XC7K410T-3FFG900E

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XC7K410T-3FFG900E

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IC FPGA 500 I/O 900FCBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XC7K410T-3FFG900E

  • Pacote BGA-900

  • Em Estoque1675

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Especificações

Atributo Valor
Package / Case Tray
Series Kintex®-7
Part Status Active
Number of LABs/CLBs 31775
Number of Logic Elements/Cells 406720
Total RAM Bits 29306880
Number of I/O 500
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)

Visão Geral

Description

The XC7K410T-3FFG900E is a member of Xilinx's Kintex-7 FPGA family, built on a 28nm process. It features 406,720 logic cells, 28,620 Kb of block RAM, and 1,600 DSP slices, making it suitable for high-performance computing, signal processing, and embedded systems.
The -3FFG900E suffix indicates:
- Speed grade -3 (moderate performance)
- FFG900 package (Flip-chip Fine-pitch BGA, 900 pins)
- Extended temperature range (E)
Key interfaces include GTP/GTX transceivers (up to 12.5 Gbps), PCIe Gen2/3 support, and abundant I/O options. It’s commonly used in telecommunications, aerospace, and industrial applications.
For development, Xilinx’s Vivado Design Suite is recommended. The FPGA balances performance, power efficiency, and cost, making it a versatile mid-range choice.

Equivalent

The XC7K410T-3FFG900E is a Kintex-7 FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Intel (Altera): Stratix IV EP4SGX230KF40C2 or Cyclone 10 GX 10CX085.
- Lattice Semiconductor: ECP5-85F or Certus-NX NX-17.
- Microchip (Microsemi): SmartFusion2 M2S090.
These offer similar logic capacity, performance, or features. For exact replacements, verify specs like speed grade, package, and power requirements.

Features

The Xilinx Kintex-7 XC7K410T-3FFG900E is a high-performance FPGA with:
- Logic Cells: 406,720
- DSP Slices: 1,540
- Block RAM: 28.8 Mb (1,845 Kb)
- Transceivers: 16 GTX (6.6 Gbps each)
- I/O Pins: 500+ (supports LVDS, LVCMOS, etc.)
- Package: 900-pin FCBGA (3FFG900E)
- Speed Grade: -3 (high-performance)
- Power: Optimized for low static/dynamic power
- Configuration: Supports PCIe, Ethernet, and memory interfaces.
Ideal for high-speed networking, DSP, and embedded systems.

Pinout

The XC7K410T-3FFG900E is a Kintex-7 FPGA from Xilinx (now AMD).
- Pin Count: 900 pins (FFG900 package).
- Key Functions:
- Logic Cells: 406,720
- DSP Slices: 1,540
- Block RAM: 28.1 Mb
- High-speed I/O: Supports GTP/GTX transceivers (up to 12.5 Gbps).
- Package Type: Flip-chip Fine-pitch BGA (FFG900).
- Power: Requires multiple supply voltages (VCCINT, VCCO, etc.).
Designed for high-performance applications like networking, DSP, and embedded systems.

Manufacturer

The XC7K410T-3FFG900E is a Kintex-7 series FPGA manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx (AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System-on-Chips), and adaptive computing solutions. Their products are widely used in telecommunications, automotive, aerospace, AI, and data centers.
The XC7K410T-3FFG900E is a high-performance FPGA with 410K logic cells, designed for applications requiring high-speed processing and flexibility. The -3FFG900E suffix indicates its speed grade, package (FFG900), and RoHS compliance.
Key Points:
- Manufacturer: Xilinx (AMD)
- Device Type: Kintex-7 FPGA
- Applications: High-speed data processing, networking, embedded systems
- Company Focus: Programmable logic and adaptive computing solutions

Package

The XC7K410T-3FFG900E is a Kintex-7 FPGA from Xilinx (now AMD). It comes in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package, specifically the FFG900 variant. The package is RoHS-compliant, measures 31x31mm, and has a 1mm ball pitch. It supports high-speed interfaces and is designed for performance-driven applications.

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