XCVM1502-1MSEVFVC1760

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XCVM1502-1MSEVFVC1760

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IC VERSALPRIME ACAP FPGA 1760BGA

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  • Peça do Fabricante #XCVM1502-1MSEVFVC1760

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Especificações

Atributo Valor
Series Versal™ Prime
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ Prime FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)

Visão Geral

Description

"Introduction to XCVM1502-1MSEVFVC1760" likely refers to a specific course or module, possibly in a technical or specialized field. The alphanumeric code suggests a structured categorization, often used in educational institutions or corporate training programs to identify courses.
"XCVM" could denote a subject area or department, while "1502" might indicate a course level or sequence. The following segments, "1MSEVFVC1760," could provide further details like session, specialization, or unique identifiers distinguishing it from other courses.
Without specific context, it's challenging to provide a detailed explanation. Generally, such courses aim to introduce fundamental concepts, skills, or frameworks pertinent to the subject, potentially involving lectures, practical exercises, and assessments.
For precise information, consulting the institution's course catalog or contacting the course administrator would be advisable.

Equivalent

The XCVM1502-1MSEVFVC1760 is an FPGA from Xilinx's Versal AI Core series. Equivalent products would generally come from the same high-performance computing and AI domains, such as Intel's Agilex FPGAs or other similar high-end FPGAs from Altera, now part of Intel. Additionally, alternatives could include FPGAs from companies like Lattice Semiconductor or Microchip's Microsemi, depending on specific application requirements. Always check for specific technical specifications to ensure compatibility.

Features

The XCVM1502-1MSEVFVC1760 is likely a model number for a specific piece of technology or equipment, possibly a microcontroller, FPGA, or another integrated circuit. Although specific features for this model aren't readily available in your query, such components typically include a range of features such as:
1. Processing Power: It may have a specific number of cores, clock speed, and processing capabilities suitable for complex computations or control tasks.
2. Memory: It could include certain amounts of RAM or ROM, along with support for external memory interfaces.
3. I/O Interfaces: Various input and output options, including GPIO, SPI, I2C, UART, and possibly others for connectivity.
4. Power Management: Features for efficient power consumption, possibly with different power modes.
5. Security Features: May include encryption support or other security mechanisms.
6. Environmental Tolerances: Specifications regarding operating temperature ranges, humidity, and other conditions.
For precise details, refer to the official datasheet or technical documentation provided by the manufacturer.

Pinout

The XCVM1502-1MSEVFVC1760 is part of the Xilinx Versal ACAP (Adaptive Compute Acceleration Platform) series. This specific model is housed in a package with 1760 pins. These pins provide a range of functions typical to advanced FPGA and ACAP devices, including:
1. Power and Ground Pins: Essential for supplying power to the device and providing a ground reference.
2. I/O Pins: Used for general-purpose input/output, supporting a variety of I/O standards.
3. Auxiliary Pins: For configuration, clocking, and reset functions.
4. High-Speed Transceivers: To facilitate high-speed serial communication.
5. Memory Interface Pins: Support external memory connections such as DDR interfaces.
6. Dedicated Functionality Pins: For specialized functions like JTAG for debugging and programming.
The device integrates adaptable hardware and software programmable elements, enabling a range of computational tasks, from general processing to acceleration of specific workloads. For detailed pin functions, one would typically refer to the specific datasheet or technical documentation provided by Xilinx.

Manufacturer

The XCVM1502-1MSEVFVC1760 is manufactured by Xilinx, which is now part of Advanced Micro Devices, Inc. (AMD) following AMD's acquisition of Xilinx in 2022. Xilinx is known for designing and developing programmable logic devices and is a leading player in the field of Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and Adaptive Compute Acceleration Platform (ACAP) devices.
As an innovative technology company, Xilinx provides solutions that are widely used in various sectors, including telecommunications, automotive, aerospace, defense, data centers, and industrial applications. Their products enable companies to customize hardware for specific applications, offering high performance and flexibility, which are critical in fields requiring rapid adaptation and scalability.
Overall, Xilinx's integration into AMD enhances AMD's capabilities in offering high-performance computing solutions, combining Xilinx's FPGA technology with AMD's existing CPU and GPU offerings.

Application

The XCVM1502-1MSEVFVC1760 is typically used in high-performance computing and data processing environments. It is suitable for applications that require advanced computational capabilities, such as artificial intelligence, machine learning, data analytics, and scientific simulations. Its robust processing power makes it ideal for cloud computing platforms, data centers, and enterprise-level servers. Additionally, it can be employed in complex simulations and real-time data processing tasks, making it valuable in sectors like finance, healthcare, and research.

Package

The XCVM1502-1MSEVFVC1760 is a type of FPGA package from Xilinx, part of their Virtex UltraScale+ family. It uses advanced packaging technology, typically in a BGA (Ball Grid Array) form factor, designed for high-performance applications. The specific package type and pin count details would be specified in the manufacturer's datasheet.