC Interface: It uses the embedded MultiMediaCard (e-MMC) interface, which simplifies design efforts and improves time to market for consumer electronics.
3. NAND Type: It uses TLC (Triple-Level Cell) NAND technology, offering a balance between performance and cost efficiency.
4. Performance: The e-MMC 5.1 standard, which it adheres to, provides improved performance in terms of read/write speeds compared to earlier standards.
5. Applications: Commonly used in smartphones, tablets, and other portable devices where compact, efficient storage is required.
6. Reliability Features: Includes wear leveling, bad block management, and error correction to enhance the longevity and reliability of the flash memory.
This chip is a component in many consumer electronics, offering a reliable and efficient storage solution.
Pinout
The chip generally comes in a BGA (Ball Grid Array) package. For e-MMC devices like this, the pin count can vary, but it typically features a 153-ball BGA package. However, it's important to verify with the specific datasheet for the exact pin count as it can depend on the version or specific configuration.
The primary function of the THGBMJG8C4LBAU8 is to provide internal storage for devices, offering features like wear leveling, bad block management, and error correction. It integrates a NAND flash memory with a controller, simplifying the interface to the host system by providing a standardized command set for read, write, and erase operations. This makes it an efficient and cost-effective storage solution for various electronic devices.
Manufacturer
Application
1. Smartphones and Tablets: Provides storage for operating systems, applications, and user data.
2. Laptops and Ultrabooks: Used in SSDs for faster boot times and data access.
3. Embedded Systems: Supports industrial and automotive applications needing robust storage.
4. IoT Devices: Offers compact storage solutions for data logging and device management.
5. Consumer Electronics: Utilized in digital cameras, gaming consoles, and media players for storing multimedia files.
These modules are favored for their compact size, high capacity, and reliable performance.