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XC7K70T-2FBG484I
+Lista de MateriaisIC FPGA 285 I/O 484FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7K70T-2FBG484I
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Pacote FCBGA-484
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 5125 |
| Number of Logic Elements/Cells | 65600 |
| Total RAM Bits | 4976640 |
| Number of I/O | 285 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features include:
1. Logic Cells: Approximately 70,000 logic cells that provide a flexible architecture for implementing complex digital circuits.
2. Configurable I/O: Offers a range of I/O capabilities, including high-speed serial connectivity and support for various I/O standards.
3. Embedded Resources: Includes DSP slices for high-efficiency signal processing tasks, and Block RAM for on-chip data storage.
4. Package: Available in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package.
5. Temperature Range: Operates in an industrial temperature range, designated by the 'I' in its part number.
Overall, the XC7K70T-2FBG484I is suitable for applications requiring a combination of performance, power efficiency, and flexibility.
Equivalent
Features
1. Logic Cells: Approximately 65,600 logic cells.
2. Configurable Logic Blocks (CLBs): Contains a significant number of CLBs to support various digital designs.
3. DSP Slices: Offers around 240 DSP slices for signal processing applications.
4. Memory: Embedded block RAM (BRAM) offering up to about 4,860 Kbits.
5. I/O Pins: The package supports a large number of I/O pins with customizable I/O standards.
6. Clock Management: Includes multiple clock management tiles (CMTs), each with phase-locked loops (PLLs) and mixed-mode clock managers (MMCMs).
7. Power: Designed for low power consumption, suited for energy-efficient applications.
8. Speed Grade: The "-2" indicates a specific speed grade optimized for performance.
9. Package: Available in the FBG484 package, which includes 484 pins.
10. Temperature Range: The "I" denotes an industrial temperature range, suitable for harsh environments.
These features make it suitable for applications in communications, automotive, industrial, and consumer electronics markets.
Pinout
The primary function of this FPGA is to provide high-performance computing capabilities in a wide range of applications, including communications, automotive, industrial, and consumer electronics. The XC7K70T is designed to offer a balance of high performance and low power consumption, making it suitable for applications that require efficient processing and optimized power usage.
This FPGA includes various features such as configurable logic blocks (CLBs), embedded DSP slices, block RAM, and advanced I/O capabilities, enabling it to handle complex processing tasks and high-speed data transfers. The device supports a variety of interfaces and protocols, facilitating its integration into diverse system architectures.
Manufacturer
Application
1. Digital Signal Processing (DSP): Ideal for processing high-speed data streams.
2. Communications: Suitable for wired and wireless communication systems, including base stations and radio equipment.
3. Embedded Systems: Used in advanced embedded solutions requiring customizable logic.
4. Data Center and Networking: Aids in accelerating network processing and data center operations.
5. Medical Imaging: Facilitates high-resolution image processing.
6. Aerospace and Defense: Used in applications demanding reliability and real-time processing.
These applications leverage the device's balance of performance, power efficiency, and cost-effectiveness.