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XCVM1502-1MSEVFVC1760
+Lista de MateriaisIC VERSALPRIME ACAP FPGA 1760BGA
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FabricanteAMD
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Peça do Fabricante #XCVM1502-1MSEVFVC1760
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Especificações
| Atributo | Valor |
| Series | Versal™ Prime |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
Visão Geral
Description
"XCVM" could denote a subject area or department, while "1502" might indicate a course level or sequence. The following segments, "1MSEVFVC1760," could provide further details like session, specialization, or unique identifiers distinguishing it from other courses.
Without specific context, it's challenging to provide a detailed explanation. Generally, such courses aim to introduce fundamental concepts, skills, or frameworks pertinent to the subject, potentially involving lectures, practical exercises, and assessments.
For precise information, consulting the institution's course catalog or contacting the course administrator would be advisable.
Equivalent
Features
1. Processing Power: It may have a specific number of cores, clock speed, and processing capabilities suitable for complex computations or control tasks.
2. Memory: It could include certain amounts of RAM or ROM, along with support for external memory interfaces.
3. I/O Interfaces: Various input and output options, including GPIO, SPI, I2C, UART, and possibly others for connectivity.
4. Power Management: Features for efficient power consumption, possibly with different power modes.
5. Security Features: May include encryption support or other security mechanisms.
6. Environmental Tolerances: Specifications regarding operating temperature ranges, humidity, and other conditions.
For precise details, refer to the official datasheet or technical documentation provided by the manufacturer.
Pinout
1. Power and Ground Pins: Essential for supplying power to the device and providing a ground reference.
2. I/O Pins: Used for general-purpose input/output, supporting a variety of I/O standards.
3. Auxiliary Pins: For configuration, clocking, and reset functions.
4. High-Speed Transceivers: To facilitate high-speed serial communication.
5. Memory Interface Pins: Support external memory connections such as DDR interfaces.
6. Dedicated Functionality Pins: For specialized functions like JTAG for debugging and programming.
The device integrates adaptable hardware and software programmable elements, enabling a range of computational tasks, from general processing to acceleration of specific workloads. For detailed pin functions, one would typically refer to the specific datasheet or technical documentation provided by Xilinx.
Manufacturer
As an innovative technology company, Xilinx provides solutions that are widely used in various sectors, including telecommunications, automotive, aerospace, defense, data centers, and industrial applications. Their products enable companies to customize hardware for specific applications, offering high performance and flexibility, which are critical in fields requiring rapid adaptation and scalability.
Overall, Xilinx's integration into AMD enhances AMD's capabilities in offering high-performance computing solutions, combining Xilinx's FPGA technology with AMD's existing CPU and GPU offerings.